摘要:
A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region of the printed circuit board includes at least two plated-through holes plated by a solderable material such as copper which also interconnects the holes, and a pin of weldable but solder-rejecting material such as stainless steel which lies in one of the holes and is in press fit contact with the walls of the hole. Component leads can be soldered into the pinless holes as by wave soldering techniques, without coating the pins with solder, and wires can be welded to the pins by stitch wire techniques. The pins permit wire welds to be made thereto without requiring large weld currents to pass through the thin plating layer of the board, and also facilitate repair of a damaged weld by replacement of the pin.
摘要:
A laminated bus bar with rigid discrete dielectric elements sandwiched between flat conductors is assembled with comparative ease by coating the opposed faces of the elements with a low melt point conductive material except in bands adjacent to the edges of the elements. When the conductive material is reflowed to bond the elements to the conductors, there will be no development of short circuits across the edges of the elements.
摘要:
Several tubular wire-retaining anchor embodiments (10, 10') are disclosed, as are several methods of manufacturing and securing the same to a supporting substrate, such as a circuit board (24). In accordance with one preferred embodiment (10), the tubular anchor is either molded out of suitable plastic material, or preferably formed as a short, severed cylindrical segment of an elongated section of plastic tubing (12). As needed, the anchors (10) are positioned in a desired spaced array on the circuit board (24) and adhesively bonded thereto. This is most readily accomplished by positioning each anchor (10) on a different droplet (28b), preferably comprising the second part of a two-part adhesive or cement (28), with the first part activator (28b) being pre-coated on at least a portion of the outer surface of the anchor. Upon each anchor (10) being brought into contact with an adhesive droplet (28b), the latter rapidly hardens to form a reliable fillet-shaped bond (28c) on either side of the juncture between the anchor and circuit board. In accordance with the second preferred anchor embodiment (10'), a longitudinally disposed slit (36) is formed through the wall thereof so as to allow the snap-in confinement of surface wiring therewithin, as well as the releasable removal of such wiring therefrom.
摘要:
An electric woven switching matrix comprises an insulating field fabric made by interweaving insulating fibers, conducting wires interwoven into the insulating field fabric, and sections for installation of circuit elements over the matrix area. The conducting wires, passing through these sections and intended for forming, by cutting, matrix contact terminals to be electrically connected with the lead-outs of the circuit elements installed on the matrix, extend out from the insulating field fabric, extend over the surface of a respective section and extend back into the insulating field fabric. Exit points from the insulating field fabric and entrance points into the insulating field fabric for odd sets of conducting wires are staggered with respect to exit points from the insulating field fabric and entrance points into the insulating field fabric for even sets of conducting wires.
摘要:
This invention generally relates to prefabricated electric wire assemblies comprising an interconnected network of separately formed, integral, shaped conductors, and to materials and techniques used in the manufacture of such assemblies.
摘要:
Different conductive zones on an insulating base support are interconnected by bonding an insulated wire to the support. In order to establish electric contacts between conductive zones and the conductive core of the insulated wire, the wire is stripped, soldered onto the conductive zones and cut after soldering.
摘要:
An interconnection system suitable for transmission lines, in the form of electrical or optical conductors, or in the form of conduits for electrical waveguide transmission, reflected light or fluidic signals, wherein lengths of such transmission lines bridge between discrete point-to-point location on a substrate, the transmission lines beng anchored by sealant and filler material at selected substrate locations and being cut generally transversely, or otherwise transversely formed, to provide exposed conductor or conduit end portions anchored at the selected locations. The transverse areas of the conductors or conduits defined by such transversely cut, or otherwise transversely formed, and exposed end portions provide energizable signal energy planes. More specifically, such discrete energizable planes in the form of transverse conductor surfaces, are of a size and shape conforming to the transverse conductor areas exposed by cutting or other forming operation. Such conductors may be either insulated electrical or optical conductors provided thereover with metal or a metallized coating to result in an electrical shielded, or an optically shielded and reflecting, interconnection system. The transmission lines in the form of conduits provide discrete, end-anchored conduits for conveying signal energy excitations in the form of fluidic pressure, reflected optical energy or electrical waveguide transmissions. The ends of the conduits are anchored in the substrate and define generally transverse end openings of the conduits. The transverse areas of such openings provide energizable signal energy planes through which the conveyed signal excitations are transmitted. The size and shape of the energizable signal energy planes conform to the conduit transverse end areas exposed by cutting.
摘要:
A wire routing system for use with reflow wiring machines is disclosed in which the system includes a single-sided printed circuit board having a plurality of wire land pads and integrated circuit pads located thereon. Wire routing fixtures are also adapted to be positioned on the circuit board with each fixture including an elongated base plate having a plurality of upwardly extending posts longitudinally spaced thereon. Each of the posts includes a hook portion for receiving portions of insulated wire used for interconnecting the wire land pads. The wire routing is done with a conventional reflow wiring machine having a capillary which is adapted to lead the insulated wire from soldered joints on the land pads around adjacent hook portions in a simple and repeatable route. The integrated circuit pads, each of which is electrically connected to a corresponding wire land pad, are adapted to receive and be reflow soldered to the legs of dual inline packages which extend over the wire routing fixtures without any interference therebetween. As a result, a known and repeatable wire route is provided to facilitate the programming and inspection of the finished circuit on the circuit board.
摘要:
A compact, multi-branch, plug-in interconnection module of either two-dimensional or three-dimensional form providing a desired interconnection pattern and having a total effective length related to the sum of the lengths of the individual branches. The interconnection module is fabricated by initially supporting the module terminals in a threading fixture disposed below a threading head which supplies a continuous insulated wire. The fixture is driven in x-y directions by a numerical control positioning apparatus so as to cause the wire from the threading head to thread selected terminals along predetermined paths in a predetermined sequence. After threading, the wires are electrically affixed to the respective terminals to which they were threaded. The resulting structure is then removed from the threading fixture and subjected to a cutting operation which provides for the cutting of wires in all paths except predetermined assigned ''''threading paths''''. The program of the numerical control apparatus is chosen in conjunction with the assignment of the ''''threading paths'''' so that the cutting operation results in eliminating all terminal interconnections except those desired in the completed interconnection module. After the cutting operation, the structure is bent into a desired two or three-dimensional shape and then encapsulated leaving its plug-in terminals exposed.
摘要:
A multilayer, multiconductor or single conductor insulated bus assembly with jacket envelope that will not delaminate or lose capacitance when subjected to high temperatures such as encountered in wave soldering on printed circuit boards or conventional temperature/time soldering cycles. The jacket envelope is formed from an irradiated expanded tube that fits over the conductor bus subassembly and upon application of heat shrinks to a predetermined lesser diameter forming an outer layer about the body of the bus bar subassembly with all connecting terminals extending through openings punched in the jacket.