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公开(公告)号：US20200165446A1
公开(公告)日：2020-05-28
申请号：US16202156
申请日：2018-11-28
发明人： Te-Chao LIAO , Ying-Te HUANG , Hao-Sheng CHEN , Hung-Yi CHANG , Chia-Lin LIU
摘要： A thermosetting resin composition comprises a thermosetting polybutadiene resin, a thermosetting polyphenylene ether resin that is ended with styrene and acrylate in a weight ratio of 0.5-1.5 as reactive functional groups, a thermoplastic resin that serves to set desired heat resistance, flowability and filling performance, a compound cross-linking initiator composed of peroxides of different half-life temperatures to effectively improve its crosslink density during its thermal curing process; particularly the composition after cured has a low dielectric constant, a low dielectric dissipation factor, a high Tg, and high rigidity, and the prepreg made thereof is easy to cut.
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公开(公告)号：US20200165434A1
公开(公告)日：2020-05-28
申请号：US16202165
申请日：2018-11-28
发明人： Te-Chao LIAO , Ying-Te HUANG , Chih-Kai CHANG , Hung-Yi CHANG , Hao-Sheng CHEN , Chia-Lin LIU
摘要： A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulos; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
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公开(公告)号：US20200123363A1
公开(公告)日：2020-04-23
申请号：US16510429
申请日：2019-07-12
发明人： TE-CHAO LIAO , CHUN-LAI CHEN , WEN-YI WU
IPC分类号： C08L23/16 , C08F10/06 , C08K3/22 , C08K3/34 , C08K3/30 , C08J5/18 , C08J3/22 , B32B27/08 , B32B27/32
摘要： A matte synthetic paper is a biaxially oriented polypropylene synthetic paper having a thickness of 25 to 300 μm, and includes a printing surface layer as an outermost paper layer. Moreover, by adding a mist flour or a thermoplastic elastomer, the haze and gloss of the printing surface layer can be improved. According to Tappi T480, the printing surface layer having gloss of 15 to 50% is suitable to be printing paper.
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74.发明授权公开(公告)号：US10544254B2
公开(公告)日：2020-01-28
申请号：US15414582
申请日：2017-01-24
发明人： Cheng-Chung Lee , Chen-Hua Wu , Jaou-Shain Yu
IPC分类号： C08G59/06 , C09D163/08 , C09D5/18 , C09D7/20 , C09D163/04 , C08G59/08
摘要： This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288° C. soldering test and 2 hours pressure cooking test.
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公开(公告)号：US10435526B2
公开(公告)日：2019-10-08
申请号：US15634037
申请日：2017-06-27
发明人： Te-Chao Liao , Chun-Che Tsao , Chia-Ho Cheng , Tzai-Shing Chen
IPC分类号： C08J5/18 , C08K3/013 , B29C48/08 , B29C48/00 , G02B5/20 , C01D17/00 , B29K67/00 , B29K105/16
摘要： A transparent polyester film has low visible light transmittance of 5-50% by JIS K7705 testing standard and a high infrared-blocking rate of at least 90% by JIS R3106 testing standard, which is extruded from a kind of polyester resins obtained from 5-40 wt % of nanoparticle-based thermal insulation slurry and/or 0.005-0.1 wt % of nanoparticle-based black pigment slurry by weight of and to react with the polymerization materials to completely perform an esterification and a polycondensation, wherein the thermal insulation nanoparticle has a chemical formula of CsXNYWO3-ZClC with an average particle size of 10-90 nm and the nanoparticle-based black contains carbon black particles having a particle size of 20-80 nm.
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公开(公告)号：US10403865B2
公开(公告)日：2019-09-03
申请号：US14505713
申请日：2014-10-03
发明人： Dein-Run Fung , Ying-Te Huang , Chao-Hsien Lin , Ching-Yao Yuan , Teng-Ko Ma
IPC分类号： H01M2/02 , H01M10/052
摘要： A method for lithium aluminum film packaging materials, with water, high temperature and corrosion resistance, the substrate layer, and then layer, aluminum foil layer, anti-corrosion layer, adhesive layer and the inner layer together constitute from the outermost to innermost layer laminate structure in which one side of the aluminum foil layer, or both side surface of the conductive coating material to said coating and curing anticorrosive layer, and the use of fluorine-containing polyurethane resin constituting the laminated rubber layer and the inner layer of corrosion between the adhesive layer, used lithium batteries as plastic film packaging applications, it can promote lithium battery with Merit water resistance, high temperature resistance and corrosion resistance, and enhance the use of lithium batteries in years.
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公开(公告)号：US10179758B2
公开(公告)日：2019-01-15
申请号：US15615890
申请日：2017-06-07
摘要： A method for crystallizing succinic acid includes agitating a succinic acid reaction solution with a jet-flow agitator that is rotated at low speed and has a low volume power density; compared with the conventional agitators, the jet-flow agitator helps increase the uniformity of succinic acid particles, shorten the time required for crystallizing succinic acid, and raise the yield of the crystallized succinic acid as well as purity of crystallized succinic acid having a purity of 99.8-99.9%.
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78.发明申请公开(公告)号：US20180346398A1
公开(公告)日：2018-12-06
申请号：US15990871
申请日：2018-05-29
摘要： A hydrogenation method for preparing HBPA includes placing a BPA reaction liquid into a hydrogenation vessel with a hollow-shaft stirrer installed inside; starting the hollow-shaft stirrer to stir the BPA reaction liquid and simultaneously allowing hydrogen gas evenly distributed over and contact well with the BPA reaction liquid; in the presence of a single-metallic Ru/Al2O3 hydrogenation catalyst to proceed with a catalytic hydrogenation at low temperature and low pressure to produce HBPA, the HBPA has a yield of 99.7% or more, and particularly having a trans/trans isomer ratio above 63%.
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79.发明授权公开(公告)号：US10113355B2
公开(公告)日：2018-10-30
申请号：US15277475
申请日：2016-09-27
发明人： Kuei Yung Wang
摘要： A soundproof door having a multiple-layered core to form a concrete inner portion of the soundproof door, the multiple-layered core due to particularly constituted by having a soft-soundproofing core interleaved in between two spaced hard-soundproofing cores to form as a whole as a sandwich structure are excellent in sound isolation for soundproof door, and the soundproof door at least has an STC of 30, determined in accordance with ASTM E413-10 and E90-09, to minimize the transmission of sound from one side of the soundproof door to the other side.
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公开(公告)号：US10100142B2
公开(公告)日：2018-10-16
申请号：US15071733
申请日：2016-03-16
发明人： Cheng-Chung Lee , Yeong-Tong Hwang , Chen-Hua Wu , Jaou-Shain Yu
IPC分类号： C09D163/04 , C08L63/04 , C08G59/14 , C09D163/00 , H05K1/03 , B32B27/38 , H05K1/02
摘要： The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I) wherein A is: PPE are: Z are: Y are: Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03(1 GHz), dissipation factor is 0.0046(1 GHz) and no delamination longer than 60 minutes dipping in 288 soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.
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