公开(公告)号：US10299393B2

公开(公告)日：2019-05-21

申请号：US16163129

申请日：2018-10-17

申请人： Apple Inc.

发明人： Bartley K. Andre ,  Matthew Dean Rohrbach ,  Peter N. Russell-Clarke

IPC分类号： H05K5/02 ,  B23P13/00 ,  B23K26/38 ,  B29C67/00 ,  B44C1/22 ,  B23K26/362 ,  B23K26/402 ,  B23K26/382 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12 ,  H05K5/03 ,  B23K26/361 ,  B23K103/00

摘要： The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

公开(公告)号：US20190126406A1

公开(公告)日：2019-05-02

申请号：US16166170

申请日：2018-10-22

申请人： Samsung Display Co., Ltd.

发明人： Taras Litoshenko ,  Voronov Alexander ,  Gyoowan Han

IPC分类号： B23K26/382 ,  B23K26/082 ,  B23K26/067 ,  B23K26/06 ,  B23K26/0622 ,  C23C14/04 ,  C23C16/04

摘要： A method of manufacturing a deposition mask including: arranging a deposition mask to be processed on a stage and forming a deposition hole in the deposition mask by irradiating the deposition mask with a laser beam. The laser beam forming the deposition hole is irradiated plural times in an identical moving path in a region where the deposition hole is formed, the laser beam includes a pulse laser, and pulse energy of the laser beam when the laser beam is irradiated once is different from pulse energy of the laser beam when the laser beam is irradiated twice.

公开(公告)号：US20190118281A1

公开(公告)日：2019-04-25

申请号：US16227658

申请日：2018-12-20

申请人： AGC, Inc.

发明人： Motoshi ONO

IPC分类号： B23K9/013 ,  B23K26/382 ,  B26F1/28 ,  B23K26/384

摘要： Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ  (1), and 0.16≤sin θ≤0.22  (2).

公开(公告)号：US10252375B2

公开(公告)日：2019-04-09

申请号：US14698351

申请日：2015-04-28

申请人： FANUC CORPORATION

发明人： Atsushi Mori

IPC分类号： G05B19/4067 ,  B23K26/14 ,  B23K26/04 ,  B23K26/38 ,  B23K26/382 ,  B23K26/70

摘要： A laser processing system including a laser processing unit, a controller controlling the processing unit according to a laser processing program, and a restart preparation apparatus performing a preparation process of the controller to resume the program execution after being suspended. The restart preparation apparatus includes an operating state judging section judging whether an operating state of the processing unit when suspending the program execution is in course of laser processing, and a restart condition specifying section specifying a restart condition of the processing unit when resuming the program execution, from among predetermined conditions, based on a judgment result. The operating state judging section judges that the operating state is in course of laser processing, if a predetermined operation command for processing the workpiece is output from the controller, or predetermined external information for processing the workpiece is input to the controller, at the instant of suspending the program execution.

公开(公告)号：US10220469B2

公开(公告)日：2019-03-05

申请号：US14914795

申请日：2014-05-23

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Tsugumaru Yamashita ,  Yoshihito Fujita ,  Kiyotaka Nakagawa ,  Shinnosuke Osafune ,  Haruhiko Niitani ,  Yoshikatsu Sato

IPC分类号： B23K26/00 ,  B23P23/04 ,  F02M61/16 ,  B23K37/02 ,  B23K26/06 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/382

摘要： Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.

公开(公告)号：US10201867B2

公开(公告)日：2019-02-12

申请号：US14965111

申请日：2015-12-10

申请人： AGC Inc.

发明人： Motoshi Ono

IPC分类号： C03B33/10 ,  C03C23/00 ,  B23K9/013 ,  B23K26/382 ,  B26F1/28 ,  B23K26/384 ,  B23K103/00

摘要： Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle θ that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan θ  (1), and 0.16≤sin θ≤0.22  (2).

公开(公告)号：US10189115B2

公开(公告)日：2019-01-29

申请号：US15104627

申请日：2014-07-30

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD.

发明人： Kiyotaka Nakagawa ,  Yoshihito Fujita ,  Tsugumaru Yamashita

IPC分类号： B23K26/06 ,  B23K26/00 ,  B23K26/38 ,  B23K26/08 ,  B23K37/02 ,  B23K26/382

摘要： Provided is a laser processing apparatus provided with: a first optical system including a first prism and a second prism; a second optical system including a third prism and a fourth prism; a condensing optical system that condenses laser light to guide the condensed laser light to a workpiece; a first driving device that rotates the first prism and rotates the second prism synchronously with the first prism; a second driving device that rotates the third prism and rotates the fourth prism synchronously with the third prism; and a controller that controls the first driving device and the second driving device such that the workpiece is irradiated with the laser light while the laser light turns. The controller adjusts irradiation conditions of the laser light including an incidence position and an incidence angle of the laser light with respect to the workpiece, by adjusting a relative position between the first prism and the second prism and a relative position between the third prism and the fourth prism in a rotational direction.

公开(公告)号：US20190001442A1

公开(公告)日：2019-01-03

申请号：US15750140

申请日：2016-09-08

申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC.

发明人： Mark Unrath ,  Chuan Yang ,  Jan Kleinert ,  Mark Peeples ,  Hugh Owens ,  Gwendolyn Byrne ,  Haibin Zhang ,  Justin Redd ,  Corie Neufeld ,  James D. Brookhyser ,  Yasu Osako ,  Mehmet Alpay ,  Zhibin Lin ,  Patrick Riechel ,  Tim Nuckolls ,  Hisashi Matsumoto ,  Chris Ryder

IPC分类号： B23K26/382 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

摘要： Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

公开(公告)号：US20180360175A1

公开(公告)日：2018-12-20

申请号：US16048119

申请日：2018-07-27

申请人： ROFIN SINAR TECHNOLOGIES INC.

发明人： S. ABBAS HOSSEINI

IPC分类号： A44C17/00 ,  B28D5/00 ,  B23K26/40 ,  B23K26/03 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/382 ,  B23K103/00

摘要： A non-ablative laser machining method and apparatus for cutting facets of a diamond, using a material machining technique involving filamentation by burst ultrafast laser pulses well suited to mass production. Coupled with 3D modeling and the computerized laser machining system, complex geometric surfaces can be created on the diamond. The facets of the diamond need not be planar in configuration, and may incorporate acute as well as oblique angles. This method minimizes the need for diamond polishing, speeds up production, and realizes great reductions in the quantity of lost material from the cutting process.

公开(公告)号：US10155287B2

公开(公告)日：2018-12-18

申请号：US14966250

申请日：2015-12-11

申请人： TRUMPF Werkzeugmaschinen GmbH + Co. KG

发明人： Martin Spiess ,  Patrick Mach

IPC分类号： B23K26/38 ,  B23K26/382 ,  B23K26/04 ,  B23K26/142 ,  B23K26/14 ,  B23K26/12

摘要： Methods and systems are implemented for forming a through hole in a workpiece using a laser beam and a process gas, such as oxygen or nitrogen, coming from a gas nozzle. A hole is formed in the workpiece using the laser beam and a process gas emerging from a gas nozzle, such that the formed hole extends only partially through the workpiece. A bulge deposited while forming the hole partially through the workpiece is removed from the workpiece surface by directing a flow of gas through the nozzle toward the workpiece surface as the nozzle is moved with the laser beam switched off, the flow of gas being delivered to the nozzle at a higher pressure than the process gas is delivered to the nozzle during forming the hole partially through the workpiece. Then, the hole is fully pierced through the workpiece by the laser beam using the process gas.