公开(公告)号：US20120223431A1

公开(公告)日：2012-09-06

申请号：US13142757

申请日：2011-04-11

申请人： Chao Zhao ,  Dapeng Chen ,  Wen Ou

发明人： Chao Zhao ,  Dapeng Chen ,  Wen Ou

IPC分类号： H01L23/48 ,  H01L21/762

CPC分类号： H01L21/76898 ,  H01L21/76224 ,  H01L2924/0002

摘要： A through-silicon via and a method for forming the same are provided. The method includes: providing a semiconductor substrate, the semiconductor substrate including an upper surface and an opposite lower surface; etching the upper surface of the semiconductor substrate to form an opening; filling the opening with a conductive material to form a first nail; etching the lower surface of the semiconductor substrate to form a recess, such that the first nail is exposed at a bottom of the recess; filling the recess with a conductive material that can be etched, and etching the conductive material that can be etched to form a second nail, such that the second nail is vertically connected with the first nail; and filling a gap between the second nail and the semiconductor substrate and a gap between the second nail and an adjacent second nail with a dielectric layer. Then invention can improve the reliability of through-silicon vias and avoid voids.

摘要翻译： 提供了一种硅通孔及其形成方法。 该方法包括：提供半导体衬底，所述半导体衬底包括上表面和相对的下表面; 蚀刻半导体衬底的上表面以形成开口; 用导电材料填充开口以形成第一钉; 蚀刻半导体衬底的下表面以形成凹部，使得第一指甲暴露在凹部的底部; 用可蚀刻的导电材料填充凹部，并蚀刻可蚀刻的导电材料以形成第二钉，使得第二钉与第一钉垂直连接; 以及在所述第二钉和所述半导体衬底之间填充间隙以及所述第二钉和相邻的具有介电层的第二钉之间的间隙。 然后，本发明可以提高硅通孔的可靠性并避免空隙。

公开(公告)号：US07183604B2

公开(公告)日：2007-02-27

申请号：US10459360

申请日：2003-06-10

申请人： Eduard Cartier ,  Jerry Chen ,  Chao Zhao

发明人： Eduard Cartier ,  Jerry Chen ,  Chao Zhao

IPC分类号： H01L29/94

CPC分类号： H01L21/28185 ,  C01G27/02 ,  C01P2002/72 ,  C23C16/40 ,  C23C16/405 ,  C23C16/4412 ,  H01B3/10 ,  H01L21/28167 ,  H01L21/28194 ,  H01L21/31604 ,  H01L28/40 ,  H01L29/517 ,  H01L29/518 ,  Y10T428/24917 ,  Y10T428/265

摘要： Dielectric material compositions comprising HfO2 and a second compound are disclosed. The compositions are characterized by at least a part of the compositions being in a cubic crystallographic phase. Further, semiconductor based devices comprising such dielectric material compound and method for forming such compounds are disclosed.

摘要翻译： 公开了包含HfO 2 N 2和第二化合物的介电材料组合物。 组合物的特征在于至少一部分组合物为立方晶相。 此外，公开了包含这种介电材料化合物的基于半导体的器件及其形成方法。

公开(公告)号：US09419095B2

公开(公告)日：2016-08-16

申请号：US14119864

申请日：2012-12-12

申请人： Chunlong Li ,  Junfeng Li ,  Jiang Yan ,  Chao Zhao

发明人： Chunlong Li ,  Junfeng Li ,  Jiang Yan ,  Chao Zhao

IPC分类号： H01L21/338 ,  H01L29/66 ,  H01L29/423 ,  H01L29/51 ,  H01L21/28

CPC分类号： H01L29/66545 ,  H01L21/28123 ,  H01L29/42364 ,  H01L29/513 ,  H01L29/518

摘要： A method for manufacturing a dummy gate in a gate-last process and a dummy gate in a gate-last process are provided. The method includes: providing a semiconductor substrate; growing a gate oxide layer on the semiconductor substrate; depositing bottom-layer amorphous silicon on the gate oxide layer; depositing an ONO structured hard mask on the bottom-layer amorphous silicon; depositing top-layer amorphous silicon on the ONO structured hard mask; depositing a hard mask layer on the top-layer amorphous silicon; forming photoresist lines on the hard mask layer, and trimming the formed photoresist lines so that the trimmed photoresist lines a width less than or equal to 22 nm; and etching the hard mask layer, the top-layer amorphous silicon, the ONO structured hard mask and the bottom-layer amorphous silicon in accordance with the trimmed photoresist lines, and removing the photoresist lines, the hard mask layer and the top-layer amorphous silicon.

摘要翻译： 提供了一种在门最后处理中制造伪栅极的方法和在栅极最后工艺中的伪栅极。 该方法包括：提供半导体衬底; 在半导体衬底上生长栅极氧化层; 在栅极氧化物层上沉积底层非晶硅; 在底层非晶硅上沉积ONO结构的硬掩模; 在ONO结构化的硬掩模上沉积顶层非晶硅; 在顶层非晶硅上沉积硬掩模层; 在硬掩模层上形成光致抗蚀剂线，并修整所形成的光致抗蚀剂线，使得修整的光致抗蚀剂线的宽度小于或等于22nm; 并根据修整的光致抗蚀剂线蚀刻硬掩模层，顶层非晶硅，ONO结构的硬掩模和底层非晶硅，并除去光致抗蚀剂线，硬掩模层和顶层无定形 硅。

公开(公告)号：US09136160B2

公开(公告)日：2015-09-15

申请号：US13697372

申请日：2012-07-31

申请人： Lijun Dong ,  Chao Zhao

发明人： Lijun Dong ,  Chao Zhao

IPC分类号： H01L23/498 ,  H01L21/768 ,  H01L23/14 ,  H01L21/48

CPC分类号： H01L21/76802 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A solid hole array and a method for forming the same are disclosed. The solid hold array may comprise: substrate with a via; a top hole array base formed on a top surface of the substrate and a bottom hole array base formed on a bottom surface of the substrate, wherein a front hole is located in the top hole array base at a place corresponding to the via; and top protection layer formed on a surface and sidewalls of the top hole array base and a bottom protection layer formed on a surface of the bottom hole array base, wherein a rear window is located in the bottom hole array base and the bottom protection layer at a place corresponding to the via.

摘要翻译： 公开了一种固体孔阵列及其形成方法。 固体保持阵列可以包括：具有通孔的基底; 形成在所述基板的上表面上的顶孔阵列基座和形成在所述基板的底面的底孔阵列基座，其中，在与所述通孔相对应的位置处，所述顶孔阵列基座中的前孔位于所述顶孔阵列基底中; 以及形成在顶孔阵列基底的表面和侧壁上的顶部保护层和形成在底部孔阵列基底的表面上的底部保护层，其中后部窗口位于底部孔阵列基底中，底部保护层位于底部保护层 一个对应于通道的地方。

公开(公告)号：US08994119B2

公开(公告)日：2015-03-31

申请号：US13520618

申请日：2012-04-11

申请人： Huaxiang Yin ,  Zuozhen Fu ,  Qiuxia Xu ,  Chao Zhao ,  Dapeng Chen

发明人： Huaxiang Yin ,  Zuozhen Fu ,  Qiuxia Xu ,  Chao Zhao ,  Dapeng Chen

IPC分类号： H01L27/088 ,  H01L21/8236 ,  H01L21/8238 ,  H01L29/49 ,  H01L29/78 ,  H01L29/51 ,  H01L29/66

CPC分类号： H01L21/823807 ,  H01L21/823842 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66545 ,  H01L29/7845

摘要： The present invention discloses a semiconductor device, comprising substrates, a plurality of gate stack structures on the substrate, a plurality of gate spacer structures on both sides of each gate stack structure, a plurality of source and drain regions in the substrate on both sides of each gate spacer structure, the plurality of gate spacer structures comprising a plurality of first gate stack structures and a plurality of second gate stack structures, wherein each of the first gate stack structures comprises a first gate insulating layer, a first work function metal layer, a second work function metal diffusion blocking layer, and a gate filling layer; Each of the second gate stack structures comprises a second gate insulating layer, a first work function metal layer, a second work function metal layer, and a gate filling layer, characterized in that the first work function metal layer has a first stress, and the gate filling layer has a second stress. Two metal gate layers of different types and/or intensity of stress are formed, respectively, thus different stresses are applied to the channel regions of different MOSFETs effectively and accurately, the device carrier mobility is enhanced simply and efficiently, and the device performance is also enhanced.

摘要翻译： 本发明公开了一种半导体器件，包括衬底，衬底上的多个栅极堆叠结构，在每个栅极堆叠结构的两侧上的多个栅极间隔结构，在衬底的两侧的多个源极和漏极区域 每个栅极间隔结构，所述多个栅极间隔结构包括多个第一栅极堆叠结构和多个第二栅极堆叠结构，其中所述第一栅极堆叠结构中的每一个包括第一栅极绝缘层，第一功函数金属层， 第二功函数金属扩散阻挡层和栅极填充层; 每个第二栅极堆叠结构包括第二栅极绝缘层，第一功函数金属层，第二功函数金属层和栅极填充层，其特征在于，第一功函数金属层具有第一应力，并且 栅极填充层具有第二应力。 形成不同类型和/或应力强度的两个金属栅极层，从而有效且准确地对不同MOSFET的沟道区域施加不同的应力，简化高效地提高器件载流子迁移率，器件性能也 增强。

公开(公告)号：US08647987B2

公开(公告)日：2014-02-11

申请号：US13698283

申请日：2012-06-12

申请人： Tao Yang ,  Chao Zhao ,  Junfeng Li

发明人： Tao Yang ,  Chao Zhao ,  Junfeng Li

IPC分类号： H01L21/302 ,  H01L21/461 ,  H01L21/311

CPC分类号： H01L21/30625 ,  H01L21/31053 ,  H01L21/31056 ,  H01L22/26 ,  H01L29/66545 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a method for improving uniformity of chemical-mechanical planarization process, comprising the steps of: forming features on a substrate; forming a first dielectric isolation layer between the features; planarizing the first dielectric isolation layer until the features are exposed, causing the first dielectric isolation layer between the features to have a recess depth; forming a second dielectric isolation layer on the features and the first dielectric isolation layer, whereby reducing the difference in height between the second dielectric isolation layer between the features and the second dielectric isolation layer on the top of the features; planarizing the second dielectric isolation layer until the features are exposed. According to the method for improving uniformity of chemical-mechanical planarization process of the invention, a dielectric isolation layer is formed again after grinding the dielectric isolation layer on the top of the features, such that the difference in height between the dielectric layer between the features and the dielectric layer on the top of the features is effectively reduced, and the recess of the features is compensated, the within-in-die uniformity is effectively improved.

摘要翻译： 本发明提供了一种改善化学机械平面化工艺的均匀性的方法，包括以下步骤：在基底上形成特征; 在所述特征之间形成第一绝缘隔离层; 平面化第一介电隔离层直到特征被暴露，使得特征之间的第一介电隔离层具有凹陷深度; 在特征和第一介电隔离层上形成第二绝缘隔离层，从而减小特征之间的第二介电隔离层与特征顶部的第二介电隔离层之间的高度差; 平坦化第二介电隔离层，直到特征被暴露。 根据本发明的化学机械平面化工艺的均匀性提高方法，在研磨特征顶部的介电隔离层之后再次形成介电隔离层，使得介电层之间的高度差 并且功能顶部的电介质层被有效地减少，并且特征的凹部得到补偿，从而有效地提高了模内均匀性。

公开(公告)号：US20140001646A1

公开(公告)日：2014-01-02

申请号：US13697372

申请日：2012-07-31

申请人： Lijun Dong ,  Chao Zhao

发明人： Lijun Dong ,  Chao Zhao

IPC分类号： H01L21/768 ,  H01L23/498

CPC分类号： H01L21/76802 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A solid hole array and a manufacture method thereof are provided. The method for manufacturing the solid hole array comprises: forming a top hole array base and a bottom hole array base on a top surface and a bottom surface of a substrate respectively; forming a front hole in the top hole array base; forming a top protection layer on the substrate with the top hole array base, and forming a bottom protection layer on the bottom hole array base; forming a rear window in the bottom hole array base and the bottom protection layer; and etching through the substrate by alkali corrosion to connect the front hole with the rear window. In addition, the present disclosure also provides a solid hole array. Using the method of the present disclosure, the intensity of the front film is enhanced, the process steps are simplified, the cost is decreased, and a large scale manufacture is more likely.

摘要翻译： 提供了一种固体孔阵列及其制造方法。 固体孔阵列的制造方法包括：分别在衬底的顶表面和底表面上形成顶孔阵列基底和底孔阵列基底; 在顶孔阵列基底中形成前孔; 在顶孔阵列基底上形成顶层保护层，在底孔阵列基底上形成底层保护层; 在底孔阵列基底和底部保护层中形成后窗; 并通过碱腐蚀蚀刻基板，将前孔与后窗连接起来。 此外，本公开还提供了一种固体孔阵列。 利用本公开的方法，提高了前膜的强度，简化了工艺步骤，降低了成本，并且更有可能进行大规模制造。

公开(公告)号：US08409986B2

公开(公告)日：2013-04-02

申请号：US13377889

申请日：2011-04-20

申请人： Tao Yang ,  Chao Zhao ,  Junfong Li

发明人： Tao Yang ,  Chao Zhao ,  Junfong Li

IPC分类号： H01L21/768

CPC分类号： H01L21/7684 ,  H01L21/3212 ,  H01L21/32135

摘要： A method for improving the within die uniformity of the metal plug CMP process in the gate last route is provided. Before performing the CMP process for forming the metal plug, a metal etching process is applied, so that the step height between the metal layers in the contact hole area and the non-contact hole area is greatly reduced. Therefore, the relatively small step height will exert a significantly less effect on the following CMP process, so that the step height will be limitedly transferred to the top of metal plug after finishing CMP process. In this way, the recess on top of the metal plug is largely reduced, so that a flat top of the metal plug is obtained, and within die uniformity and electrical properties the device are improved.

摘要翻译： 提供了一种用于提高门最后路线中的金属塞CMP工艺的模内均匀性的方法。 在进行用于形成金属插塞的CMP处理之前，应用金属蚀刻工艺，使得接触孔区域中的金属层与非接触孔区域之间的台阶高度大大降低。 因此，相对较小的台阶高度将对下列CMP工艺产生显着影响较小，因此在完成CMP工艺后，台阶高度将有限地转移到金属插头的顶部。 以这种方式，金属插头顶部的凹槽大大减小，从而获得金属插头的平坦的顶部，并且在模具的均匀性和电气特性中改进了该装置。

公开(公告)号：US20120322172A1

公开(公告)日：2012-12-20

申请号：US13499288

申请日：2011-11-29

申请人： Tao Yang ,  Chao Zhao ,  Junfeng Li ,  Jiang Yan ,  Dapeng Chen

发明人： Tao Yang ,  Chao Zhao ,  Junfeng Li ,  Jiang Yan ,  Dapeng Chen

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  H01L29/66545

摘要： The present invention discloses a method for monitoring the removal of a polycrystalline silicon dummy gate, comprising the steps of: forming a polycrystalline silicon dummy gate structure on a surface of a wafer; determining a measurement target and an error range of mass of the wafer; and measuring the mass of the wafer by a mass measurement tool after polycrystalline silicon dummy gate removal to determine whether the polycrystalline silicon dummy gate has been completely removed. According to the measurement method of the present invention, the full wafer may be quickly and accurately measured without requiring a specific test structure, to effectively monitor and determine whether the polysilicon dummy gate is thoroughly removed, meanwhile said measurement method gives feedback directly, quickly and accurately without causing any damage to the wafer.

摘要翻译： 本发明公开了一种用于监测多晶硅虚拟栅极去除的方法，包括以下步骤：在晶片的表面上形成多晶硅虚拟栅极结构; 确定晶片的测量目标和质量的误差范围; 以及通过质量测量工具在多晶硅虚拟栅极去除之后测量晶片的质量，以确定多晶硅虚拟栅极是否被完全去除。 根据本发明的测量方法，可以快速且准确地测量全晶片而不需要特定的测试结构，以有效地监测和确定多晶硅虚拟栅极是否被彻底去除，同时所述测量方法直接，快速地给出反馈， 准确地不会对晶片造成任何损坏。

公开(公告)号：US20120319215A1

公开(公告)日：2012-12-20

申请号：US13497744

申请日：2011-11-29

申请人： Guilei Wang ,  Chunlong Li ,  Chao Zhao

发明人： Guilei Wang ,  Chunlong Li ,  Chao Zhao

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/1054 ,  H01L29/66651 ,  H01L29/7833

摘要： The present invention discloses a semiconductor device and method of manufacturing the same, comprising: forming an insulating isolation layer on a substrate; forming an insulating isolation layer trench in the insulating isolation layer; forming an active region layer in the insulating isolation layer trench; and forming a semiconductor device structure in and above the active region layer, wherein the carrier mobility of the active region layer is higher than that of the substrate. In accordance with the semiconductor device and the manufacturing method thereof in the present invention, an active region formed of a material different from that of the substrate is used, the carrier mobility in the channel region is enhanced, thereby the device response speed is substantially improved and the device performance is enhanced greatly. Furthermore, unlike the existing STI manufacturing process, in the present invention a STI is formed first, and then filling is performed to form an active region, to avoid the problem of generation of holes in the STI and improve the device reliability.

摘要翻译： 本发明公开了一种半导体器件及其制造方法，包括：在衬底上形成绝缘隔离层; 在绝缘隔离层中形成绝缘隔离层沟槽; 在绝缘隔离层沟槽中形成有源区; 以及在所述有源区域层中和之上形成半导体器件结构，其中所述有源区域层的载流子迁移率高于所述衬底的载流子迁移率。 根据本发明的半导体器件及其制造方法，使用由与衬底不同的材料形成的有源区域，增加沟道区域中的载流子迁移率，从而显着提高器件响应速度 设备性能大大提升。 此外，与现有的STI制造方法不同，在本发明中，首先形成STI，然后进行填充以形成有源区，以避免在STI中产生孔的问题，并提高器件的可靠性。