摘要:
A current control circuit capable of minimizing changes in an output high voltage VOH and an output low voltage VOL and quickly and accurately bringing a divided voltage to a steady state, and a packet-type semiconductor memory device including the current control circuit. The current control circuit includes a first differential amplification type buffer for transmitting the voltage of a first pad, that is, the output high voltage VOH, without change in response to a current control enable signal, a second differential amplification type buffer for transmitting the voltage of a second pad, that is, the output low voltage VOL, without change in response to the current control enable signal, and a voltage divider for dividing a voltage ranging between the voltage outputs of the first and second differential amplification buffers, and outputting the divided voltage. Accordingly, in the packet-type semiconductor memory device including the current control circuit, the current control circuit minimizes changes in the output high voltage VOH and the output low voltage VOL and quickly and accurately brings a divided voltage to a steady state, so that the current driving capability of an output driver for driving the second pad can be quickly controlled.
摘要:
A phase change memory device including a voltage generator that generates an operating voltage by generating at least one modified clock signal, a pulse width of which is maintained constant for at least one clock cycle in response to a pump enable signal being enabled, from at least one reference clock signal, and performing a pump operation on a power supply voltage according to the at least one modified clock signal; and a memory cell array that includes a plurality of phase change memory cells connected between word lines and bit lines. The operating voltage is applied to the memory cell array so as to perform a data access operation.
摘要:
A memory device is provided, which includes a plurality of global bit lines, a discharge line, a switching circuit configured to connect the plurality of global bit lines to the discharge line in response to a discharge enable signal, a first discharge circuit configured to apply a first voltage that is higher than a ground voltage to the discharge line, a precharge circuit configured to apply a precharge voltage to a selected global bit line among the plurality of global bit lines, and a second discharge circuit configured to discharge the selected global bit line to a second voltage that is higher than the ground voltage.
摘要:
Transistors, semiconductor memory cells having a transistor and methods of forming the same are provided, the transistors may include a semiconductor substrate having a first semiconductor region. A gate pattern may be disposed on the first semiconductor region. Spacer patterns may each be disposed on a sidewall of the gate pattern. Second semiconductor regions and a third semiconductor regions may be disposed in the semiconductor substrate. The second semiconductor regions may be disposed under the spacer patterns. The third semiconductor regions may be disposed adjacent to the second semiconductor regions. The first semiconductor region may have a higher impurity ion concentration than the second semiconductor regions.
摘要:
A nonvolatile semiconductor memory device includes a plurality of pillars protruding upward from a semiconductor substrate and having respective top surfaces and opposing sidewalls, a bit line on the top surfaces of the pillars and connecting a row of the pillars along a first direction, a pair of word lines on the opposing sidewalls of one of the plurality of pillars and crossing beneath the bit line, and a pair of memory layers interposed between respective ones of the pair of word lines and the one of the plurality of pillars. Methods of fabricating a nonvolatile semiconductor memory device include selectively etching a semiconductor substrate to form pluralities of stripes having opposing sidewalls and being arranged along a direction, forming memory layers and word lines along the sidewalls of the stripes selectively etching the stripes to form a plurality of pillars, and forming a bit line connecting the pillars and crossing above the word lines.
摘要:
A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein.
摘要:
A capacitorless one transistor (1T) semiconductor device whose data storage abilities are increased and leakage current is reduced is provided. The capacitor-less 1T semiconductor device includes a buried insulating layer formed on a substrate, an active region formed on the buried insulating layer and including a source region, a drain region and a floating body formed between the source region and the drain region, and a gate pattern formed on the floating body, wherein the floating body includes a main floating body having the same top surface height as one of the source region and the drain region, and a first upper floating body formed between the main floating body and the gate pattern.
摘要:
The semiconductor memory device includes a memory cell array and a switching circuit. The memory cell array includes a plurality of first memory cells connected between word lines and first local bit lines, and a plurality of second memory cells connected between the word lines and second local bit lines. The switching circuit is configured to respectively connect the first local bit lines to first global bit lines during a first sensing period, and to respectively connect the second local bit lines to second global bit lines during a second sensing period of a reading operation. The semiconductor memory device further includes a sensing circuit configured to sense and amplify data from the first global bit lines during the first sensing period, and to sense and amplify data from the second global bit lines during the second sensing period of the reading operation.
摘要:
A memory device is provided, which includes a plurality of global bit lines, a discharge line, a switching circuit configured to connect the plurality of global bit lines to the discharge line in response to a discharge enable signal, a first discharge circuit configured to apply a first voltage that is higher than a ground voltage to the discharge line, a precharge circuit configured to apply a precharge voltage to a selected global bit line among the plurality of global bit lines, and a second discharge circuit configured to discharge the selected global bit line to a second voltage that is higher than the ground voltage.
摘要:
An electrostatic discharge (ESD) protection device includes an I/O terminal structure and a current discharge structure. The current discharge structure includes a conductive region separated from a bridge region by a gate electrode, a well region formed below the conductive region, another well region separated from the well region by another conductive region, and multiple additional conductive regions implementing dual current discharge paths through another well region.