公开(公告)号：US08785839B2

公开(公告)日：2014-07-22

申请号：US13433418

申请日：2012-03-29

申请人： Hitoshi Takeuchi ,  Noriyuki Kimura ,  Koji Noguchi

发明人： Hitoshi Takeuchi ,  Noriyuki Kimura ,  Koji Noguchi

IPC分类号： H01J5/02 ,  H01L31/0203 ,  H01L23/12

CPC分类号： H01L31/02002 ,  G01J1/0214 ,  G01J1/0271 ,  G01J1/0407 ,  G01J1/0437 ,  G01J1/0488 ,  G01J1/4204 ,  G01J5/041 ,  G01J5/045 ,  H01L31/0203 ,  H01L2224/16225 ,  Y10T29/49826

摘要： An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form a cavity portion. A photoelectric conversion element id accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches each formed at a corner of a peripheral edge along an outside surface of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals.

摘要翻译： 光学传感器具有具有凹部的玻璃基底，玻璃盖接合到基部并且覆盖在凹部上以形成空腔部。 容纳在空腔部分中的光电转换元件id。 内部布线的一端各自连接到光电转换元件，并且沿着沿底部的外表面形成在周缘的角部的凹口延伸。 内部配线的另一端连接在凹口内，外部布线沿着底座的外表面延伸并终止于外部端子。

公开(公告)号：US20140169827A1

公开(公告)日：2014-06-19

申请号：US14106413

申请日：2013-12-13

申请人： Yoshio Hattori ,  Yoshiyuki Fukuda ,  Sho Akiyama ,  Yuki Oshikawa ,  Noriyuki Kimura

发明人： Yoshio Hattori ,  Yoshiyuki Fukuda ,  Sho Akiyama ,  Yuki Oshikawa ,  Noriyuki Kimura

IPC分类号： G03G15/08

CPC分类号： G03G15/0865 ,  G03G15/0882 ,  G03G2215/0875

摘要： A developing device includes a developer bearer, a development casing in which a developer conveyance channel is formed facing the developer bearer through a communicating area, a developer supply member disposed in the developer conveyance channel, a developer regulator disposed facing a lower portion of the developer bearer to adjust an amount of developer carried on the developer bearer, and a sheet member that is removably installed to seal the communicating area and passes through a gap between the developer regulator and the developer bearer and an opening formed in the development casing. A first end of the sheet member is retained downstream from the gap in a direction of rotation of the developer bearer, and the sheet member is fixed to the development casing at a position across the communicating area from the first end with a second end positioned outside the development casing.

摘要翻译： 显影装置包括显影剂载体，显影外壳，其中通过连通区域形成面向显影剂承载体的显影剂输送通道，设置在显影剂输送通道中的显影剂供应构件，面向显影剂下部设置的显影剂调节剂 用于调节显影剂载体上承载的显影剂的量;以及片状构件，其可移除地安装以密封通信区域并且通过显影剂调节器和显影剂承载体之间的间隙以及形成在显影外壳中的开口。 片状构件的第一端在间隙的下游保持在显影剂载体的旋转方向上，并且片状构件在与第一端横跨连通区域的位置处固定到显影外壳，第二端位于外部 开发套管。

公开(公告)号：US20120166176A1

公开(公告)日：2012-06-28

申请号：US13383742

申请日：2010-03-03

申请人： Satoshi Nakamura ,  Eiichiro Sumita ,  Yutaka Ashikari ,  Noriyuki Kimura ,  Chiori Hori

发明人： Satoshi Nakamura ,  Eiichiro Sumita ,  Yutaka Ashikari ,  Noriyuki Kimura ,  Chiori Hori

IPC分类号： G06F17/28 ,  G10L13/04 ,  G10L15/00

CPC分类号： G06F17/289 ,  G10L13/00 ,  G10L15/26

摘要： A conventional speech recognition dictionary, translation dictionary and speech synthesis dictionary used in speech translation have inconsistencies. Inconsistency among dictionaries can be solved with a dictionary server including an all-language group dictionary storage unit capable of having stored therein, for two or more languages, two or more all-language term information pieces for speech recognition, translation and speech synthesis, an information-for-speech-recognition sending unit that acquires information for speech recognition including speech recognition information of a term for all languages, and sends the information to one or more speech recognition servers, an information-for-translation sending unit that acquires information for translation including the written form of the term for all languages, and sends the information to one or more translation servers, and an information-for-speech-synthesis sending unit that acquires information for speech synthesis including speech synthesis information of a term for all languages, and sends the information to one or more speech synthesis servers.

摘要翻译： 用于语音翻译的常规语音识别字典，翻译词典和语音合成词典具有不一致性。 词典之间的不一致性可以用包括能够存储在其中的两种或多种语言的全语言组字典存储单元的字典服务器来解决，用于语音识别，翻译和语音合成的两个或多个全语言术语信息片段 用于语音识别发送单元，其获取包括所有语言的术语的语音识别信息的语音识别信息，并将该信息发送到一个或多个语音识别服务器，该翻译信息发送单元获取用于 翻译包括所有语言的术语的书面形式，并将信息发送到一个或多个翻译服务器，以及语音合成发送单元，其获取包括用于所有语言的术语的语音合成信息的语音合成信息 并将信息发送到一个或多个语音合成服务器。

公开(公告)号：US20120068340A1

公开(公告)日：2012-03-22

申请号：US13200246

申请日：2011-09-21

申请人： Noriyuki Kimura

发明人： Noriyuki Kimura

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L24/14 ,  H01L21/565 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/141 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1905 ,  H01L2924/384 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Provided is a BGA semiconductor package including: a substrate on which a semiconductor device is mounted; an adhesive for adhering the semiconductor device and the substrate to each other; a micro ball having conductivity, the micro ball being fitted into a through-hole provided in the substrate; a bonding wire for electrically connecting the semiconductor device and the micro ball to each other; and an encapsulation member for encapsulating, with an encapsulation resin, the semiconductor device, the adhesive, a part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted, in which at least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member.

摘要翻译： 提供一种BGA半导体封装，包括：安装半导体器件的衬底; 用于将半导体器件和衬底彼此粘合的粘合剂; 具有导电性的微球，所述微球嵌入到设置在所述基板中的通孔中; 用于将半导体器件和微球彼此电连接的接合线; 以及封装构件，其仅在安装有半导体器件的基板的表面侧上用封装树脂封装半导体器件，粘合剂，微球的一部分和接合线，其中在 微球的底表面的至少一部分具有作为外部连接端子的暴露部分，其通过设置在基板中的通孔作为封装构件的底表面露出。

公开(公告)号：US20080044948A1

公开(公告)日：2008-02-21

申请号：US11880978

申请日：2007-07-25

申请人： Noriyuki Kimura

发明人： Noriyuki Kimura

IPC分类号： H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a leadless, resin sealed semiconductor device structure and manufacturing method. In the semiconductor device according to the present invention, one side of a thin plate made of copper or the like is subjected to half etching, and a plurality of die pad portions (3) and bonding areas (2) are formed thereon. A semiconductor chip (4) is mounted on each of the die pad portions (3). Then, electrodes (5) on the respective semiconductor chips and the bonding areas (2) are electrically connected to each other, and a mounting side of the respective semiconductor chips (4) is sealed with a molding resin (7). After that, a conductive board side is gradually and evenly removed, and only the die pad portions (3) and the bonding areas (2) (external connecting electrodes) are exposed. Finally, dicing is conducted to obtain a separated semiconductor device as a final form.

摘要翻译： 本发明涉及一种无引线树脂密封半导体器件结构及其制造方法。 在根据本发明的半导体器件中，对由铜等制成的薄板的一侧进行半蚀刻，并且在其上形成多个芯片焊盘部分（3）和接合区域（2）。 半导体芯片（4）安装在每个芯片焊盘部分（3）上。 然后，各半导体芯片上的电极（5）和接合区域（2）彼此电连接，并且用模制树脂（7）密封各个半导体芯片（4）的安装侧。 之后，导电板侧被逐渐均匀地去除，只有裸片焊盘部分（3）和接合区域（2）（外部连接电极）露出。 最后，进行切割以获得作为最终形式的分离的半导体器件。

公开(公告)号：US07177573B2

公开(公告)日：2007-02-13

申请号：US10849821

申请日：2004-05-21

申请人： Noriyuki Kimura ,  Nobuhiko Umezawa ,  Takeroh Kurenuma ,  Hideyuki Takemoto

发明人： Noriyuki Kimura ,  Nobuhiko Umezawa ,  Takeroh Kurenuma ,  Hideyuki Takemoto

IPC分类号： G03G15/06

CPC分类号： G03G15/0806

摘要： An image forming apparatus including an image bearing member bearing latent images; a developing unit including plural developing devices developing the latent images with developers to form visual images, each developing device including a developer bearing member bearing the developer to develop the latent image, and a developer thickness controlling member contacting the developer bearing member to control the thickness of a developer layer on the developer bearing member; and a driving device including at least one driving source, a forward rotation driving member rotated by the driving source to drive the developer bearing members to forwardly rotate to develop the latent images, and a reverse rotation driving member rotated by the driving source to drive the developer bearing members to reversely rotate when the developing operation is not performed, wherein the forward rotation driving member and the reverse rotation driving member can operate at the same time.

摘要翻译： 一种图像形成装置，包括承载潜像的图像承载部件; 显影单元，包括用显影剂显影潜像以形成视觉图像的多个显影装置，每个显影装置包括承载显影剂以显影潜像的显影剂承载构件，以及与显影剂承载构件接触以控制厚度的显影剂厚度控制构件 显影剂承载部件上的显影剂层; 以及驱动装置，其包括至少一个驱动源，由驱动源旋转的正向旋转驱动构件，以驱动显影剂承载构件向前旋转以显影潜像;以及由驱动源旋转的反向旋转驱动构件，以驱动 当不执行显影操作时，显影剂承载构件反向旋转，其中正向旋转驱动构件和反向旋转驱动构件可以同时操作。

公开(公告)号：US20050158917A1

公开(公告)日：2005-07-21

申请号：US11031267

申请日：2005-01-07

申请人： Noriyuki Kimura

发明人： Noriyuki Kimura

IPC分类号： H01L23/12 ,  H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention relates to a leadless, resin sealed semiconductor device structure and manufacturing method. In the semiconductor device according to the present invention, one side of a thin plate made of copper or the like is subjected to half etching, and a plurality of die pad portions (3) and bonding areas (2) are formed thereon. A semiconductor chip (4) is mounted on each of the die pad portions (3). Then, electrodes (5) on the respective semiconductor chips and the bonding areas (2) are electrically connected to each other, and a mounting side of the respective semiconductor chips (4) is sealed with a molding resin (7). After that, a conductive board side is gradually and evenly removed, and only the die pad portions (3) and the bonding areas (2) (external connecting electrodes) are exposed. Finally, dicing is conducted to obtain a separated semiconductor device as a final form.

摘要翻译： 本发明涉及一种无引线树脂密封半导体器件结构及其制造方法。 在根据本发明的半导体器件中，对由铜等制成的薄板的一侧进行半蚀刻，并且在其上形成多个芯片焊盘部分（3）和接合区域（2）。 半导体芯片（4）安装在每个芯片焊盘部分（3）上。 然后，各半导体芯片上的电极（5）和接合区域（2）彼此电连接，并且用模制树脂（7）密封各个半导体芯片（4）的安装侧。 之后，导电板侧被逐渐均匀地去除，只有裸片焊盘部分（3）和接合区域（2）（外部连接电极）露出。 最后，进行切割以获得作为最终形式的分离的半导体器件。

公开(公告)号：US06248444B1

公开(公告)日：2001-06-19

申请号：US09387172

申请日：1999-08-31

申请人： Tsutomu Kido ,  Noriyuki Kimura ,  Ichiro Takeuchi ,  Kazuya Umino

发明人： Tsutomu Kido ,  Noriyuki Kimura ,  Ichiro Takeuchi ,  Kazuya Umino

IPC分类号： D01F800

CPC分类号： D01F8/02 ,  D01F2/06 ,  D04H1/4258 ,  Y10T428/249921 ,  Y10T428/2924 ,  Y10T428/2929 ,  Y10T428/2965 ,  Y10T442/3146 ,  Y10T442/637 ,  Y10T442/638

摘要： A powdered super absorbent polymer (SAP) has heretofore been used as a water retentive material for sanitary products, such as sanitary napkin, disposable diaper and incontinence pad. This water retentive material is used by being held between two paper sheets but the powdered SAP comes off easily from absorbent member. Moreover, even when the SAP is in a dried powdered state or in a water-absorbed gel state, it is moved between a top sheet and a back sheet in accordance with the movement of a wearer of the sanitary product. Consequently, water absorbency decreases with poor shape stability. Moreover, since the SAP in a water-absorbed gel state is sticky, the wearer feels unpleasant. According to the present invention, therefore, a cellulose fiber, such as a viscose rayon fiber containing uniformly a non-cellulose based material of high water absorbency such as polyacrylate salt is manufactured. A fiber web and nonwoven fabric produced of this fiber is used as water retentive materials in an absorbent member. This fiber has high absorbency and moreover high water retentivity such that water absorbed into the fiber is hardly released from the fiber. Accordingly, an absorbent member formed of a sheet made of this fiber has a stable shape both when it is in a dry state and when it is in a water-absorbed state, and, moreover, it has high absorbency and high water retentivity. Therefore, when this water-retentive sheet is used, a thin absorbent member of high absorbency can be provided.

摘要翻译： 迄今为止，粉状高吸水性聚合物（SAP）已被用作诸如卫生巾，一次性尿布和失禁垫等卫生产品的保水性材料。 这种保水材料被保持在两个纸张之间，但粉状SAP容易从吸收部件脱落。 此外，即使当SAP处于干燥的粉末状态或吸水凝胶状态时，根据卫生产品的穿着者的移动，其在顶片和背片之间移动。 因此，吸水性随着形状稳定性的降低而降低。 此外，由于吸水凝胶状态的SAP是粘性的，所以佩戴者感觉到不愉快。因此，根据本发明，纤维素纤维，例如均匀地含有高吸水性的非纤维素基材料的粘胶人造丝纤维 如聚丙烯酸盐制造。 将由该纤维制成的纤维网和非织造织物用作吸湿件中的保水材料。 该纤维具有高的吸收性和高的保水性，使得吸收到纤维中的水难以从纤维中释放出来。 因此，由这种纤维制成的片材形成的吸收件在处于干燥状态时和处于吸水状态时都具有稳定的形状，而且具有高的吸收性和高的保水性。 因此，当使用该保水性片材时，可以提供高吸收性的薄吸收体。

公开(公告)号：US6046504A

公开(公告)日：2000-04-04

申请号：US24650

申请日：1998-02-17

申请人： Noriyuki Kimura

发明人： Noriyuki Kimura

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041

摘要： A semiconductor device of the present invention has an LOC (Lead On Chip) structure. An end portion of an inner lead made thinner than an outer lead by cutting its lower surface by a predetermined thickness and a bus bar thinned to have the same thickness as the end portion of the inner lead are bonded to the surface of a semiconductor chip on which circuits are formed, with a protective film and an insulating tape interposed therebetween. A bonding wire is bonded to the thin portion of the inner lead or the thin bus bar. The thickness from the upper surface of the semiconductor chip to the upper surface of the inner lead can be reduced by the cut portion. A thin package can be realized without deteriorating the reliability with the normal thickness of the outer lead, the insulating tape and an encapsulating resin and the normal loop height of the bonding wire.

摘要翻译： 本发明的半导体器件具有LOC（片上芯片）结构。 内引线的端部通过将其下表面切割预定厚度而制成比外引线更薄，并且减薄成具有与内引线的端部相同厚度的汇流条被接合到半导体芯片的表面上 这些电路形成有保护膜和插入其间的绝缘带。 接合线接合到内引线或薄母线的薄部分。 从半导体芯片的上表面到内引线的上表面的厚度可以通过切割部分减小。 可以实现薄封装，而不会劣化外引线，绝缘带和封装树脂的正常厚度和接合线的正常环高度的可靠性。

公开(公告)号：US5822298A

公开(公告)日：1998-10-13

申请号：US687235

申请日：1996-07-25

申请人： Tsuyoshi Matsumoto ,  Noriyuki Kimura ,  Kenji Taniguchi ,  Takashi Tai ,  Hiroaki Nagao ,  Masashi Hirome

发明人： Tsuyoshi Matsumoto ,  Noriyuki Kimura ,  Kenji Taniguchi ,  Takashi Tai ,  Hiroaki Nagao ,  Masashi Hirome

IPC分类号： H04J3/14 ,  H04L12/42

CPC分类号： H04L12/42

摘要： A ring transmission system includes nodes connected in a ring shape by transmission lines to communicate with each other. Each node includes a cell extracting unit which receives a cell from the transmission lines and separates a control field from the cell in accordance with a communication control procedure, the control field including a number of bits containing management data and a destination, the management data indicating information related to maintenance and operation of the ring transmission system. A separating unit separates, from the control field, one of management data for the node and management data for another node by comparing the destination with an identification of the node. A management data processing unit generates processed management data from the management data when the destination indicates the node. An intermediate unit generates a new cell containing the management data from the separating unit when the destination indicates the another node. The management data of the new cell is distinctly different from the processed management data. The intermediate unit transmits the new cell to the transmission lines.

摘要翻译： 环形传输系统包括通过传输线路连接成环形的节点以彼此通信的节点。 每个节点包括一个单元提取单元，该单元从传输线接收一个单元，并根据一个通信控制程序从该单元中分离一个控制区，该控制字段包含一些包含管理数据和一个目的地的位，该管理数据表示 与环形传输系统的维护和运行有关的信息。 分离单元通过将目的地与节点的标识进行比较，将与节点的管理数据和用于另一节点的管理数据之间的一个与控制字段分离。 当目的地指示节点时，管理数据处理单元从管理数据生成处理的管理数据。 当目的地指示另一节点时，中间单元生成包含来自分离单元的管理数据的新单元。 新单元的管理数据与处理的管理数据有明显的不同。 中间单元将新单元发送到传输线。