公开(公告)号：US20070053647A1

公开(公告)日：2007-03-08

申请号：US11511491

申请日：2006-08-29

申请人： Yasuyuki Hishida ,  Hisashi Sato ,  Akira Suzuki ,  Shigenori Kobayashi ,  Hiroyuki Takahashi

发明人： Yasuyuki Hishida ,  Hisashi Sato ,  Akira Suzuki ,  Shigenori Kobayashi ,  Hiroyuki Takahashi

IPC分类号： G02B6/00

CPC分类号： B60R21/0136 ,  B60R2021/01095

摘要： A collision detection sensor for detecting a collision of a vehicle and a collision object by converting the collision into a change in optical transmission characteristics of an optical fiber. The collision detection sensor has the optical fiber, a molding material formed on the periphery of the optical fiber, and a convex portion formed on the surface of the molding material.

摘要翻译： 一种碰撞检测传感器，用于通过将碰撞变换为光纤的光传输特性的变化来检测车辆和碰撞对象的碰撞。 碰撞检测传感器具有光纤，形成在光纤周边的成型材料和形成在成型材料的表面上的凸部。

公开(公告)号：US20070026639A1

公开(公告)日：2007-02-01

申请号：US11488890

申请日：2006-07-19

申请人： Takashi Noma ,  Hiroyuki Shinogi ,  Akira Suzuki ,  Yoshinori Seki ,  Koichi Kuhara ,  Yukihiro Takao ,  Hiroshi Yamada

发明人： Takashi Noma ,  Hiroyuki Shinogi ,  Akira Suzuki ,  Yoshinori Seki ,  Koichi Kuhara ,  Yukihiro Takao ,  Hiroshi Yamada

IPC分类号： H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/481 ,  H01L24/10 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A glass substrate is bonded through a resin to the top surface of a semiconductor wafer on which a first wiring is formed. A V-shaped groove is formed by notching from the back surface of the wafer. A second wiring connected with the first wiring and extending over the back surface of the wafer is formed. A protection film composed of an organic resin or a photoresist layer to provide protection with an opening is formed on the second wiring by spray coating. A conductive terminal is formed by screen printing using the protection film as a solder mask. A cushioning material may be formed on the back surface of the wafer by spray coating.

摘要翻译： 玻璃基板通过树脂粘合到其上形成有第一布线的半导体晶片的顶表面。 通过从晶片的背面开槽而形成V形槽。 形成与第一布线连接并在晶片的背面延伸的第二布线。 通过喷涂在第二布线上形成由有机树脂或光致抗蚀剂层组成的保护膜以提供开口的保护。 通过使用保护膜作为焊接掩模的丝网印刷形成导电端子。 可以通过喷涂在晶片的背面上形成缓冲材料。

公开(公告)号：US20070012019A1

公开(公告)日：2007-01-18

申请号：US10523407

申请日：2003-06-30

申请人： Akira Suzuki

发明人： Akira Suzuki

IPC分类号： D02G1/00

CPC分类号： D02G1/082

摘要： The false-twisting disk 5 a friction ring 8 with rubber elasticity on the outer periphery of the disk body 10, wherein a fitting recessed part such as a dovetail groove 7 is formed on the outer periphery of the disk body 10, and a fitting projection part such as a projected line 9 to be fitted in the dovetail groove 7 or the like is provided on the inner periphery of the friction ring 8, thereby, only the friction ring 8 mounted on the outer periphery of the disk body 10 can be replaced, and the friction ring 8 is prevented from falling off at high-speed rotation of the false-twisting disk 5.

摘要翻译： 假捻盘5在盘体10的外周具有橡胶弹性的摩擦环8，其中在盘体10的外周上形成有诸如燕尾槽7的嵌合凹部，配合突起 在摩擦环8的内周设置有诸如在燕尾槽7等中安装的突出线9的部分，从而只能更换安装在盘体10的外周上的摩擦环8 并且防止摩擦环8在假捻盘5的高速旋转时脱落。

公开(公告)号：US20070011241A1

公开(公告)日：2007-01-11

申请号：US11289730

申请日：2005-11-29

申请人： Shigehisa Kawabe ,  Setsu Kunitake ,  Akira Suzuki ,  Katsuhide Tanaka

发明人： Shigehisa Kawabe ,  Setsu Kunitake ,  Akira Suzuki ,  Katsuhide Tanaka

IPC分类号： G06F15/16

CPC分类号： G06F9/5072 ,  G06F9/544 ,  G06F2209/541 ,  H04L67/02 ,  H04L69/08

摘要： A cooperative processing system includes a first data processing component, existing on a first computer, that generates an output containing object having a function of outputting data contained therein to a stream, a pipeline section that causes the output containing object to output the data contained in the output containing object to a stream addressed to a second computer, and causes the second computer to generate an input containing object that receives the stream and stores data transferred through the stream, and a second data processing component, existing on the second computer, that receives the input containing object to perform a data process.

摘要翻译： 协作处理系统包括存在于第一计算机上的第一数据处理组件，其生成包含对象的输出，该对象具有将包含在其中的数据输出到流的功能;使流水线部分使得包含输出对象的输出包含在 所述输出将对象包含到寻址到第二计算机的流，并且使得所述第二计算机生成接收所述流并存储通过所述流传送的数据的输入包含对象，以及存在于所述第二计算机上的第二数据处理组件， 接收包含输入的对象以执行数据处理。

公开(公告)号：US07146852B2

公开(公告)日：2006-12-12

申请号：US10984999

申请日：2004-11-10

申请人： Akira Suzuki

发明人： Akira Suzuki

IPC分类号： E01C23/00

CPC分类号： B60C23/0416

摘要： Speed detecting sections 8 which detect the speeds of the respective wheels 2 at the hub sides of the axles 7 are provided, and by comparing the speeds of the respective wheels 2 detected by the speed detecting sections 8 for each two wheels 2 on each axle 7, the speed deflections of the axles 7 are calculated, and from comparison between the speed deflections, the axle 7 with the larger speed deflection between the axles 7 is judged as a pressure lowered tire existing axle. Between two wheels 2 on the pressure lowered tire existing axle, a tire 5 of the wheels 2 with the higher speed is judged as the pressure lowered tire.

摘要翻译： 提供了检测在车轴7的轮毂侧的相应车轮2的速度的速度检测部分8，并且通过比较由每个车轮7上的每个车轮2的速度检测部分8检测到的各个车轮2的速度 计算出车轴7的速度偏差，并且从速度偏差之间的比较来看，车轴7与轴7之间的较大的转速偏差被判断为轮胎现有轴的压力降低。 在降低轮胎现有轴的压力下的两个车轮2之间，将具有较高速度的车轮2的轮胎5判断为降压轮胎。

公开(公告)号：US20060276097A1

公开(公告)日：2006-12-07

申请号：US10565902

申请日：2004-11-18

申请人： Akira Suzuki ,  Tomoaki Kato ,  Kazuyoshi Torii ,  Akikazu Taido

发明人： Akira Suzuki ,  Tomoaki Kato ,  Kazuyoshi Torii ,  Akikazu Taido

IPC分类号： H01T13/20

CPC分类号： H01T21/02 ,  H01T13/20 ,  H01T13/39

摘要： There is provided a method for producing a spark plug in which welding strength between a noble metal tip and an electrode joined by laser welding can be restrained from becoming weak. A noble metal tip (90) to be joined to a center electrode (2) or ground electrode of a spark plug to form a spark discharge gap is resistance-welded to each electrode containing no noble metal and then laser-welded. In the noble metal tip (90) exposed under a severe environment involving spark discharge, a molten portion (80) formed in such a manner that a portion of the noble metal tip (90) and a portion of the electrode are melted by laser welding and a non-molten portion (95) on the noble metal tip (90) side are apt to be peeled from each other in a boundary surface (83) between the molten portion (80) and the non-molten portion (95). The noble metal content in the molten portion (80) however becomes higher because a flange portion is formed in a bottom portion by pressing force applied on the noble metal tip (90) at the time of resistance welding and then irradiated with a laser beam. Accordingly, peeling can be prevented from occurring in the boundary surface (83).

摘要翻译： 提供一种用于制造火花塞的方法，其中可以抑制贵金属电极头和通过激光焊接接合的电极之间的焊接强度变弱。 要连接到火花塞的中心电极（2）或接地电极以形成火花放电间隙的贵金属端头（90）被电阻焊接到不含贵金属的每个电极上，然后被激光焊接。 在涉及火花放电的恶劣环境下露出的贵金属电极头（90）中，以使得贵金属电极头（90）的一部分和电极的一部分通过激光焊接而熔化的方式形成的熔融部（80） 并且在熔融部分（80）和非熔融部分（95）之间的边界表面（83）中，在贵金属端头（90）侧上的非熔融部分（95）易于彼此剥离。 然而，熔融部分（80）中的贵金属含量变高，因为通过在电阻焊接时施加在贵金属电极头（90）上的压力而在底部形成凸缘部分，然后用激光束照射。 因此，能够防止在边界面（83）发生剥离。

公开(公告)号：US20060250050A1

公开(公告)日：2006-11-09

申请号：US11397952

申请日：2006-04-04

申请人： Tomohisa Azuma ,  Masakazu Hirose ,  Akira Suzuki ,  Kouji Taniwaki

发明人： Tomohisa Azuma ,  Masakazu Hirose ,  Akira Suzuki ,  Kouji Taniwaki

IPC分类号： H01L41/187

CPC分类号： H03H3/02 ,  H03H9/02031 ,  H03H9/1014 ,  H03H9/1035 ,  H03H9/177

摘要： There is provided a resonator having a piezoelectric ceramic resonator which has excellent free-fall resistance. The resonator comprises a piezoelectric ceramic resonator 2 with a vibrating electrode formed, and a substrate 3 which supports the piezoelectric ceramic resonator 2, wherein the piezoelectric ceramic resonator 2 satisfies the condition of U≧0.88×H+20.28, wherein U=maximum elastic energy (kJ/m3) per unit volume, and H=drop height (m) (H>1). The present invention can be applied to a resonator 1, wherein the substrate 3 has terminal electrodes 31, 32, and the piezoelectric ceramic resonator 2 is in electrical continuity with the vibrating electrode and is supported on the substrate 3 at both ends via a conductive stator 4.

摘要翻译： 提供了具有优异的自由落体电阻的压电陶瓷谐振器的谐振器。 谐振器包括：形成有振动电极的压电陶瓷谐振器2和支撑压电陶瓷谐振器2的基板3，其中压电陶瓷谐振器2满足U> = 0.88×H + 20.28的条件，其中U =最大弹性能 （kJ / m 3）/ H =滴高（m）（H> 1）。 本发明可以应用于谐振器1，其中基片3具有端子电极31,32，并且压电陶瓷谐振器2与振动电极电连通，并且通过导电定子在两端支撑在基板3上 4。

公开(公告)号：US20060202348A1

公开(公告)日：2006-09-14

申请号：US11362503

申请日：2006-02-27

申请人： Kojiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto

发明人： Kojiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L24/11 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a pad electrode formed on a semiconductor substrate through a first insulation layer, and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein the via hole includes a first opening of which a diameter in a portion close to the pad electrode is larger than a diameter in a portion close to the back surface of the semiconductor substrate, and a second opening formed in the first insulation layer and continuing from the first opening, of which a diameter in a portion close to the pad electrode is smaller than a diameter in a portion close to the front surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括通过第一绝缘层形成在半导体衬底上的焊盘电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中通孔包括 第一开口部，其靠近焊盘电极的部分的直径大于靠近半导体基板的背面的部分的直径;以及第二开口，形成在第一绝缘层中并与第一开口连续， 其中靠近焊盘电极的部分的直径小于靠近半导体衬底的前表面的部分的直径。

公开(公告)号：US07102238B2

公开(公告)日：2006-09-05

申请号：US10828556

申请日：2004-04-21

申请人： Takashi Noma ,  Akira Suzuki ,  Hiroyuki Shinogi

发明人： Takashi Noma ,  Akira Suzuki ,  Hiroyuki Shinogi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/02 ,  H01L21/76898 ,  H01L23/3114 ,  H01L25/0657 ,  H01L27/14806 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded to the surface of the semiconductor chip on which the first wiring and the second wiring are formed. A third wiring is disposed on a back surface and a side surface of the semiconductor chip through an insulation film and connected to the first wiring. And a conductive terminal of another semiconductor device is connected to the second wiring through the opening.

摘要翻译： 在不使用昂贵的设备的情况下，以低成本制造堆叠MCM。 通过绝缘膜在第一半导体器件的半导体芯片的表面上形成第一布线和第二布线。 具有露出第二布线的开口的玻璃基板被接合到形成有第一布线和第二布线的半导体芯片的表面上。 第三布线通过绝缘膜设置在半导体芯片的背面和侧面上并连接到第一布线。 并且另一半导体器件的导电端子通过开口连接到第二布线。

公开(公告)号：US07087010B2

公开(公告)日：2006-08-08

申请号：US10017743

申请日：2001-12-14

申请人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

发明人： Takashi Ootawara ,  Akira Suzuki ,  Hiroaki Kubokawa ,  Hidenobu Kimura ,  Osamu Tamada ,  Mamoru Nakada ,  Masayuki Iwasaka

IPC分类号： A61B1/00

CPC分类号： A61B1/00098 ,  A61B1/0052 ,  A61B1/01 ,  A61B2017/22038 ,  A61B2017/22045

摘要： Guide wire fixing means is provided for an insertion portion of an endoscope, and a guide wire is releasably engaged when inserting/removing a therapeutic instrument running on the guide wire with a distal end portion of the guide wire inserted into a therapeutic instrument insertion channel of the endoscope being led out from a distal end opening portion of the channel.