公开(公告)号：US20150140797A1

公开(公告)日：2015-05-21

申请号：US14610755

申请日：2015-01-30

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L27/115 ,  H01L29/51 ,  H01L21/28

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

Abstract translation: 三维存储器单元以及制造和使用存储器单元的方法一般在此讨论。 在一个或多个实施例中，三维垂直存储器可以包括存储器堆栈。 这样的存储器堆可以包括存储器单元和相邻存储单元之间的电介质，每个存储单元包括控制栅极和电荷存储结构。 存储单元还可以包括电荷存储结构和控制栅极之间的阻挡材料，电荷存储结构和阻挡材料具有基本相等的尺寸。

公开(公告)号：US08946807B2

公开(公告)日：2015-02-03

申请号：US13748747

申请日：2013-01-24

Applicant: Micron Technology, Inc.

Inventor： John Hopkins ,  Darwin Franseda Fan ,  Fatma Arzum Simsek-Ege ,  James Brighten ,  Aurelio Giancarlo Mauri ,  Srikant Jayanti

IPC: H01L29/788 ,  H01L29/423 ,  H01L29/40

CPC classification number: H01L29/7887 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11582 ,  H01L29/401 ,  H01L29/42324 ,  H01L29/518 ,  H01L29/66825 ,  H01L29/7827 ,  H01L29/7881 ,  H01L29/7889

Abstract: Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.

Abstract translation: 三维存储器单元以及制造和使用存储器单元的方法一般在此讨论。 在一个或多个实施例中，三维垂直存储器可以包括存储器堆栈。 这样的存储器堆可以包括存储器单元和相邻存储单元之间的电介质，每个存储单元包括控制栅极和电荷存储结构。 存储单元还可以包括电荷存储结构和控制栅极之间的阻挡材料，电荷存储结构和阻挡材料具有基本相等的尺寸。

公开(公告)号：US20140264542A1

公开(公告)日：2014-09-18

申请号：US13864794

申请日：2013-04-17

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Fatma Arzum Simsek-Ege ,  John Hopkins ,  Srikant Jayanti

IPC: H01L29/792 ,  H01L29/66

CPC classification number: H01L27/11556 ,  H01L27/11524 ,  H01L27/11582 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/7889 ,  H01L29/7926

Abstract: Vertical memories and methods of making the same are discussed generally herein. In one embodiment, a vertical memory can include a vertical pillar extending to a source, an etch stop tier over the source, and a stack of alternating dielectric tiers and conductive tiers over the etch stop tier. The etch stop tier can comprise a blocking dielectric adjacent to the pillar. In another embodiment, the etch stop tier can comprise a blocking dielectric adjacent to the pillar, and a plurality of dielectric films horizontally extending from the blocking dielectric into the etch stop tier.

Abstract translation: 垂直记忆及其制备方法一般在此讨论。 在一个实施例中，垂直存储器可以包括延伸到源的垂直柱，源极上的蚀刻停止层，以及蚀刻停止层上方的交替介电层和导电层的堆叠。 蚀刻停止层可以包括邻近柱的阻挡电介质。 在另一个实施例中，蚀刻停止层可以包括邻近柱的阻挡电介质和从阻挡电介质水平延伸到蚀刻停止层中的多个电介质膜。

公开(公告)号：US20140264532A1

公开(公告)日：2014-09-18

申请号：US13838297

申请日：2013-03-15

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Charles H. Dennison ,  Akira Goda ,  John Hopkins ,  Fatma Arzum Simsek-Ege ,  Krishna K. Parat

IPC: H01L29/788

CPC classification number: H01L27/11556 ,  H01L21/28273 ,  H01L27/11578 ,  H01L29/66666 ,  H01L29/66825 ,  H01L29/66833

Abstract: Floating gate memory cells in vertical memory. A control gate is formed between a first tier of dielectric material and a second tier of dielectric material. A floating gate is formed between the first tier of dielectric material and the second tier of dielectric material, wherein the floating gate includes a protrusion extending towards the control gate. A charge blocking structure is formed between the floating gate and the control gate, wherein at least a portion of the charge blocking structure wraps around the protrusion.

Abstract translation: 垂直存储器中的浮动存储单元。 控制栅极形成在介电材料的第一层和第二层电介质材料之间。 浮动栅极形成在介电材料的第一层和第二层介质材料之间，其中浮动栅极包括朝向控制栅极延伸的突起。 在浮置栅极和控制栅极之间形成电荷阻挡结构，其中电荷阻挡结构的至少一部分围绕突起卷绕。

公开(公告)号：US20140027832A1

公开(公告)日：2014-01-30

申请号：US14043943

申请日：2013-10-02

Applicant: Micron Technology, Inc.

Inventor： James Mathew ,  Gordon Haller ,  Ronald A. Weimer ,  John Hopkins ,  Vinayak K. Shamanna ,  Sanjeev Sapra

IPC: H01L29/78

CPC classification number: H01L29/78 ,  H01L21/764 ,  H01L27/11524 ,  H01L27/1157

Abstract: A memory array has first and second memory cells over a semiconductor and an isolation region extending into the semiconductor. The isolation region includes an air gap between charge-storage structures of the first and second memory cells and a thickness of dielectric over the air gap and contained between the first and second memory cells.

Abstract translation: 存储器阵列具有半导体上的第一和第二存储器单元以及延伸到半导体中的隔离区。 隔离区包括第一和第二存储单元的电荷存储结构之间的气隙和气隙上的电介质的厚度，并且包含在第一和第二存储单元之间。