METHOD AND SYSTEM FOR METAL-COATING

    公开(公告)号:US20210069829A1

    公开(公告)日:2021-03-11

    申请号:US17014896

    申请日:2020-09-08

    Abstract: The invention relates to a method and to a system for metal-coating at least one surface of a workpiece, in which before coating, a surface structure with peaks and troughs in the surface to be coated is detected by means of a measuring apparatus, the coating is carried out by means of at least one deposition apparatus, which is moved relative to the surface and applies coating material in the process, and the deposition apparatus is controlled by a control apparatus on the basis of the detected surface structure, wherein more material is applied in the region of troughs and less material is applied in the region of peaks.

    Wear Resistant Insert
    72.
    发明申请

    公开(公告)号:US20200378195A1

    公开(公告)日:2020-12-03

    申请号:US16960500

    申请日:2018-02-27

    Abstract: A wear resistant insert including a deposition substrate having an exterior surface, and a wear resistant layer deposited on the exterior surface of the deposition substrate. The wear resistant insert may further include a structure interface layer deposited on an exterior surface of the wear resistant layer. A method of forming a wear resistant insert including providing a deposition substrate having an exterior surface, and depositing a wear resistant layer on the exterior surface of the deposition substrate. The method may further include depositing a structure interface layer on an exterior surface of the wear resistant layer. The method may further include separating the wear resistant layer from the deposition substrate intact.

    Smart device fabrication via precision patterning

    公开(公告)号:US10818481B2

    公开(公告)日:2020-10-27

    申请号:US15215382

    申请日:2016-07-20

    Abstract: Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.

    COMPONENT PROTECTED BY AN ENVIRONMENTAL BARRIER

    公开(公告)号:US20200331817A1

    公开(公告)日:2020-10-22

    申请号:US16753588

    申请日:2018-10-03

    Applicant: SAFRAN

    Abstract: A component includes a substrate at least a portion of which adjacent to a surface of the substrate is made of a material including silicon; a bond coat located on the surface of the substrate and including silicon, an environmental barrier which includes an outer layer of ceramic material covering the bond coat, wherein the environmental barrier further includes a self-healing inner layer located between the bond coat and the outer layer, the inner layer including a matrix in which silico-forming particles are dispersed, these particles being capable of generating a matrix crack healing phase in the presence of oxygen.

    METHOD FOR REPAIRING MONOCRYSTALLINE MATERIALS

    公开(公告)号:US20200216942A1

    公开(公告)日:2020-07-09

    申请号:US16649994

    申请日:2018-10-04

    Abstract: A method for coating, with a coating material, a monocrystalline substrate surface of a component comprising a monocrystalline alloy includes polishing the monocrystalline substrate surface, transferring the substrate to a vacuum chamber, and heating the entire substrate to a temperature of at least half a melting temperature of the substrate but less than a melting temperature of the substrate. The method further includes applying the coating material in powder form onto the polished monocrystalline substrate surface by vacuum plasma spraying. The powder has a mean particle size in a range of 10 to 200 μm. A pressure in a range of 1 to 200 mbar is set for the vacuum plasma spraying, and an argon atmosphere having a hydrogen content in a range of 10 to 50 vol. % is used as a working gas for the vacuum plasma spraying.

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