Provenance based identification of policy deviations in cloud computing environments

    公开(公告)号:US11553005B1

    公开(公告)日:2023-01-10

    申请号:US17351737

    申请日:2021-06-18

    申请人: Kyndryl, Inc.

    IPC分类号: G06F15/173 H04L9/40 H04L67/10

    摘要: Policy deviations for distributed computing environments are detected and recorded an immutable ledger of transaction provenance from end to end transactions performed in the distributed computing environment. From the immutable ledger, persona data for transaction types is plotted as an bipartite graph. Edge weights of the bipartite graphs are correlated to trust levels between personas from the persona data and the transaction types from the immutable ledger. Trust levels from the edge weights are correlated to rules illustrating when the transaction provenance indicate a policy deviation in the distributed computing environment. The rules are then employed to detect in real time end to end provenance when a policy deviation in the distributed computing environment is occurring. An alert of policy deviations may be sent to stakeholders for the distributed computing environment.

    Power varying pedal
    82.
    发明授权

    公开(公告)号:US11547539B2

    公开(公告)日:2023-01-10

    申请号:US16590799

    申请日:2019-10-02

    申请人: Steven Gagliano

    发明人: Steven Gagliano

    摘要: A system and method for providing variable power is disclosed. The system includes a power supply which provides power to at least one instrument. A pedal comprises a variable resistor that is configured to produce a resistance value within a predetermined range based on an amount of pressure which is being applied to the pedal. The voltage being supplied to the instrument is varied in accordance with the resistance value produced at the pedal.

    Downlight having quick connect driver assembly and test module

    公开(公告)号:US11530806B2

    公开(公告)日:2022-12-20

    申请号:US17572698

    申请日:2022-01-11

    申请人: LEDVANCE LLC

    摘要: A lighting test method that includes connecting a housing including driver electronics and a junction box to a main power source. The main power source is connected to a main power connector in the junction box. The driver electronics includes a first terminal. The method further includes connecting a power testing module to the first terminal to the driver electronics to determine whether the main power source is correctly connected to the main power connector in the junction box. The method further includes replacing the power testing module with a second terminal of a light engine housing. Connecting the first and second terminals provides that the driver electronics are in electrical communication with a light engine within the light engine housing.

    Pipe support structure
    89.
    发明授权

    公开(公告)号:US11506309B2

    公开(公告)日:2022-11-22

    申请号:US17371844

    申请日:2021-07-09

    摘要: A pipe support assembly including a pipe support shell body and at least one standing saddle element. The pipe support shell body includes a substantially semi-cylindrical wall portion having a length which is greater than a width thereof, and have longitudinal rims; and outwardly extending flanges formed at each of the longitudinal rims of the semi-cylindrical wall, wherein the flanges are provided with through holes distributed over the length thereof. The at least one standing saddle element includes an anchoring portion adapted to be anchored to a support structure and a saddle portion to receive the convex side of the semi-cylindrical wall of the pipe support shell, the saddle portion including snap members at its rims to snap around the flanges of the pipe support shell body.

    Embedded memory devices
    90.
    发明授权

    公开(公告)号:US11502242B2

    公开(公告)日:2022-11-15

    申请号:US16828489

    申请日:2020-03-24

    摘要: A semiconductor device includes a base structure of an embedded memory device including a bottom electrode contact (BEC) landing pad within a memory area of the embedded memory device and a first metallization level having at least a first conductive line within a logic area of the embedded memory device, a cap layer disposed on the base structure, a BEC disposed through the cap layer on the BEC landing pad, a memory pillar disposed on the BEC and the cap layer, encapsulation layers encapsulating the memory pillar to protect the memory stack, and a second metallization level including a second conductive line surrounding the top electrode, a via disposed on the first conductive line such that the second via is below the top electrode, and a third conductive line disposed on the via to enable the memory pillar to be fitted between the first and second metallization levels.