公开(公告)号：US20090127518A1

公开(公告)日：2009-05-21

申请号：US12067996

申请日：2006-09-29

Applicant: Toyoji Nagano ,  Kinji Oono ,  Shoko Kuwajima

Inventor： Toyoji Nagano ,  Kinji Oono ,  Shoko Kuwajima

IPC: H01B1/02

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/0272

Abstract: Electrically conductive powder includes polyhedral large particles and flakey small particles. The aspect ratio of the small particles is not less than 3 and is at least 1.3 times greater than that of the large particles. The electrically conductive powder is surface treated with a fatty acid. The electrically conductive powder has good contact among the polyhedral large particles and the flakey small particles. An electrically conductive paste of the electrically conductive powder achieves excellent electrical and thermal conductivities because the particles are in contact not at points but through surfaces. The electrically conductive paste is capable of filling via-holes in a satisfactory manner.

Abstract translation: 导电粉末包括多面体大颗粒和片状小颗粒。 小颗粒的长宽比不小于3，比大颗粒的长宽比大至少1.3倍。 导电粉末用脂肪酸进行表面处理。 导电粉末在多面体大颗粒和片状小颗粒之间具有良好的接触。 导电粉末的导电糊料实现了优异的导电性和导热性，因为颗粒不是接触点而是通过表面接触。 导电浆料能以令人满意的方式填充通孔。

公开(公告)号：US20090011201A1

公开(公告)日：2009-01-08

申请号：US12161848

申请日：2007-01-23

Applicant: Hatsuo Ikeda ,  Koji Ichikawa

Inventor： Hatsuo Ikeda ,  Koji Ichikawa

IPC: B32B5/16 ,  B32B37/00

CPC classification number: H05K1/092 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0272 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347 ,  Y10T428/24893 ,  Y10T428/24909

Abstract: A conductive paste comprising 88-94% by mass of Ag powder having an average particle size of 3 μm or less and 0.1-3% by mass of Pd powder, the total amount of the Ag powder and the Pd powder being 88.1-95% by mass. A multilayer ceramic substrate obtained by laminating and sintering pluralities of ceramic green sheets, and having conductor patterns and via-conductors inside, the via-conductors being formed in via-holes having diameters of 150 μm or less after sintering, containing Ag crystal particles having a particle size of 25 μm or more, and having a porosity of 10% or less.

Abstract translation: 一种包含平均粒径为3μm以下的Ag粉末88〜94质量％，Pd粉末为0.1〜3质量％的导电性糊剂，Ag粉末和Pd粉末的总量为88.1〜95质量％ 的质量。 一种多层陶瓷基板，其通过在多个陶瓷生片层叠并烧结多个陶瓷生片，并且在其内部具有导体图案和通孔导体，所述通孔导体形成在烧结后的直径为150μm以下的通孔中，所述通孔导体含有具有 粒径为25μm以上，孔隙率为10％以下。

公开(公告)号：US20080207814A1

公开(公告)日：2008-08-28

申请号：US12071280

申请日：2008-02-19

Applicant: Matthew Wrosch ,  Miguel Albert Capote ,  Janet Fox ,  Alan Grieve

Inventor： Matthew Wrosch ,  Miguel Albert Capote ,  Janet Fox ,  Alan Grieve

IPC: C08K3/08 ,  B32B15/02 ,  B23K35/363

CPC classification number: C08F220/26 ,  C08F222/1006 ,  C08K3/08 ,  C08L63/00 ,  C09J4/00 ,  C09J9/00 ,  C09J11/04 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31529

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract translation: 导热粘合剂组合物包括高熔点金属或金属合金的粉末，低熔点金属或金属合金的粉末，以及具有聚环氧化物聚合物树脂和低熔点固体或液体的可聚合助熔聚合物基质组合物 酸酐和聚合物稀释剂或具有碳碳双键和/或官能羟基的稀释剂。 低熔点粉末与高熔点粉末的重量比为约0.50至约0.80，并且可以为约0.64至约0.75，并且可为0.665。 迄今为止，已经发现使用这些低熔点粉末与高熔点粉末的比例，实质上更高的导热性能改善。

公开(公告)号：US20060292721A1

公开(公告)日：2006-12-28

申请号：US11315153

申请日：2005-12-23

Applicant: Geo Chae ,  Mi Park

Inventor： Geo Chae ,  Mi Park

IPC: H01L21/00 ,  H01L21/4763

CPC classification number: H05K3/101 ,  H01L21/288 ,  H01L21/76838 ,  H01L27/1292 ,  H05K3/04 ,  H05K3/102 ,  H05K2201/0257 ,  H05K2201/0272 ,  H05K2203/0108 ,  Y10S977/777

Abstract: A fabricating method of a flat panel display device can reduce manufacturing costs of the flat panel display device. A fabricating method of a flat panel display device includes providing a conductive nanopowder thin film material having a first conductive nanopowder and a second conductive nanopowder, spreading the conductive nanopowder thin film material over a substrate, forming a conductive thin film pattern by patterning the conductive nanopowder thin film material, and forming a conductive thin film by baking the conductive thin film pattern, wherein the first conductive nanopowder is located in a middle of the conductive thin film and the second conductive nanopowder is located in an outer part of the conductive thin film.

Abstract translation: 平板显示装置的制造方法可以降低平板显示装置的制造成本。 平板显示装置的制造方法包括提供具有第一导电纳米粉末和第二导电纳米粉末的导电纳米粉末薄膜材料，将导电纳米粉末薄膜材料铺展在基板上，通过图案化导电纳米粉末形成导电薄膜图案 薄膜材料，并通过烘烤导电薄膜图案形成导电薄膜，其中第一导电纳米粉末位于导电薄膜的中间，第二导电纳米粉末位于导电薄膜的外部。

公开(公告)号：US20040217152A1

公开(公告)日：2004-11-04

申请号：US10854640

申请日：2004-05-27

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Toshihiko Taguchi ,  Satoru Akita ,  Masato Shimamura ,  Ryoichi Suzuki ,  Tetsuya Okuno

IPC: B23K031/02

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/42 ,  H05K2201/0272

Abstract: A lead-free solder paste suitable for reflow soldering includes a plurality of different types of metal powder mixed with a flux. One of the metal powders is a Sn alloy powder. Another of the metal powders is selected from a Sn alloy powder, elemental Ag powder, elemental Cu powder, and elemental Sn powder. Each Sn alloy powder includes 0-8 mass % of Ag, 0-5 mass % of Cu, and at least 80 mass % of Sn. The plurality of metal powders have a composition when melted of 1-5 mass % Ag, 0.5-3 mass % Cu, and a remainder of Sn.

Abstract translation: 适用于回流焊接的无铅焊膏包括与焊剂混合的多种不同类型的金属粉末。 其中一种金属粉末是Sn合金粉末。 另一种金属粉末选自Sn合金粉末，元素Ag粉末，元素Cu粉末和元素Sn粉末。 每个Sn合金粉末包括0-8质量％的Ag，0-5质量％的Cu和至少80质量％的Sn。 多个金属粉末当熔融为1-5质量％的Ag，0.5-3质量％的Cu和余量的Sn时具有组成。

公开(公告)号：US20030178476A1

公开(公告)日：2003-09-25

申请号：US10390672

申请日：2003-03-19

Inventor： Kazuhisa Kanai ,  Makoto Takeuchi

IPC: B23K031/02

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H01L2924/00014

Abstract: A solder paste includes a first solder powder having an alloy of at least Sn and Zn and a second solder powder having a solidus temperature lower than an eutectic or a solidus temperature of the first solder powder, the first and the second solder powders being mixed into flux. The first solder powder may include an alloy of Sn-aZn-ba (5nullanull12, 0nullbnull5) in which null is Bi or In. The second solder powder may include an alloy of Sn-cBi-dAg-enull, Sn-cBi-dZn-enull or Sn-cBi-fIn-enull (1nullcnull57, 0nulldnull5, 0nullenull5 and 0nullfnull52) in which null is Bi or In, and nullanull, nullbnull, nullcnull, nulldnull and nullenull indicate weight by percent, a mixture ratio of the first to the second solder powder being A:1 (1.5nullAnull10).

Abstract translation: 焊膏包括具有至少Sn和Zn的合金的第一焊料粉末和具有低于第一焊料粉末的共晶或固相线温度的固相线温度的第二焊料粉末，将第一和第二焊料粉末混合 助焊剂 第一焊料粉末可以包括Sn-aZn-ba（5≤a≤12,0≤b≤5）的合金，其中α是Bi或In。 第二焊料粉末可以包括Sn-cBi-dAg-ealpha，Sn-cBi-dZn-ebeta或Sn-cBi-fIn-eα（1≤c≤5,0.0≤d≤5,0）的合金 其中，α为Bi或In，“a”，“b”，“c”，“d”和“e”表示重量百分比，混合物 第一和第二焊料粉末的比例为A：1（1.5 <= A <= 10）。

公开(公告)号：US20030038280A1

公开(公告)日：2003-02-27

申请号：US10223907

申请日：2002-08-20

Inventor： Hiroki Kojo ,  Hisashi Matsuno

IPC: H01C001/00 ,  H01B001/02

CPC classification number: H05K3/4069 ,  H01B1/22 ,  H05K1/095 ,  H05K3/4614 ,  H05K2201/0272 ,  H05K2203/1189

Abstract: The invention is directed to a thermosetting electroconductive paste for forming electroconductive bumps at predetermined locations on at least one circuit layer that is laminated to an insulating layer. Upon lamination the electroconductive bumps penetrate the insulating layer forming an electrical connection to a second circuit layer. The paste comprises, based on total composition, 80 to 90 wt % electroconductive powders comprising at least a first and second electroconductive metal powder of which packing densities are in the range of 20% or less of the average density (sp. gr.) of metal for the first powder and 20 to 40% of the average density (sp. gr.) of metal for the second powder; and 10 to 20 wt % epoxy resin, curing agent, and solvent.

Abstract translation: 本发明涉及一种热固性导电浆料，用于在至少一层层压到绝缘层上的电路层上的预定位置处形成导电凸块。 在层叠时，导电凸块穿透绝缘层，形成与第二电路层的电连接。 基于总组合，糊状物包含至少包含第一和第二导电金属粉末的80至90重量％的导电粉末，其中填充密度在平均密度（sp。gr。）的20％或更小的范围内 用于第一粉末的金属和用于第二粉末的金属的平均密度（sp。gr。）的20至40％; 和10〜20重量％的环氧树脂，固化剂和溶剂。

公开(公告)号：US06524721B2

公开(公告)日：2003-02-25

申请号：US09898721

申请日：2001-07-03

Applicant: Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC: H01L2314

CPC classification number: H01B1/22 ,  C09J9/02 ,  H01L2924/181 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0272 ,  H05K2201/0769 ,  Y10T428/12069 ,  Y10T428/1209 ,  Y10T428/12111 ,  Y10T428/12139 ,  Y10T428/12528 ,  Y10T428/25 ,  H01L2924/00012

Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

公开(公告)号：US20020158232A1

公开(公告)日：2002-10-31

申请号：US10030235

申请日：2002-03-26

Inventor： Tsutomu Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H05K3/321 ,  C09J9/02 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/0307 ,  Y02P70/611 ,  Y10T428/2982

Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

Abstract translation: 导电粘合剂包括导电填料和粘合剂树脂的主要组分，并且导电填料的含量在20重量％至70重量％的范围内。 导电填料的至少一部分优选具有突起。 特别优选枝晶金属填料。 当该粘合剂被压缩时，树脂组分被挤出，而导电填料组分保留在内部。 结果，导电填料组分的浓度升高到内部，并且这通过划伤电极的表面来连接电极是有用的。 在电路基板1的基板电极2上形成导电性粘合剂3也不需要焊料，也不需要用于包装电子元件4.还提供使用导电粘合剂的电子元件的封装，其具有改善的初始和长期可靠性 ，以及包装该方法。

公开(公告)号：US20020043652A1

公开(公告)日：2002-04-18

申请号：US09898721

申请日：2001-07-03

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani ,  Tousaku Nishiyama

IPC: H01B001/00 ,  H01B001/02

CPC classification number: H01B1/22 ,  C09J9/02 ,  H01L2924/181 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0272 ,  H05K2201/0769 ,  Y10T428/12069 ,  Y10T428/1209 ,  Y10T428/12111 ,  Y10T428/12139 ,  Y10T428/12528 ,  Y10T428/25 ,  H01L2924/00012

Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

Abstract translation: 本发明提供即使在使用多功能贱金属电极的情况下也能够保持防潮可靠性的导电性粘合剂和包装结构。 根据本发明的导电粘合剂包括具有等于或高于银的标准电极电位的标准电极电位的第一颗粒和具有低于银的标准电极电位的标准电极电位的第二颗粒。 可以在具有比金属颗粒的电位低的电极的表面上形成具有比作为第一颗粒的金属颗粒高的电位的金属化合物涂层。