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136 条记录 (耗时 0.029 秒)

    NON-CONTACT SELECTION DEVICE
    71.
    发明申请
    NON-CONTACT SELECTION DEVICE 有权
    非接触式选择装置

    公开(公告)号：US20120320247A1

    公开(公告)日：2012-12-20

    申请号：US13529623

    申请日：2012-06-21

    申请人： Dong-Jin KIM ,  Zeeno Joe

    发明人： Dong-Jin KIM ,  Zeeno Joe

    IPC分类号： H04N5/222

    CPC分类号： G06F3/0304 ,  H04N5/23203

    摘要： A non-contract selecting device is disclosed. The non-contract selecting device include a light source, emitting light to an outside; a camera unit, generating and outputting a video signal corresponding to an external video; a video data generating unit, generating video data corresponding to the video signal; and an identity unit, detecting a location of a detected area formed by light, reflected by pointing-means and inputted, of the light emitted from the video data in units of each frame, recognizing a moving locus of the detected area by comparing at least two continuous frames and generating and outputting corresponding change information. With the present invention, the function-selecting can be more quickly and easily and increase making the most use of elements.

    摘要翻译： 公开了一种非合同选择装置。 非收缩选择装置包括向外部发光的光源; 相机单元，生成并输出与外部视频相对应的视频信号; 视频数据生成单元，生成与视频信号相对应的视频数据; 以及识别单元，以每个帧为单位检测由视频数据发射的光以指示装置反射并输入的由光形成的检测区域的位置，通过至少比较来识别检测区域的移动轨迹 两个连续帧，并生成并输出相应的变化信息。 利用本发明，可以更快速和容易地进行功能选择，并增加最多使用元件。

    MIMO ANTENNA APPARATUS
    73.
    发明申请
    MIMO ANTENNA APPARATUS 有权
    MIMO天线设备

    公开(公告)号：US20120105296A1

    公开(公告)日：2012-05-03

    申请号：US13283029

    申请日：2011-10-27

    申请人： Jae Young CHUNG ,  Dong-Jin KIM ,  Tae Sik YANG ,  Joong Ho JEONG ,  Ju Hyung LEE

    发明人： Jae Young CHUNG ,  Dong-Jin KIM ,  Tae Sik YANG ,  Joong Ho JEONG ,  Ju Hyung LEE

    IPC分类号： H01Q21/28 ,  H01Q1/52

    CPC分类号： H01Q1/521 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/28

    摘要： A Multiple Input Multiple Output (MIMO) antenna apparatus is provided. The apparatus includes antenna devices that operate in respective resonant frequency bands. The apparatus also includes a main board comprising a device region and a ground region. The antenna devices are disposed on the device region. The ground plate is disposed on the ground region for grounding the antenna devices. The apparatus also includes at least one isolation device having a negatively charged line that protrudes from the ground plate and extends between the antenna devices on the device region, and a positively charged line that extends around the negatively charged line and connects the antenna devices to each other. The isolation device induces an electromagnetic wave that is generated by the antenna devices between the negative and positively charged lines to isolate the antenna devices from each other.

    摘要翻译： 提供了多输入多输出（MIMO）天线装置。 该装置包括在相应的谐振频带中工作的天线装置。 该装置还包括主板，其包括设备区域和接地区域。 天线装置设置在装置区域上。 接地板设置在接地区域，用于使天线装置接地。 该装置还包括至少一个隔离装置，其具有从接地板突出并在设备区域上的天线装置之间延伸的带负电荷的线，以及在带负电的线周围延伸并且将天线装置连接到每个 其他。 隔离装置引起由负极和带正电的线路之间的天线装置产生的电磁波，以将天线装置彼此隔离。

    Backlight unit equipped with light emitting diodes
    76.
    发明授权
    Backlight unit equipped with light emitting diodes 有权
    背光单元配有发光二极管

    公开(公告)号：US07795635B2

    公开(公告)日：2010-09-14

    申请号：US11714193

    申请日：2007-03-06

    申请人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

    发明人： Gi Ho Jeong ,  Jae Wook Kwon ,  Dong Jin Kim ,  Yoon Tak Yang ,  Hyeong Won Yun ,  Hyun Ho Lee ,  Jeong Hoon Park

    IPC分类号： H01L33/64

    CPC分类号： H05K1/0206 ,  F21K9/00 ,  G02F1/133603 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/00014

    摘要： Disclosed herein is a backlight unit equipped with LEDs. The backlight includes an insulating substrate, a plurality of LED packages, an upper heat dissipation plate, and a lower heat dissipation plate. The insulating substrate is provided with predetermined circuit patterns. The LED packages are mounted above the insulating substrate, and are electrically connected to the circuit patterns. The upper heat dissipation plate is formed on the insulating substrate, and is configured to come into contact with the circuit patterns and to dissipate heat. The lower heat dissipation plate is formed on the insulating substrate, and is configured to transmit heat transmitted through the upper heat dissipation plate. The upper heat dissipation plate and the lower heat dissipation plate are connected to each other by at least one through hole, and the through hole and the upper heat dissipation plate have a predetermined area ratio.

    摘要翻译： 这里公开了配备有LED的背光单元。 背光源包括绝缘基板，多个LED封装，上部散热板和下部散热板。 绝缘基板设置有预定的电路图案。 LED封装安装在绝缘基板上方，并且电连接到电路图案。 上部散热板形成在绝缘基板上，并被配置为与电路图案接触并散热。 下部散热板形成在绝缘基板上，构成为透过上部散热板透过的热量。 上散热板和下散热板通过至少一个通孔彼此连接，并且通孔和上散热板具有预定的面积比。

    Antenna having parasitic element
    77.
    发明授权
    Antenna having parasitic element 有权
    天线具有寄生元件

    公开(公告)号：US07755560B2

    公开(公告)日：2010-07-13

    申请号：US12099739

    申请日：2008-04-08

    申请人： Se-hyun Park ,  Byung-tae Yoon ,  Young-min Moon ,  Dong-jin Kim

    发明人： Se-hyun Park ,  Byung-tae Yoon ,  Young-min Moon ,  Dong-jin Kim

    IPC分类号： H01Q19/10

    CPC分类号： H01Q1/2291 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q21/29 ,  H01Q23/00 ,  H01Q25/00

    摘要： An antenna having a parasitic element is disclosed, the antenna including a ground, a radiation unit which is arranged on a different area of the same plane as the ground, and a parasitic element which is selectively connected to the ground, and operates as an antenna element. Where the antenna is in a first mode, electromagnetic waves resonate in the radiation unit, and where the antenna is in a second mode, electromagnetic waves resonate in the radiation unit and the parasitic element.

    摘要翻译： 公开了一种具有寄生元件的天线，天线包括地面，布置在与地面相同的平面的不同区域上的辐射单元和选择性地连接到地面并作为天线工作的寄生元件 元件。 在天线处于第一模式的情况下，电磁波在辐射单元中谐振，并且在天线处于第二模式的地方，电磁波在辐射单元和寄生元件中谐振。

    Semiconductor device package
    79.
    发明授权
    Semiconductor device package 失效
    半导体器件封装

    公开(公告)号：US07629685B2

    公开(公告)日：2009-12-08

    申请号：US11585828

    申请日：2006-10-25

    申请人： Young Bok Yoon ,  Dong Jin Kim ,  Jin Woo Park

    发明人： Young Bok Yoon ,  Dong Jin Kim ,  Jin Woo Park

    IPC分类号： H01L23/06

    CPC分类号： H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01S5/02276 ,  H01S5/02476 ,  H01L2924/00014

    摘要： Disclosed is a semiconductor device package. The semiconductor device package includes at least one semiconductor device acting as a heating source, a package substrate having an upper surface on which the semiconductor device is mounted, the package substrate at least having a higher heat conductivity than that of the semiconductor device, and a fiber-reinforced polymer composite formed to surround a side surface of the package substrate, the polymer composite including fibers acting as a reinforcing material and a resin mass embedding the fibers therein.

    摘要翻译： 公开了一种半导体器件封装。 半导体器件封装包括至少一个充当加热源的半导体器件，具有上表面的封装衬底，半导体器件安装在该上表面上，封装衬底至少具有比半导体器件更高的导热性， 形成为围绕封装基板的侧表面的纤维增强聚合物复合材料，所述聚合物复合材料包括用作增强材料的纤维和将纤维嵌入其中的树脂块。