公开(公告)号：US12019096B2

公开(公告)日：2024-06-25

申请号：US17225462

申请日：2021-04-08

申请人： Infineon Technologies AG

发明人： Stefano Di Martino ,  Thomas Thurner

IPC分类号： G01R1/067 ,  G01R31/28

CPC分类号： G01R1/06738 ,  G01R1/0675 ,  G01R31/2891

摘要： A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.

公开(公告)号：US20240201246A1

公开(公告)日：2024-06-20

申请号：US18554657

申请日：2022-03-21

申请人： Endress+Hauser SE+Co. KG

发明人： Stefan Müller ,  Dirk Dohse ,  Manfred Hammer

IPC分类号： G01R31/28 ,  G01R35/00

CPC分类号： G01R31/2829 ,  G01R31/2839 ,  G01R35/00

摘要： A method for checking a signal path of a sensor circuit for a field device, wherein the signal path includes a transducer for outputting analog raw measured values, an analog-digital converter to convert the analog raw measured values into digital raw measured values, and a digital processor designed to further process the digital raw measured values, includes: interrupting the measuring mode; replacing the analog raw measured values at an output of the transducer by an analog check signal; passing the analog check signal through the signal path so that the digital processor determines a measured value corresponding to the analog check signal; checking the determined measured value with a comparison value determined for the signal path; and, if the measured value determined for the analog check signal is outside a defined tolerance range for the comparison value, identifying a change in the state of the signal path.

公开(公告)号：US12013433B2

公开(公告)日：2024-06-18

申请号：US17799698

申请日：2021-02-09

申请人： KYOCERA Corporation

发明人： Daisuke Jingu ,  Hidenori Tanaka

IPC分类号： G01R31/28 ,  G01R1/073 ,  H05B1/02 ,  H05B3/03 ,  H05B3/18 ,  H05B3/28

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2889 ,  H05B1/0233 ,  H05B3/03 ,  H05B3/18 ,  H05B3/283 ,  H05B2203/002 ,  H05B2203/017 ,  H05B2203/035

摘要： A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.

公开(公告)号：US12013416B2

公开(公告)日：2024-06-18

申请号：US17598918

申请日：2020-03-12

申请人： NIDEC READ CORPORATION

发明人： Michio Kaida ,  Norihiro Ota ,  Yusuke Yokota

IPC分类号： G01R1/073 ,  G01R31/28

CPC分类号： G01R1/07342 ,  G01R31/2818

摘要： In a contact terminal, the first insertion portion includes a first contact portion having a first flat surface along an axial direction, the second insertion portion includes a second contact portion having a second flat surface along the axial direction, the first flat surface and the second flat surface are in contact with each other, the tubular body includes at least one of a first end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body and a second end side notch provided along the axial direction on a peripheral surface of the other end portion in the axial direction of the tubular body.

公开(公告)号：US20240192270A1

公开(公告)日：2024-06-13

申请号：US18585589

申请日：2024-02-23

申请人： TeraView Limited

发明人： Brian Edward Cole ,  Darius Sullivan ,  Simon Chandler

IPC分类号： G01R31/28 ,  G01R31/308 ,  G01R35/00

CPC分类号： G01R31/2887 ,  G01R31/308 ,  G01R35/005

摘要： A test system for testing a device having a plurality of electrical contacts. The test system comprising: a device table operable to hold at least one device under test, a probe comprising at least one probe end for contacting electrical contacts of a device under test, a movement mechanism operable to move one or both of the device table and the probe so as to bring the at least one probe end into contact with at least one electrical contact of a device under test, and a profile determining system configured to determine a profile of the electrical contacts of a device under test.

公开(公告)号：US20240192269A1

公开(公告)日：2024-06-13

申请号：US18463558

申请日：2023-09-08

申请人： Kioxia Corporation

发明人： Taisuke ICHIKAWA

IPC分类号： G01R31/28

CPC分类号： G01R31/2875

摘要： According to one embodiment, a test substrate of a semiconductor integrated circuit includes: a substrate connected between a burn-in apparatus and a burn-in board on which a semiconductor integrated circuit which is a device under test is mounted, and a test circuit disposed on the substrate and configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board.

公开(公告)号：US20240192266A1

公开(公告)日：2024-06-13

申请号：US18079871

申请日：2022-12-12

申请人： Swaresh Borse

发明人： Swaresh Borse

IPC分类号： G01R31/28

CPC分类号： G01R31/2848

摘要： The present invention is an electrical device which can be used to design and test electronic circuits with close to null manual intervention. It consists of plurality of reed relays to establish electrical contact between two given points in a connector matrix which is also part of the tool. User can make and break these electrical connections by application software controlling the reed relays. This application is required to be installed on a computer which aids user interaction with the tool. A micro-controller, equipped with firmware, is used to manage interface between the reed relays and the application software. Additionally, an analog to digital converter chip is implemented to measure voltage between two points in a user circuit under test.

公开(公告)号：US12007414B2

公开(公告)日：2024-06-11

申请号：US17456682

申请日：2021-11-29

申请人： Mitsubishi Electric Corporation

发明人： Yoshiyuki Ueda ,  Takaya Noguchi

IPC分类号： G01R1/073 ,  G01R1/04 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/66

CPC分类号： G01R1/07342 ,  G01R31/2601 ,  G01R31/2886 ,  H01L22/30

摘要： A semiconductor test apparatus includes a chuck top on which a semiconductor wafer is mounted, and contact probes that contact measurement points of semiconductor chips formed on the semiconductor wafer, the chuck top includes a conductor that contacts a lower surface of the semiconductor wafer, a mounting table arranged below the conductor, and a first vacuum tube and a second vacuum tube connected to the mounting table, the conductor has a plurality of suction holes that are arranged in a spiral form in top view, in the mounting table, a flow pass communicating with the plurality of suction holes and having a spiral form in top view, the first vacuum tube is connected to an inner circumference portion of the flow pass, and the second vacuum tube is connected to an outer circumference portion of the flow pass.

公开(公告)号：US12004288B2

公开(公告)日：2024-06-04

申请号：US17184793

申请日：2021-02-25

申请人： Teradyne, Inc.

发明人： Andrew Westwood

IPC分类号： G01R31/00 ,  G01R1/04 ,  G01R31/28 ,  H01P3/08 ,  H05K1/02

CPC分类号： H05K1/0222 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R31/2886 ,  H01P3/08 ,  H05K1/0251 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K2201/09609 ,  H05K2201/09754 ,  H05K2201/09809

摘要： An example printed circuit board (PCB) includes a substrate having layers of a dielectric material, where the layers of dielectric material include a first layer and a second layer; a conductive trace that is between the first layer and the second layer and that is parallel to the first layer and the second layer along at least part of a length of the conductive trace; and a conductive via that extends at least part-way through the layers of dielectric material and that connects electrically to the conductive trace, where the conductive via is configured also to connect electrically to a signal input to receive or to transmit a signal that has a center frequency span.

公开(公告)号：US12000886B2

公开(公告)日：2024-06-04

申请号：US15830046

申请日：2017-12-04

申请人： Aktiebolaget SKF

发明人： Julian Franchitti

IPC分类号： G01R31/28 ,  G01R29/22 ,  H01L21/66

CPC分类号： G01R31/2884 ,  G01R29/22 ,  H01L22/34

摘要： Examples provide for a self-test circuit. The self-test circuit comprises input circuitry; testing circuitry; and a circuit to be tested, coupled between the input and testing circuitry and comprising at least a piezoelectric crystal. The input circuitry is configured to generate and transfer a predefined electric signal comprising at least a sinusoidal signal through at least the piezoelectric crystal of the circuit to be tested to generate an output signal. The testing circuitry is configured to analyze the output signal.