Smart device fabrication via precision patterning

    公开(公告)号:US10818481B2

    公开(公告)日:2020-10-27

    申请号:US15215382

    申请日:2016-07-20

    Abstract: Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.

    PLASMA SPRAY COATING ENHANCEMENT USING GRADUATED PARTICLE FEED RATE

    公开(公告)号:US20190157047A1

    公开(公告)日:2019-05-23

    申请号:US16192610

    申请日:2018-11-15

    Abstract: A method for forming a ceramic coating on an article includes placing the article into a chamber or spray cell of a plasma spraying system. A first ceramic powder is then fed into the plasma spraying system at a first powder feed rate, and a first layer of a plasma resistant ceramic coating is deposited onto at least one surface of the article in a plasma spray process by the plasma spray system. The powder feed rate is adjusted to a second powder feed rate, and a second layer of the plasma resistant ceramic coating is deposited onto the at least one surface of the article in the plasma spray process by the plasma spray system.

    Smart device fabrication via precision patterning
    3.
    发明授权
    Smart device fabrication via precision patterning 有权
    智能设备制造通过精密图案化

    公开(公告)号:US09420639B2

    公开(公告)日:2016-08-16

    申请号:US14077043

    申请日:2013-11-11

    Abstract: Embodiments involve smart device fabrication for semiconductor processing tools via precision patterning. In one embodiment, a method of manufacturing a semiconductor processing tool component includes providing a substrate of the semiconductor processing tool component, patterning the substrate to form a sensor directly on the substrate, and depositing a top layer over the sensor. The sensor may include, for example, a temperature or strain sensor. The method can also include patterning the substrate to form one or more of: heaters, thermistors, and electrodes on the substrate. In one embodiment, the method involves patterning a surface of the component oriented towards a plasma region inside of the semiconductor processing tool.

    Abstract translation: 实施例涉及通过精密图案化的半导体加工工具的智能装置制造。 在一个实施例中,制造半导体处理工具部件的方法包括提供半导体加工工具部件的基板,图案化基板以在基板上直接形成传感器,以及在传感器上沉积顶层。 传感器可以包括例如温度或应变传感器。 该方法还可以包括图案化衬底以形成衬底上的一个或多个:加热器,热敏电阻和电极。 在一个实施例中,该方法包括图案化部件的表面朝向半导体处理工具内部的等离子体区域。

    Plasma spray coating design using phase and stress control

    公开(公告)号:US10604831B2

    公开(公告)日:2020-03-31

    申请号:US16231139

    申请日:2018-12-21

    Abstract: A ceramic coating is coated on a body of an article, wherein the ceramic coating includes Y2O3, Y4Al2O9, Y3Al5O12, or a solid-solution of Y2O3 mixed with at least one of ZrO2, Al2O3, HfO2, Er2O3, Nd2O3, Nb2O5, CeO2, Sm2O3 or Yb2O3. The ceramic coating is applied to the body by a method including providing a plasma spraying system having a plasma current in the range of between about 100 A to about 1000 A, positioning a torch standoff of the plasma spraying system a distance from the body between about 60 mm and about 250 mm, flowing a first gas through the plasma spraying system at a rate of between about 30 L/min and about 400 L/min, and plasma spray coating the body to form a ceramic coating, wherein splats of the coating are amorphous and have a pancake shape.

Patent Agency Ranking