公开(公告)号：US4671593A

公开(公告)日：1987-06-09

申请号：US756296

申请日：1985-07-18

申请人： Bruno Millon-Fremillon ,  Gerard Nicolas

发明人： Bruno Millon-Fremillon ,  Gerard Nicolas

IPC分类号： H01R4/48 ,  H01R12/71 ,  H01R9/09

CPC分类号： H01R12/714

摘要： A microconnector is used for connecting electrodes placed on a support and which are insulated from one another to the same number of conductors as there are electrodes and comprises a means for the elastic gripping of the support and flexible, elastic conductor wires, whose number is the same as that of the electrodes for connecting to the latter, which are insulated from one another and from the gripping means and which are fixed to the latter in such a way that each of them can come into contact with a single electrode when the support is gripped by the gripping means. Application is to low temperature electrical connections and to high density connections in a reduced space.

摘要翻译： 微连接器用于连接放置在支架上的电极，它们彼此绝缘至与电极相同数量的导体，并且包括用于弹性夹持支撑件和柔性弹性导线的装置，其数量为 与用于连接到后者的电极相同，它们彼此绝缘并且与夹持装置绝缘，并且固定到后者，使得当支撑件是支撑件时，它们中的每一个可以与单个电极接触 由夹持装置抓住。 适用于减少空间中的低温电气连接和高密度连接。

公开(公告)号：US5636683A

公开(公告)日：1997-06-10

申请号：US387605

申请日：1995-02-13

申请人： Claude Massit ,  Gerard Nicolas ,  Guy Parat

发明人： Claude Massit ,  Gerard Nicolas ,  Guy Parat

IPC分类号： G02F1/13 ,  B23K1/005 ,  H01L21/60 ,  F25B29/00

CPC分类号： H01L24/81 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19043

摘要： A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.

摘要翻译： 提供了一种加热装置，用于通过熔化材料连接到连接支撑件上的至少一个部件，所述至少一个部件安装在支撑件上的至少一个连接区域的支撑件的外围。 该装置局部加热连接区域中的支撑件和/或部件。 本发明的特别实用性在平面显示屏的生产领域中发现，但是也可以考虑其它实用程序。

公开(公告)号：US4684181A

公开(公告)日：1987-08-04

申请号：US800362

申请日：1985-11-21

申请人： Claude Massit ,  Gerard Nicolas ,  Gerard Turc

发明人： Claude Massit ,  Gerard Nicolas ,  Gerard Turc

IPC分类号： G04G17/00 ,  H01R12/88 ,  H01R13/22 ,  H01R33/76 ,  H01R9/09 ,  H01R13/629

CPC分类号： G04G17/00 ,  H01R12/88

摘要： A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.

摘要翻译： 具有高密度接触的微型连接器，可以将N个平行电极连接到N个电导体。 微连接器包括能够接收分别连接到N个导体并固定到可相对于所述支撑件移动的绝缘部分的电极，N导电，柔性，弹性线的支撑件，使得导线平行并且每个 当电极安装在支撑体中时，由于绝缘部分的位移，可以与单个电极接触。 提供凸轮以使部件移动以使各个电极和电线之间同时接触。 微型连接器可用于平板显示装置。

公开(公告)号：US4031612A

公开(公告)日：1977-06-28

申请号：US663250

申请日：1976-03-02

申请人： Gerard Nicolas

发明人： Gerard Nicolas

IPC分类号： H05K3/22 ,  H05K7/06 ,  H05K13/06 ,  H05K3/00

CPC分类号： H05K13/06 ,  H05K3/222 ,  H05K7/06 ,  Y10T29/49162 ,  Y10T29/514

摘要： Different conductive zones on an insulating base support are interconnected by bonding an insulated wire to the support. In order to establish electric contacts between conductive zones and the conductive core of the insulated wire, the wire is stripped, soldered onto the conductive zones and cut after soldering.

摘要翻译： 绝缘基座支架上的不同导电区域通过将绝缘电线连接到支架而相互连接。 为了在导电区域和绝缘电线的导电芯之间建立电接触，将电线剥离，焊接到导电区上并在焊接之后切割。

公开(公告)号：US6159323A

公开(公告)日：2000-12-12

申请号：US200388

申请日：1998-11-24

申请人： Jean-Pierre Joly ,  Gerard Nicolas ,  Michel Bruel

发明人： Jean-Pierre Joly ,  Gerard Nicolas ,  Michel Bruel

IPC分类号： H05K3/32 ,  G02F1/1362 ,  H05K3/00 ,  H05K3/20 ,  B32B31/00

CPC分类号： G02F1/13454 ,  H01L2221/68363 ,  H05K3/0058 ,  H05K3/0097

摘要： Process for transfer of a microstructure (12) from an initial substrate (10) to a final substrate (32). The process includes the following steps in sequence:bonding between the initial substrate (10) and an intermediate substrate (24), the microstructure facing the intermediate substrate,formation of at least one layer (30) of bond material on at least one selected region (16) of the initial substrate including the microstructurebring the said selected region (16) into contact with the final substrate,treatment of the bond material in an area corresponding to the selected region (16), to increase the bond force,breaking the selected region (16) of the initial substrate, from the intermediate substrate (24).

摘要翻译： 用于将微结构（12）从初始衬底（10）转移到最终衬底（32）的工艺。 该方法依次包括以下步骤：在初始基底（10）和中间基底（24）之间的结合，微结构面向中间基底，在至少一个选定区域上形成至少一层（30）的粘合材料 包括微结构的初始衬底的基底（16）使所述选定区域（16）与最终衬底接触，在对应于所选择的区域（16）的区域中处理粘合材料，以增加接合力，从而破坏 初始衬底的选定区域（16）从中间衬底（24）。

公开(公告)号：US5776791A

公开(公告)日：1998-07-07

申请号：US747932

申请日：1996-11-12

申请人： Patrice Caillat ,  Gerard Nicolas ,  Robert Teoule

发明人： Patrice Caillat ,  Gerard Nicolas ,  Robert Teoule

IPC分类号： H01L21/306 ,  B01J19/00 ,  C40B40/06 ,  C40B40/10 ,  G01N27/403 ,  G01N33/00 ,  H01L23/52 ,  H01L21/66

CPC分类号： G01N33/0031 ,  B01J19/0046 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00637 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00713 ,  B01J2219/0072 ,  B01J2219/00722 ,  B01J2219/00725 ,  C40B40/06 ,  C40B40/10

摘要： This process comprises the following steps: a) make a set of chips (110, 111, 112, 113) on a substrate (100), each chip including a number of electrodes (110a, 110b, 111a, 111b), b) individual validity test on each chip and the formation of at least one electrical network (117a, 117b) for addressable matched electrodes on different valid chips, c) make a deposit successively on matched electrode sets by dipping the substrate in an appropriate electrochemical bath and by application of appropriate voltages on the electrical network to cause an electrochemical reaction on the electrodes.

摘要翻译： 该过程包括以下步骤：a）在衬底（100）上形成一组芯片（110,111,112,113），每个芯片包括多个电极（110a，110b，111a，111b），b）个体 对每个芯片进行有效性测试，并在不同的有效芯片上形成用于可寻址匹配电极的至少一个电网（117a，117b），c）通过将基板浸入适当的电化学浴中并通过应用 在电网上施加适当的电压以在电极上引起电化学反应。

公开(公告)号：US5373189A

公开(公告)日：1994-12-13

申请号：US99663

申请日：1993-07-30

申请人： Claude Massit ,  Gerard Nicolas

发明人： Claude Massit ,  Gerard Nicolas

IPC分类号： H01L25/065 ,  H01L25/10 ,  H01L23/02 ,  H05K7/00

CPC分类号： H01L25/105 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1088 ,  H01L2924/01014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/16153 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/19107

摘要： Three-dimensional multichip module.The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.Application to the association of integrated circuits in microconnection technology.

摘要翻译： 三维多芯片模块。 本发明涉及一种具有多个二维基本电子模块（4a-4d）的三维或三维多芯片模块，每个都包含至少一个芯片（10a-10d），其上放置有支撑件（6a-6d） 所述芯片和覆盖所述支撑件的上表面的导电互连网络或阵列（8a-8d）。 这些基本模块基本上以移位的方式（以阶梯的形式）叠加，并且通过其互连网络和放置在未被上部基本模块覆盖的基本模块的那些部分上的连接焊盘（12a-12d）相互连接 。 应用于微型连接技术中集成电路的关联。

公开(公告)号：US5450206A

公开(公告)日：1995-09-12

申请号：US242607

申请日：1994-05-13

申请人： Patrice Caillat ,  Guy Parat ,  Gerard Nicolas

发明人： Patrice Caillat ,  Guy Parat ,  Gerard Nicolas

IPC分类号： H01L21/60 ,  G01B11/14 ,  H01L21/66 ,  H05K13/08 ,  G01B11/00

CPC分类号： G01B11/14 ,  H01L22/12

摘要： A process for checking the conformity of hybridization balls present on a chip or a substrate and its implementation device are provided. The process includes positioning the hybridization balls of the electronic component or substrate near a strip transparent to a predetermined wavelength. The hybridization balls are partially flattened against the strip by positioning the electronic component or substrate at a previously defined distance from the transparent strip. The previously defined distance corresponds to a theoretical reference ball height less an acceptable deviation between the theoretical reference ball height and a minimum height of the hybridization balls. The partial flattening creates ball flats on the hybridization balls at the strip. The hybridization balls are illuminated with a light beam of the predetermined wavelength that is emitted through the strip. A portion of the light beam reflected back through the strip by the hybridization balls to be checked and is acquired. Finally, conformity or nonconformity of the hybridization balls to be checked is determined as a function of the portion of said light beam reflected back by each of the hybridization balls.

摘要翻译： 提供了一种用于检查存在于芯片或基板上的杂交球的一致性的方法及其实现装置。 该方法包括将电子部件或基板的杂交球定位在预定波长透明的条带附近。 通过将电子部件或基板定位在与透明条带预先限定的距离处，将杂交球部分地压平在条带上。 先前定义的距离对应于理论参考球高度减去理论参考球高度和杂交球的最小高度之间的可接受的偏差。 部分平坦化在条带上的杂交球上产生球平面。 用通过条带发射的预定波长的光束照射杂交球。 光束的一部分通过条带反射回通过待检查的杂交球并被获取。 最后，将要检查的杂交球的一致性或不合格确定为由每个杂交球反射的所述光束的部分的函数。

公开(公告)号：US4337573A

公开(公告)日：1982-07-06

申请号：US154144

申请日：1980-05-29

申请人： Gerard Nicolas ,  Gerard Ponthenier ,  Gerard Turc

发明人： Gerard Nicolas ,  Gerard Ponthenier ,  Gerard Turc

IPC分类号： H05K3/10 ,  H05K3/22 ,  H05K13/06 ,  H05K3/20 ,  B23P19/00

CPC分类号： H05K13/06 ,  H05K3/222 ,  Y10T29/49128 ,  Y10T29/53213

摘要： Method and apparatus for producing an electrical interconnection circuit for electronic components in which an insulating base support incorporating conductive zones is used, the different conductive zones to be interconnected are joined by an insulating wire by adhering it to the base support, the bared wire is welded to the conductive zones and is cut after welding, wherein a thermally weldable insulating wire is used and liquid flux is deposited on the parts of the wire to be welded resting on the conductive zones before making the weld.

摘要翻译： 制造用于电子部件的电气互连电路的方法和装置，其中使用包含导电区域的绝缘基底支架，通过绝缘线将不相互连接的不同导电区域粘合到基座上，将裸线焊接 并且在焊接之后切割，其中使用可焊接的绝缘线，并且在进行焊接之前，将待焊接的焊丝的部分放置在导电区上的液体焊剂沉积。

公开(公告)号：US3981076A

公开(公告)日：1976-09-21

申请号：US527828

申请日：1974-11-27

申请人： Gerard Nicolas

发明人： Gerard Nicolas

IPC分类号： H01L21/00 ,  H01L21/60 ,  H05K3/10 ,  H05K7/06 ,  H05K3/30

CPC分类号： H01L24/85 ,  H01L21/67138 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H05K3/103 ,  H05K7/06 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48463 ,  H01L2224/4899 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85007 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/20753 ,  H05K2201/10287 ,  H05K2201/10424 ,  Y10T29/49137 ,  Y10T29/49162

摘要： A method of connecting electronic microcomponents comprising the steps of realizing a support with conducting wire connecting pads secured on said support, the position of which is adapted to the arrangement of the connections for the microcomponents, making a connecting circuit by sticking an insulated wire onto said support and connecting said conducting wire connecting pads, positioning the microcomponent panels so that each microcomponent connection is in electrical contact with one of said wire connecting pads, welding the connections to their respective wire connecting pads.A substrate for connecting microcomponents comprising a support on which conducting wire connecting pads are deposited and joined by a connecting circuit made of insulated wire.A hybrid circuit comprising a number of electronic microcomponents connected by said substrate.

摘要翻译： 一种连接电子微型部件的方法，包括以下步骤：通过固定在所述支撑件上的导线连接垫实现支撑，其位置适合于用于微型部件的连接的布置，通过将绝缘电线粘附到所述支架上而形成连接电路 支撑和连接所述导线连接垫，定位微组件面板，使得每个微组件连接与所述导线连接垫中的一个电接触，将连接焊接到它们各自的导线连接垫。