公开(公告)号：US07925377B2

公开(公告)日：2011-04-12

申请号：US11458667

申请日：2006-07-19

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John A. Backer

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John A. Backer

IPC分类号： G06F7/00

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment of the cluster tool, grouping substrates together, and transferring and processing the substrates in groups of two or more, improves system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在集群工具中处理的衬底具有更可重复的晶片历史，并且还 集群工具具有更小的系统占用空间。 在集群工具的一个实施例中，将基板分组在一起，并且以两个或更多个组的方式传送和处理基板，提高了系统吞吐量，并且减少了机器人必须在处理室之间传送一批基板的移动次数 从而减少机器人的磨损，提高系统的可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US07831135B2

公开(公告)日：2010-11-09

申请号：US11849978

申请日：2007-09-04

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： A21B2/00 ,  A21B1/00 ,  C23C16/00

CPC分类号： H01L21/67248 ,  F27B17/0025

摘要： A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The method also includes determining a difference between the face plate temperature and a predetermined temperature and modifying the temperature control signal provided to the bake plate in response to the determined difference.

摘要翻译： 设置在具有与烘烤板相对的面板的半导体处理室中的烘烤板的操作方法包括向烘烤板提供温度控制信号并测量与面板相关联的面板温度。 该方法还包括确定面板温度和预定温度之间的差异，并且响应于所确定的差异来修改提供给烘烤板的温度控制信号。

公开(公告)号：US07694647B2

公开(公告)日：2010-04-13

申请号：US11458664

申请日：2006-07-19

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用具有增加的系统吞吐量，增加的系统可靠性的多腔室处理系统（例如，集群工具）来处理衬底的装置和方法，在集群工具中处理的衬底具有更可重复的晶片历史，并且还 集群工具具有更小的系统占用空间。 实施例还提供了用于改进涂布室，显影室，曝光后烘烤室，冷却室和烘焙室处理结果的方法和装置。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US07517469B2

公开(公告)日：2009-04-14

申请号：US11380913

申请日：2006-04-28

申请人： Harald Herchen ,  Erica Porras ,  Tetsuya Ishikawa

发明人： Harald Herchen ,  Erica Porras ,  Tetsuya Ishikawa

IPC分类号： B44C1/22 ,  G05D7/00

CPC分类号： G01F1/7086 ,  B05B12/082 ,  H01L21/6715 ,  H01L21/67225

摘要： Systems, devices and methods of measuring a flow of a liquid stream for a semiconductor process are provided. The liquid stream is delivered through a liquid delivery nozzle. The nozzle is adapted to deliver the liquid stream for the semiconductor process. The free stream extends from an upstream location near the nozzle to a downstream location. The stream is marked at the upstream location and measured at the downstream location to determine the flow.

摘要翻译： 提供了测量半导体工艺的液体流的流量的系统，装置和方法。 液体流通过液体输送喷嘴输送。 喷嘴适于输送用于半导体工艺的液体流。 自由流从喷嘴附近的上游位置延伸到下游位置。 流在上游位置标记并在下游位置测量以确定流。

公开(公告)号：US07497026B2

公开(公告)日：2009-03-03

申请号：US11763352

申请日：2007-06-14

申请人： Harald Herchen ,  Lily Pang ,  Erica Porras

发明人： Harald Herchen ,  Lily Pang ,  Erica Porras

IPC分类号： H01L21/00 ,  G01B9/00

CPC分类号： G01D5/342

摘要： A system for measuring substrate concentricity includes a substrate support member adapted to rotate a substrate around a substantially vertical axis. The substrate includes a mounting surface and a process surface. The system also includes a spin cup positioned below the substrate and a translatable arm mounted a predetermined distance above the process surface of the substrate. The translatable arm is adapted to translate along a radius of the substrate. The system further includes an optical emitter mounted on the translatable arm and an optical detector mounted on the translatable arm.

摘要翻译： 用于测量衬底同心度的系统包括适于围绕基本垂直轴线旋转衬底的衬底支撑构件。 衬底包括安装表面和工艺表面。 该系统还包括位于基底下方的旋转杯，以及安装在衬底的工艺表面上方预定距离的可平移臂。 可平移臂适于沿着基底的半径平移。 该系统还包括安装在可平移臂上的光发射器和安装在可平移臂上的光学探测器。

公开(公告)号：US20080050679A1

公开(公告)日：2008-02-28

申请号：US11678034

申请日：2007-02-22

申请人： Mohsen Salek ,  Tetsuya Ishikawa ,  Christoper Beaudry ,  Steven Verhaverbeke ,  Helen Armer ,  Harald Herchen ,  Leon Volfovsky

发明人： Mohsen Salek ,  Tetsuya Ishikawa ,  Christoper Beaudry ,  Steven Verhaverbeke ,  Helen Armer ,  Harald Herchen ,  Leon Volfovsky

IPC分类号： G03C5/29 ,  G03B27/58

CPC分类号： G03B27/58 ,  G03F7/70341

摘要： A method of processing a substrate includes forming a coating layer over a front surface of the substrate and exposing the coating layer in an immersion scanner. The coating layer may include a photoresist layer. The method also includes performing one or more immersion processes on the substrate after exposure. As an example, the one or more immersion processes include an immersion post-exposure bake process.

摘要翻译： 一种处理衬底的方法包括在衬底的前表面上形成涂层，并在浸没式扫描仪中曝光该涂层。 涂层可以包括光致抗蚀剂层。 该方法还包括在曝光之后在衬底上执行一个或多个浸渍处理。 作为示例，一个或多个浸渍处理包括浸渍曝光后烘烤处理。

公开(公告)号：US20060286300A1

公开(公告)日：2006-12-21

申请号：US11458667

申请日：2006-07-19

申请人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

发明人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

IPC分类号： B05D1/40 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20060237308A1

公开(公告)日：2006-10-26

申请号：US11475584

申请日：2006-06-27

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： C25B9/00 ,  C25C7/00 ,  C25D17/00

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/06

摘要： A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

公开(公告)号：US20060236941A1

公开(公告)日：2006-10-26

申请号：US11336471

申请日：2006-01-20

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： B65G25/00 ,  C23C16/00 ,  H01L21/306

CPC分类号： H01L21/67103 ,  H01L21/67748 ,  H01L21/6838

摘要： The present invention provides an apparatus and a method of handling and transferring substrate in reduced particle contamination and thermal stress, as well as increased speed. One embodiment of the present invention provides an apparatus for handling a substrate. The apparatus comprises a support plate, and at least one pad protruding an upper surface of the support plate. The pad is configured to support a backside of the substrate so that the backside of the substrate is a first distance away from the upper surface of the support plate. The thermal resistance of the pad is substantially equal to the thermal resistance of the medium between the substrate and the upper surface.

摘要翻译： 本发明提供了一种在减少的颗粒污染和热应力以及增加的速度下处理和转移衬底的装置和方法。 本发明的一个实施例提供一种用于处理衬底的装置。 该装置包括支撑板和至少一个突出支撑板的上表面的垫。 衬垫被配置为支撑衬底的背面，使得衬底的背面离开支撑板的上表面的第一距离。 焊盘的热阻基本上等于介质在基板和上表面之间的热阻。

公开(公告)号：US20060102467A1

公开(公告)日：2006-05-18

申请号：US10988646

申请日：2004-11-15

申请人： Harald Herchen ,  John Dukovic ,  Lily Pang

发明人： Harald Herchen ,  John Dukovic ,  Lily Pang

IPC分类号： C25C3/16 ,  C25B9/00 ,  C25D17/00

CPC分类号： C25D17/008 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007

摘要： A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to receive a substrate for processing, an anode assembly positioned in the fluid basin, and a collimator positioned in the fluid basin between the anode assembly and the opening.

摘要翻译： 提供了一种用于将导电材料电镀到基底上的方法和装置。 该装置包括流体处理池，流体池被配置为容纳电解质溶液，并且具有构造成接收用于处理的基板的开口，定位在流体池中的阳极组件和位于阳极组件之间的流体池中的准直器 和开幕。