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公开(公告)号：US20210329810A1
公开(公告)日：2021-10-21
申请号：US17083152
申请日：2020-10-28
发明人： Joel Richard Goergen
IPC分类号： H05K7/20 , H01L23/427 , G02B6/12
摘要： In one or more embodiments, an apparatus includes a substrate and die package, a thermal transfer plate positioned adjacent to the substrate and die package for cooling the substrate and die package, wherein at least one electrical path extends through the thermal transfer plate for transmitting power from a power module to the substrate and die package, and a microelectromechanical system (MEMS) module comprising a plurality of air movement cells for dissipating heat from the thermal transfer plate.
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公开(公告)号：US20210327785A1
公开(公告)日：2021-10-21
申请号：US16849968
申请日：2020-04-15
申请人： Sheng-Huang Lin
发明人： Sheng-Huang Lin
IPC分类号： H01L23/427 , F28D15/04
摘要： A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.
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公开(公告)号：US11149937B2
公开(公告)日：2021-10-19
申请号：US16777403
申请日：2020-01-30
发明人： Yuqing Zhou , Ercan Mehmet Dede
IPC分类号： F21V29/75 , H01L23/467 , H01L23/473 , H01L23/427
摘要： Embodiments disclosed herein describe a manifold microchannel heat sink having a target surface, a microchannel structure and an insert disposed over the microchannel structure. The microchannel structure includes a plurality of fins extending in a normal direction from the target surface and defining a plurality of microchannels. The individual fins are shaped as rectangular plates and the individual microchannels comprise gaps between the individual fins. The plurality of fins are distributed on the target surface such that at least a thickness of the individual fins or a width of the gaps comprising the individual microchannels is varied along a plane of the target surface. The insert disposed over the microchannel structure has a plurality of inlet dividers and a plurality of outlet dividers. The individual inlet dividers define an inlet channel and the individual outlet dividers define an outlet channel.
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公开(公告)号：US20210313248A1
公开(公告)日：2021-10-07
申请号：US17353115
申请日：2021-06-21
发明人： MANISH ARORA , NUWAN JAYASENA
IPC分类号： H01L23/427 , H05K1/02
摘要： Various circuit board embodiments are disclosed. In one aspect, an apparatus is provided that includes a circuit board and a first phase change material pocket positioned on or in the circuit board and contacting a surface of the circuit board.
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公开(公告)号：US20210313247A1
公开(公告)日：2021-10-07
申请号：US17267539
申请日：2019-08-23
发明人： Damena AGONAFER , Binjian MA , Li SHAN , Patricia WEISENSEE , John Mark MEACHAM
IPC分类号： H01L23/427
摘要： A heat exchanger for thermal management of an electronic device includes a liquid delivery layer thermally coupled to the electronic device and configured to receive a liquid from a source. The heat exchanger also includes an evaporation layer comprising hollow pillars configured to receive a continuous flow of the liquid from the liquid delivery layer and evaporate the continuous flow of the liquid from droplets maintained on the hollow pillars. Each hollow pillar has an evaporation surface and a pore configured to channel the continuous flow of the liquid through the hollow pillar to the evaporation surface. The evaporation surface being configured to maintain a droplet on the respective hollow pillar within a contact line. The evaporation surface has a wetting efficiency of at least about 95% and the contact line has a length of less than about 0.0314 mm.
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公开(公告)号：US11121059B2
公开(公告)日：2021-09-14
申请号：US16604024
申请日：2018-05-01
发明人： Roberto Mrad , Stefan Mollov
IPC分类号： H01L23/427 , H01L23/473 , H05K1/02 , H05K1/18 , H05K7/20
摘要： The present invention concerns a power module composed of a first and second parts (100a, 100b), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes (300a, 300b) when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating (400a, 400g) of the walls of the pipes.
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公开(公告)号：US20210280495A1
公开(公告)日：2021-09-09
申请号：US16328614
申请日：2016-09-29
申请人： Intel Corporation
IPC分类号： H01L23/40 , H01L23/427 , H01L21/48
摘要： Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.
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公开(公告)号：US11098959B2
公开(公告)日：2021-08-24
申请号：US17094293
申请日：2020-11-10
发明人： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
摘要： An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US11092391B2
公开(公告)日：2021-08-17
申请号：US15305020
申请日：2015-05-18
申请人： Satish G. Kandlikar , Chinmay Patil
发明人： Satish G. Kandlikar , Chinmay Patil
IPC分类号： F28F13/18 , H01L23/427 , H01L23/44
摘要： A heat transfer system includes a substrate having a heat exchange region including a surface having an enhancement region including alternating regions of selectively placed plurality of nucleation sites and regions lacking selectively placed nucleation sites, such that bubble formation and departure during boiling of a liquid in contact with the enhancement region induces liquid motion over the surface of the regions lacking selectively placed nucleation sites sufficient to enhance both critical heat flux and heat transfer coefficient at the critical heat flux in the enhancement region of the system.
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公开(公告)号：US20210249333A1
公开(公告)日：2021-08-12
申请号：US16787241
申请日：2020-02-11
IPC分类号： H01L23/40 , H01L23/427 , F28F13/00
摘要： An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.
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