公开(公告)号：US06332270B2

公开(公告)日：2001-12-25

申请号：US09198179

申请日：1998-11-23

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice H. Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： H01R914

CPC分类号： G01R1/07378 ,  G01R1/07314 ,  G01R3/00 ,  H01L2224/16225 ,  H01L2924/15312 ,  Y10T29/49004 ,  Y10T29/49151 ,  Y10T29/49222

摘要： A high density integrated test probe and method of fabrication is described. A group of wires are ball bonded to contact locations on the surface of a fan out substrate. The wires are sheared off leaving a stub, the end of which is flattened by an anvil. Before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs. The sheet of material supports the enlarged tip. The substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate.

摘要翻译： 描述了高密度集成测试探针和制造方法。 将一组电线球焊接到扇形外壳的表面上的接触位置。 电线被剪断，留下一个短截线，其末端被砧平坦化。 在平坦化具有一组孔的材料的片材之前，布置成使一组短截线对准，以便将短截线组放置在短截线上。 该材料片支撑放大的尖端。 具有短截线的基底形成探针，该探针移动成与诸如滴液或包装基底的工件上的接触位置接合。

公开(公告)号：US6104201A

公开(公告)日：2000-08-15

申请号：US162474

申请日：1998-09-28

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： G01R31/02

CPC分类号： G01R1/06733 ,  G01R1/07364 ,  G01R3/00

摘要： Probe structures for testing electrical interconnections to integrated circuit devices and other electronic components; particularly to testing integrated circuits devices with high density area array solder ball interconnections. The probe structure is formed from a substrated have a surface, with at least one electrical contact location having a perimeter which is raised above the surface, and a location within the boundaries of said perimeter which is raised above the surface.

摘要翻译： 用于测试集成电路器件和其他电子部件的电气互连的探头结构; 特别是测试具有高密度面积阵列焊球互连的集成电路器件。 探针结构由一个底部形成，具有一个表面，其中至少一个电接触位置具有在表面上方升高的周边，以及在该表面上方升高的所述周边的边界内的位置。

公开(公告)号：US6062879A

公开(公告)日：2000-05-16

申请号：US78174

申请日：1998-05-13

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

IPC分类号： G01R1/073 ,  H01R13/24 ,  H05K7/10 ,  H01R4/04

CPC分类号： H01R13/2414 ,  G01R1/07357 ,  H05K7/1061 ,  H01R12/714

摘要： The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.

摘要翻译： 本发明是用于探测电子设备的结构。 该结构具有具有第一侧和第二侧的弹性体材料层; 从所述第一侧延伸到所述第二侧的多个电导体; 每个电导体具有第一端和第二端，第一端延伸到第一侧，第二端延伸到所述第二侧; 设置在所述第一侧上的介电材料层; 多个电导体的第一端延伸到电介质材料层中的开口中。 更具体地说，在本发明中，第二面设置成与衬底的第一表面接触，并且电导体的第二端电连接到第一表面上的第一电接触位置。

公开(公告)号：US5914614A

公开(公告)日：1999-06-22

申请号：US946141

申请日：1997-10-07

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

IPC分类号： G01R1/067 ,  G01R3/00 ,  H05K3/32 ,  H05K3/40 ,  G01R1/073

CPC分类号： H05K3/326 ,  G01R1/06727 ,  G01R3/00 ,  G01R1/06744 ,  G01R1/06761 ,  H01L2224/1134 ,  H01L2924/00013 ,  H05K3/4015

摘要： Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

摘要翻译： 描述电子设备探头。 探针通过将多根线球焊接到扇形基板表面上的接触位置而形成。 电线被切断留下残留物。 其中具有电导体图案的图案化聚合物片材设置在延伸穿过片材中的孔的短截线上。 电线的端部被压扁以将聚合物片材放置在适当位置。 导线连接到聚合物片上的电导体，该电导体转换成聚合物片上的接触垫。 将第二根线球焊接到聚合物片上的垫上并切割以留下第二个短截线。 聚合物片材被激光切割，使得每个第二短截线自由地独立于其它第二螺柱移动。 第二短截线的端部设置在诸如FC芯片的电子设备的接触位置，以测试电子设备。

公开(公告)号：US5838160A

公开(公告)日：1998-11-17

申请号：US744903

申请日：1996-11-08

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/07314 ,  G01R1/0466 ,  G01R1/06738 ,  G01R3/00 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01322

摘要： The present invention is directed to probe structures for testing of electrical interconnections to integrated circuit devices and other electronic components and particularly to testing integrated circuit devices with high density area array solder ball interconnections. The probe structure is formed from a substrate having a surface having at least one electrical contact location which has a perimeter which is raised above the surface and a location within the boundaries of said perimeter which is raised above the surface.

摘要翻译： 本发明涉及用于测试集成电路器件和其他电子部件的电互连的探针结构，特别是用于测试具有高密度面积阵列焊球互连的集成电路器件。 探针结构由具有至少一个电接触位置的表面的基底形成，所述电接触位置具有在表面上方升高的周边以及在表面上方升高的周边边界内的位置。

公开(公告)号：US5821763A

公开(公告)日：1998-10-13

申请号：US754869

申请日：1996-11-22

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  G01R31/02

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant of high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

摘要翻译： 本发明涉及一种高密度测试探针，其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由嵌入柔性高弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 空间变压器由多层集成电路芯片封装基板形成。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

公开(公告)号：US5785538A

公开(公告)日：1998-07-28

申请号：US641667

申请日：1996-05-01

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih

IPC分类号： G01R1/073 ,  H01R13/24 ,  H05K7/10 ,  H01R4/04

CPC分类号： H01R13/2414 ,  G01R1/07357 ,  H05K7/1061 ,  H01R12/714

摘要： The present invention is a structure for probing an electronic device. The structure has a layer of elastomeric material having a first side and a second side; a plurality of electrical conductors extending from the first side to the second side; each of the electrical conductors has a first end and a second end, the first end extends to the first side, the second end extends to said second side; a layer of dielectric material disposed on the first side; the first end of the plurality of electrical conductors extends into openings in the layer of dielectric material. More particularly, in the present invention, the second side is disposed in contact with a first surface of a substrate and the second ends of the electrical conductors are electrically connected to first electrical contact locations on the first surface.