摘要:
An image sensor 1 has a substrate 2 and primary light-receiving pixels 4 arrayed in the direction of the surface of the substrate, and the primary light-receiving pixels are formed by laminating plural secondary light-receiving pixels 10, 20 and 30 which sense lights in different wavelength ranges, respectively, via at least sealing insulation layers 18 and 28 between adjacent secondary light-receiving pixels in the thickness direction. Each secondary light-receiving pixel includes a photoelectric conversion portion 14, 24, or 34 for photoelectrically converting the lights and a signal output portion 12, 22 or 32 for outputting signals from a thin film transistor 40 according to charges generated by the photoelectric conversion portion, and the active layer 48 of the thin film transistor is formed from an oxide semiconductor or organic semiconductor.
摘要:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要:
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要:
The honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein an average pore diameter of the porous ceramic member is larger than an average particle diameter of particles constituting the catalyst supporting layer, and when a pore diameter distribution of the porous ceramic member and a particle diameter distribution of particles constituting the catalyst supporting layer are drawn with the pore diameter and the particle diameter being on the same axis, a pore volume in an overlapped area of both the distributions is about 10% or less to the entire pore volume of the porous ceramic member.
摘要:
The present invention provides a method for producing a honeycomb structure which carries a catalyst component containing at least one element selected from the group consisting of alkali metals and alkaline earth metals and purifies exhaust emissions. The method of the invention includes: a starting material mixing step of mixing ceramic particles having a predetermined average particle size, fine particles being composed of the same material as the ceramic particles and having an average particle size smaller than the predetermined average particle size, and an erosion-resistant material or a precursor thereof which inhibits the catalyst component from eroding the ceramic particles more effectively than an oxide of the element contained in the ceramic particles, to prepare a puddle; a molding and firing step of molding the puddle into a molded body and firing the molded body to sinter the molded body and to allow a ceramic particle protection material composed of the erosion-resistant material or the precursor thereof to be present on the surface of the molded body; and a catalyst-carrying step of making the fired molded body to carry the catalyst component.
摘要:
A photoelectric conversion layer comprising a compound represented by the following formula (1): wherein L represents a divalent or polyvalent connecting group; n represents an integer of 2 or more; and A is a chemical structure represented by the following formula (2): wherein X1 to X8 each independently represents a substituted or unsubstituted carbon atom or a nitrogen atom.
摘要:
A honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in a longitudinal direction with a wall portion therebetween and either one end of which is sealed, with a catalyst supporting layer being adhered to the wall portion, wherein, supposing that the rate of the pore volume of pores having a pore diameter of 10 μm or less to the entire pore volume of the porous ceramic member is X1 (%), the porosity is Y1 (%) and the weight of the catalyst supporting layer is Z1 (g/l), these X1, Y1 and Z1 are allowed to satisfy the following expressions (1) and (2): X1≦20−Z1/10 (1), and Y1≧35+7Z1/40 (2) (where about 20≦Z1≦about 150).
摘要:
A sintering aid for promoting sintering of ceramic particles and fine particles that are the same materials as ceramic particles and have smaller average particle diameter are mixed to obtain a puddle. The average particle diameter of ceramic particles is preferably about in a range of 5 to 100 μm; the average particle diameter of the fine particles is preferably about in a range of 0.1 to 1.0 μm, and the average particle diameter of the sintering aid is preferably about in a range of 0.1 to 10 μm. As the sintering aid, for example, alumina is used. This puddle is extrusion molded into a honeycomb shape and the molded object is fired at a firing temperature lower than a temperature for sintering without mixing a sintering aid. The thermal conductivity of the obtained honeycomb structure 10 shows about 60% or more of the thermal conductivity of a fired body fired without adding a sintering aid to ceramic particles and shows about 12 W/m·K or more at 20° C.
摘要:
An organopolysiloxane-modified polysaccharide prepared by esterification reacting (A) an organopolysiloxane having residual carboxylic anhydride groups and (B) a polysaccharide having hydroxyl groups, wherein the organopolysiloxane is bonded to the polysaccharide through half ester groups, and a process for the preparation of organopolysiloxane-modified polysaccharide, in which component (A) and component (B) are subjected to an esterification reaction in the presence of (C) a non-protonic polar solvent. The organopolysiloxane-modified polysaccharide comprising polysaccharide and organopolysiloxane bonded thereto through half ester groups is novel. The process for the preparation of organopolysiloxane-modified polysaccharide permits introduction of organopolysiloxane into polysaccharide at a high introduction ratio.