摘要:
The relations in phase between first and second phase regions which are disposed on both sides of light-blocking regions interposing between them are arranged that there is a phase difference between the lights transmitted by the first and second phase regions enough to cancel with each other because of the interference, while the relations in phase between the first and second phase regions and third phase region disposed adjacent to them are arranged that between the lights transmitted by them there is a phase difference about a half of the phase difference between the lights transmitted by the first and second phase regions. Thus, the lights transmitted by the first and second phase regions and prevailing in the back sides of the light-blocking regions cancel with each other because of the interference to enchance the accuracy of the transfer at the edge portions of the light-blocking regions. Moreover, the cancellation of the lights caused by the interference at the boundaries separating the third phase region from the first and second phase regions is weakened to an extent that it exerts no effect on the transference of the pattern. As a result, the mask pattern can be transferred with high resolution without any effect of the configurations of the light-blocking regions.
摘要:
A method of fabricating a phase shifting reticle that can be used as a mask in photolithographic processes such as semiconductor wafer patterning. A transparent quartz substrate is subjected to high voltage ion bombardment to produce patterns of ion implant areas on the substrate. By carefully selecting the dopants for ion implantation and closely controlling the implantation process, areas on the substrate are produced having an absorption property for forming an opaque light blocking area or indexes of refraction different than the quartz substrate and selected to achieve a 0.degree. to 180.degree. phase shift area. This produces a repetitive pattern of alternating light transmission openings and phase shifters having opaque light blockers on either side. Additionally, tapered phase shifters may be implanted into the substrate to extend from a 180.degree. phase shift area into a light transmission opening at a 0.degree. phase shift.
摘要:
A halftone phase shift film containing Si and N and/or O is deposited on a transparent substrate by reactive sputtering of a Si-containing target with a reactive gas containing N and/or O. One layer is sputter deposited while the reactive gas flow rate is set equal to or lower than the lower limit of the reactive gas flow rate in the hysteresis region, and another layer is sputter deposited while the reactive gas flow rate is set inside the lower and upper limits of the reactive gas flow rate in the hysteresis region. The phase shift film exhibits satisfactory in-plane uniformity of optical properties.
摘要:
In an electronic design automation technique for optical proximity correction, a mask is represented by a function with an exact analytical form over a mask region. Using the physics of optical projection, a solution based on a spatial frequency analysis is determined. Spatial frequencies above a cutoff are determined by the optical system do not contribute to the projected image. Spatial frequencies below this cutoff affect the print (and the mask), while those above the cutoff only affect the mask. Frequency components in the function below this cutoff frequency may be removed, which will help to reduce computational complexity.
摘要:
A mask for photolithography and methods of manufacturing a mask and a semiconductor device are provided. The method of manufacturing a mask may comprise providing a substrate, forming a phase shift material layer on the substrate, forming a light blocking layer on the phase shift material layer, and forming a main pattern and a sub pattern on the substrate by patterning the phase shift material layer and the light blocking layer. The light blocking layer may be removed on the main pattern left on the light blocking layer remaining on the sub pattern. A semiconductor device may be manufactured using the mask to form a photoresist pattern on a semiconductor wafer. The pattern of the photoresist may be used to etch an object layer of the semiconductor wafer.
摘要:
The present invention provides a halftone mask comprising an assist pattern and a manufacturing method of the halftone mask, which uses an ArF excimer laser as an exposing source, is used for a projection exposure by an off axis illumination, does not resolve the assist pattern while keeping the focal depth magnification effect as the assist pattern, and may form a transferred image having high contrast of a main pattern. A photomask is a photomask comprising the main pattern which is transferred to a transfer-target surface by the projection exposure and the assist pattern which is formed nearby the main pattern and not transferred, characterized in that the main pattern and the assist pattern are each constituted from a semi-transparent film made of the same material, a retardation of 180° is generated between the light transmitting through the main pattern and the light transmitting through a transparent region of a transparent substrate, and a predetermined retardation within the scope of 70° to 115° is generated between the light transmitting through the assist pattern and the light transmitting through the transparent region of the transparent substrate.
摘要:
A mask is disclosed which includes a plurality of first phase shift regions disposed on a first side of the mask, and a plurality of second phase shift regions disposed on a second side of the mask. The first phase shift regions and second phase shift regions may be alternating phase shift regions in which phase shift of the first phase shift regions is out of phase, for instance by 180 degrees, from phase shift of the second phase shift regions. A method for forming the mask, and a semiconductor device fabrication method using the mask is also disclosed.
摘要:
A technique of forming an asymmetric pattern by using a phase shift mask, and further, techniques of manufacturing a diffraction grating and a semiconductor device, capable of improving accuracy of a product and capable of shortening manufacturing time. In a method of manufacturing a diffraction grating by using a phase shift mask (in which a light shield part and a light transmission part are periodically arranged), light emitted from an illumination light source is transmitted through the phase shift mask, and a photoresist on a surface of a Si wafer is exposed by providing interference between zero diffraction order light and positive first diffraction order light which are generated by the transmission through this phase shift mask onto the surface of the Si wafer, and a diffraction grating which has a blazed cross-sectional shape is formed on the Si wafer.
摘要:
Techniques are disclosed for enhancing critical dimension (CD) resolution in photomask processing. In some cases, the techniques can be implemented, for instance, to enhance space and line pattern resolution independently on a given phase-shifting photomask (PSM). The disclosed techniques can be implemented, for example, to extend existing photolithography techniques/technologies (e.g., 193 nm photolithography) to additional process nodes. For instance, some embodiments can be used to produce extremely high-resolution photomasks which generate features having sizes in the 10 nm node and beyond. The disclosed techniques can be implemented in the fabrication of a wide range of integrated circuits (ICs) and other devices.
摘要:
A method for printing a periodic pattern having a first symmetry and a first period into a photosensitive layer. The method includes providing a mask bearing a pattern of at least two overlapping sub-patterns which have a second symmetry and a second period, the features of each sub-pattern being formed in a transmissive material, providing a substrate bearing the layer, arranging the mask with a separation from the substrate, providing light having a central wavelength for illuminating the mask to generate a light-field in which light of the central wavelength forms a range of intensity distributions between Talbot planes, illuminating said mask pattern with said light while maintaining the separation or changing it by a distance whereby the photosensitive layer is exposed to an average of the range of intensity distributions, wherein the light transmitted by each sub-pattern is shifted in phase relative to that transmitted by another sub-pattern.