Abstract:
A multi-state low-current-switching magnetic memory element (magnetic memory element) comprising a free layer, two stacks, and a magnetic tunneling junction is disclosed. The stacks and magnetic tunneling junction are disposed upon surfaces of the free layer, with the magnetic tunneling junction located between the stacks. The stacks pin magnetic domains within the free layer, creating a free layer domain wall. A current passed from stack to stack pushes the domain wall, repositioning the domain wall within the free layer. The position of the domain wall relative to the magnetic tunnel junction corresponds to a unique resistance value, and passing current from a stack to the magnetic tunnel junction reads the magnetic memory element's resistance. Thus, unique memory states may be achieved by moving the domain wall.
Abstract:
One embodiment of the present invention includes multi-state current-switching magnetic memory element including a stack of two or more magnetic tunneling junctions (MTJs), each MTJ having a free layer and being separated from other MTJs in the stack by a seeding layer formed upon an isolation layer, the stack for storing more than one bit of information, wherein different levels of current applied to the memory element causes switching to different states.
Abstract:
One embodiment of the present invention includes a non-volatile magnetic memory element including a fixed layer, a barrier layer formed on top of the fixed layer, and a free layer formed on top of the barrier layer, wherein the electrical resistivity of the barrier layer is reduced by placing said barrier layer under compressive stress. Compressive stress is induced by either using a compressive stress inducing layer, or by using inert gases at low pressure during the sputtering process as the barrier layer is deposited, or by introducing compressive stress inducing molecules into the molecular lattice of the barrier layer.
Abstract:
One embodiment of the present invention includes a non-uniform switching based non-volatile magnetic memory element including a fixed layer, a barrier layer formed on top of the fixed layer, a first free layer formed on top of the barrier layer, a non-uniform switching layer (NSL) formed on top of the first free layer, and a second free layer formed on top of the non-uniform switching layer, wherein switching current is applied, in a direction that is substantially perpendicular to the fixed, barrier, first free, non-uniform and the second free layers causing switching between states of the first, second free and non-uniform layers with substantially reduced switching current.
Abstract:
One embodiment of the present invention includes a multi-state current-switching magnetic memory element having a stack of magnetic tunneling junction (MTJ) separated by a non-magnetic layer for storing more than one bit of information, wherein different levels of current applied to the memory element cause switching to different states.
Abstract:
An oscillator circuit residing internally to a semiconductor device for generating a clock signal for use by digital circuits. The oscillator circuit includes a voltage regulator circuit responsive to frequency selection signals for selecting a predetermined frequency and a supply voltage. The voltage regulator circuit is operative to generate a voltage reference signal having a voltage level being adjusted to compensate for variations due to temperature, process and supply voltage variations. The oscillator circuit further includes a ring oscillator circuit responsive to the voltage reference signal for generating a clock out signal having a particular frequency based upon the voltage level of the voltage reference signal. Wherein the frequency of the clock out signal remains substantially constant despite temperature, process and supply voltage variations in the semiconductor circuit.
Abstract:
A flash EPROM cell has a reduced cell size by providing vertical coupling between the floating gate and the bit line during programming. The erase operation is done by tunneling of electrons from the sharp tip of the Poly spacer to the control gate. The cell is adapted so that the source for each cell within the array is the source of an adjacent cell and the drain is the drain to another adjacent cell. The cell is formed by forming the drain regions into the substrate through openings in a first insulator that is preferably the field oxide. A second insulator is deposited over the first insulator, over the substrate and along the side walls of the openings and is preferably a thin layer so that the opening is covered with a thin insulating layer. The insulated opening is filled with a metal, preferably tungsten or a tungsten alloy. The field oxide is selectively removed. A gate oxide is grown and a first polysilicon layer is formed and then etched to form spacers along the edges of the metal/second insulator structure. The first polysilicon is selectively etched and a tunneling insulator layer is formed thereover. A second polysilicon layer is formed over the tunneling insulator.
Abstract:
A multi-level NAND architecture non-volatile memory device reads and programs memory cells, each cell storing more than one bit of data, by comparing to a constant current level while selectively adjusting the gate voltage on the cell or cells being read or programmed. A plurality of read and write reference cells are provided each programmed to correspond to one each of the multi-level programming wherein during reading of the memory cells, the read reference cells provide the constant current level and during writing to the memory cells, the write reference cells provide the same. Furthermore, during a read operation, corresponding write reference cells are coupled to read reference cells to gauge the reading time associated with reading of memory cells.
Abstract:
A memory array is organized into rows and columns of resistive elements and is disclosed to include a resistive element to be read or to be written thereto. Further, a first access transistor is coupled to the resistive element and to a first source line and a second access transistor is coupled to the resistive element and to a second source line, the resistive element being coupled at one end to the first and second access transistors and at an opposite end to a bit line. The memory array further has other resistive elements that are each coupled to the bit line. The resistive element is written to while one or more of the other resistive elements are being read.