公开(公告)号：US10913654B2

公开(公告)日：2021-02-09

申请号：US16813967

申请日：2020-03-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook ,  James F. Hallas ,  Randy Long

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US10886187B2

公开(公告)日：2021-01-05

申请号：US15792580

申请日：2017-10-24

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier

IPC: H01L23/31 ,  H01L23/29 ,  H03H9/02 ,  H01L23/495 ,  H01L23/00 ,  H01L23/34 ,  G10K11/162 ,  G10K11/168

Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.

公开(公告)号：US10861796B2

公开(公告)日：2020-12-08

申请号：US15248151

申请日：2016-08-26

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Steven Kummerl ,  Kurt Peter Wachtler

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L21/78

Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.

公开(公告)号：US10833648B2

公开(公告)日：2020-11-10

申请号：US15792591

申请日：2017-10-24

Applicant: Texas Instruments Incorporated

Inventor： Daniel Lee Revier ,  Benjamin Stassen Cook

IPC: H03H9/02 ,  H01L23/28 ,  B06B1/06 ,  H03H3/007 ,  H01L23/00 ,  H03H9/10 ,  H04R17/00 ,  G01H11/08 ,  G10K15/04 ,  H01L23/29 ,  H01L23/31 ,  G01N29/34

Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A phonon device is fabricated on the IC die that is configured to emit or to receive phonons that have a range of ultrasonic frequencies. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range that includes at least a portion of the range of ultrasonic frequencies. A phononic channel is located in the phononic bandgap structure between the phonon device and a surface of the encapsulated IC.

公开(公告)号：US20200321430A1

公开(公告)日：2020-10-08

申请号：US16905197

申请日：2020-06-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Roberto Giampiero Massolini ,  Daniel Carothers

IPC: H01L49/02 ,  H01L23/495 ,  H01L27/06 ,  H01L21/3065 ,  H01L21/768 ,  H01L23/498

Abstract: In an integrated circuit (IC), a semiconductor substrate has a first side and an opposite second side. The second side has a trench. Circuitry is on the first side. An inductive structure is within the trench. The inductive structure is connected to the circuitry through vias in the semiconductor substrate. The semiconductor substrate is mounted on a package substrate. At least a portion of the inductive structure contacts the package substrate. The circuitry is coupled to the inductive structure through wires to the package substrate.

公开(公告)号：US10788367B2

公开(公告)日：2020-09-29

申请号：US16715531

申请日：2019-12-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier

IPC: H01L21/00 ,  G01J3/02 ,  G02B6/122 ,  G01N21/3581 ,  G01J3/12

Abstract: On an integrated circuit (IC) die, sensors are configured to receive electromagnetic energy and to generate signals in response to the electromagnetic energy. An encapsulation material encapsulates the IC die and the sensors. A filter structure includes a diffusion of particles within the encapsulation material. The filter structure includes: a first region configured to pass a first band of the electromagnetic energy to the sensors or to block the first band of the electromagnetic energy from passing to the sensors; and a second region configured to pass a second band of the electromagnetic energy to the sensors or to block the second band of the electromagnetic energy from passing to the sensors. The encapsulation material has a first intrinsic property, and the particles have a second intrinsic property that is different from the first intrinsic property.

公开(公告)号：US20200303285A1

公开(公告)日：2020-09-24

申请号：US16359628

申请日：2019-03-20

Applicant: Texas Instruments Incorporated

Inventor： Nazila Dadvand ,  Sreenivasan Koduri ,  Benjamin Stassen Cook

IPC: H01L23/495 ,  H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L23/14 ,  H01L25/18 ,  H01L21/56 ,  H01L21/48 ,  H01L25/065 ,  C25D7/12 ,  C25D3/38

Abstract: A packaged semiconductor device includes a metal substrate having a first and second through-hole aperture having an outer ring, and metal pads around the apertures on dielectric pads. A first and second semiconductor die have a back side metal (BSM) layer on its bottom side are mounted top side up on a top portion of the apertures. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the apertures to provide a die attachment for the first and the second semiconductor die that fills a bottom portion of the apertures. Leads contact the metal pads, wherein the leads include a distal portion that extends beyond the metal substrate. Bondwires are between the metal pads and bond pads on the first and second semiconductor die, and a mold compound provides encapsulation for the packaged semiconductor device.

公开(公告)号：US10780467B2

公开(公告)日：2020-09-22

申请号：US15492433

申请日：2017-04-20

Applicant: Texas Instruments Incorporated

Inventor： Daniel Lee Revier ,  Benjamin Stassen Cook ,  David Patrick Magee ,  Stephen John Fedigan

IPC: B08B7/02 ,  G02B27/00

Abstract: Methods and apparatus for surface wetting control are disclosed. In certain described examples, an apparatus can expel fluid from a droplet on a surface using a transducer mechanically coupled to the surface. A first area of the surface can have a first wettability for the fluid, and a second area of the surface can have a second wettability for the fluid. The first wettability of the first area of the surface can be greater than the second wettability of the second area of the surface. The first area and the second area can be arranged in a patterned arrangement.

公开(公告)号：US20200258874A1

公开(公告)日：2020-08-13

申请号：US16859345

申请日：2020-04-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Barry Jon Male ,  Benjamin Stassen Cook ,  Robert Alan Neidorff ,  Steve Kummerl

IPC: H01L25/16 ,  H01L33/00 ,  H04B10/80 ,  H01L33/62 ,  H01L31/167 ,  H01L31/11 ,  H01L31/103 ,  H01L31/02 ,  H01L49/02 ,  H01L23/495 ,  H01L23/49 ,  H01L23/31 ,  H01F38/14 ,  H01L31/101 ,  H01L31/0203

Abstract: In described examples, an integrated circuit includes a leadframe structure, which includes electrical conductors. A first coil structure is electrically connected to a first pair of the electrical conductors of the leadframe structure. The first coil structure is partially formed on a semiconductor die structure. A second coil structure is electrically connected to a second pair of the electrical conductors of the leadframe structure. The second coil structure is partially formed on the semiconductor die structure. A molded package structure encloses portions of the leadframe structure. The molded package structure exposes portions of the first and second pairs of the electrical conductors to allow external connection to the first and second coil structures. The molded package structure includes a cavity to magnetically couple portions of the first and second coil structures.

公开(公告)号：US10727116B2

公开(公告)日：2020-07-28

申请号：US16048821

申请日：2018-07-30

Applicant: Texas Instruments Incorporated

Inventor： Paul Merle Emerson ,  Benjamin Stassen Cook

IPC: H01L21/768 ,  H01L27/02 ,  H01L21/66 ,  H01L21/78 ,  H01L23/522

Abstract: Electronic device manufacturing and configuration methods include performing an additive deposition process that deposits a conductive, resistive, magnetic, semiconductor and/or thermally conductive material over a surface of a processed wafer metallization structure to set or adjust a circuit of a capacitor, an inductor, a resistor, an antenna and/or a thermal component of the metallization structure.