公开(公告)号：US20110183244A1

公开(公告)日：2011-07-28

申请号：US12692521

申请日：2010-01-22

Applicant: Jin Wu ,  Yuhua Tong ,  Helen R. Cherniack ,  Edward F. Grabowski ,  Kent J. Evans ,  Nancy L. Belknap

Inventor： Jin Wu ,  Yuhua Tong ,  Helen R. Cherniack ,  Edward F. Grabowski ,  Kent J. Evans ,  Nancy L. Belknap

IPC: G03G15/00

CPC classification number: G03G5/142 ,  G03G5/14 ,  G03G15/75

Abstract: Embodiments relate generally to an imaging member that facilitates removal of the imaging member coating layers disposed over the imaging member and environmentally or “green” methods for using the same. More specifically, the present embodiments disclose an electrophotographic photoreceptor that includes a specifically formulated undercoat layer that allows easy removal of the photoreceptor layers disposed on top of the undercoat layer. The present embodiments provide a simple yet efficient method for reclaiming recycling or remanufacturing electrophotographic photoreceptors.

Abstract translation: 实施例总体上涉及有助于去除设置在成像构件上的成像构件涂层的成像构件和使用该成像构件的环境或“绿色”方法。 更具体地，本实施例公开了一种电子照相感光体，其包括特别配制的底涂层，其允许容易地去除设置在底涂层顶部上的感光体层。 本实施例提供了回收再循环或再生电子照相感光体的简单但有效的方法。

公开(公告)号：US20110177655A1

公开(公告)日：2011-07-21

申请号：US13074883

申请日：2011-03-29

Applicant: Wen-Chih Chiou ,  Chen-Hua Yu ,  Weng-Jin Wu

Inventor： Wen-Chih Chiou ,  Chen-Hua Yu ,  Weng-Jin Wu

IPC: H01L21/28

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: The formation of through silicon vias (TSVs) in an integrated circuit (IC) die or wafer is described in which the TSV is formed in the integration process prior to contact or metallization processing. Contacts and bonding pads may then be fabricated after the TSVs are already in place, which allows the TSV to be more dense and allows more freedom in the overall TSV design. By providing a denser connection between TSVs and bonding pads, individual wafers and dies may be bonded directly at the bonding pads. The conductive bonding material, thus, maintains an electrical connection to the TSVs and other IC components through the bonding pads.

Abstract translation: 描述了在集成电路（IC）管芯或晶片中形成通孔硅通孔（TSV），其中在接触或金属化处理之前的集成工艺中形成TSV。 然后可以在TSV已经就位之后制造触点和接合焊盘，这允许TSV更致密并且允许TSV设计中的更多自由度。 通过在TSV和接合焊盘之间提供更密集的连接，单个晶片和管芯可以直接接合在接合焊盘处。 因此，导电接合材料通过接合焊盘保持与TSV和其它IC部件的电连接。

公开(公告)号：US07968263B2

公开(公告)日：2011-06-28

申请号：US12129969

申请日：2008-05-30

Applicant: Jin Wu

Inventor： Jin Wu

IPC: G03G5/00

CPC classification number: G03G5/051 ,  G03G5/0514 ,  G03G5/0614 ,  G03G5/0696 ,  Y10S430/103

Abstract: A photoconductor that includes, for example, a supporting substrate, a photogenerating layer, and at least one charge transport layer comprised of at least one charge transport component, and wherein the photogenerating layer contains an amine phosphate.

Abstract translation: 光电导体，其包括例如支撑衬底，光生成层，以及至少一个电荷传输层，其由至少一个电荷传输组分构成，并且其中光生成层含有磷酸胺。

公开(公告)号：US20110151363A1

公开(公告)日：2011-06-23

申请号：US12640255

申请日：2009-12-17

Applicant: Yuhua Tong ,  Jin Wu ,  Robert P. Altavela ,  Edward F. Grabowski ,  Kent J. Evans ,  Adilson P. Ramos ,  Nancy L. Belknap ,  Helen R. Cherniack

Inventor： Yuhua Tong ,  Jin Wu ,  Robert P. Altavela ,  Edward F. Grabowski ,  Kent J. Evans ,  Adilson P. Ramos ,  Nancy L. Belknap ,  Helen R. Cherniack

IPC: G03G15/00 ,  G03G13/06

CPC classification number: C11D7/5004 ,  B09B5/00 ,  G03G5/102 ,  G03G5/142 ,  G03G5/144

Abstract: Disclosed are undercoat layers comprising a metal oxide, a polymer, and a citrate of Formula (I): wherein R1 is H, alkyl, or COR′; wherein R′ is alkyl; and wherein R2, R3, and R4 are independently alkyl. The undercoat layers are useful in imaging members because they are easily separated from the substrate. This reduces the number of steps necessary to reclaim the substrate.

Abstract translation: 公开了包含式（I）的金属氧化物，聚合物和柠檬酸盐的底涂层：其中R 1是H，烷基或COR'; 其中R'是烷基; 并且其中R 2，R 3和R 4独立地为烷基。 底涂层在成像构件中是有用的，因为它们容易与基底分离。 这减少了回收衬底所需的步骤数。

公开(公告)号：US20110104499A1

公开(公告)日：2011-05-05

申请号：US12608432

申请日：2009-10-29

Applicant: Jin Wu ,  Yuhua Tong ,  Jonathan H. Herko ,  Brian P. Gilmartin

Inventor： Jin Wu ,  Yuhua Tong ,  Jonathan H. Herko ,  Brian P. Gilmartin

IPC: B32B27/36 ,  C08G63/64 ,  C08L69/00 ,  C08L67/00 ,  H01B1/24 ,  H01B1/12

CPC classification number: C08G63/672 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/36 ,  B32B2429/02 ,  C08G63/64 ,  C08L67/02 ,  C08L69/00 ,  C08L71/02 ,  C08L2205/03 ,  H01B1/24 ,  Y10T428/31507 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31721 ,  Y10T428/31725 ,  C08L2666/14

Abstract: An intermediate transfer member that contains a polymer of a polyester, a polycarbonate and a polyalkylene glycol, such as a polyethylene glycol, and further including as an optional component a conductive material such as a metal oxide or carbon black.

Abstract translation: 包含聚酯，聚碳酸酯和聚亚烷基二醇的聚合物如聚乙二醇的中间转印部件，并且还包括诸如金属氧化物或炭黑的导电材料作为任选的组分。

公开(公告)号：US20110104479A1

公开(公告)日：2011-05-05

申请号：US12608713

申请日：2009-10-29

Applicant: Jin Wu ,  Jonathan H. Herko ,  Brian P. Gilmartin ,  David J. Gervasi ,  Dante M. Pietrantoni ,  Michael S. Roetker ,  Scott J. Griffin ,  David W. Martin

Inventor： Jin Wu ,  Jonathan H. Herko ,  Brian P. Gilmartin ,  David J. Gervasi ,  Dante M. Pietrantoni ,  Michael S. Roetker ,  Scott J. Griffin ,  David W. Martin

IPC: B32B9/04 ,  B32B27/36 ,  B32B27/06 ,  B32B27/32 ,  B32B27/30 ,  B32B27/28 ,  B32B5/00

CPC classification number: G03G5/105 ,  G03G5/142 ,  G03G5/14734 ,  G03G5/14769 ,  G03G5/14791 ,  Y10T428/24802 ,  Y10T428/263 ,  Y10T428/31507 ,  Y10T428/31533 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786

Abstract: An intermediate transfer member, such as a belt, that includes, for example, a supporting substrate, a silane first intermediate layer, and contained on the silane layer a second layer of a self crosslinking acrylic resin; a mixture of a glycoluril resin and an acrylic polyol resin; or a mixture of a glycoluril resin and a self crosslinking acrylic resin.

Abstract translation: 中间转印部件，例如带，其包括例如支撑基板，硅烷第一中间层，并且在硅烷层上包含第二层自交联丙烯酸树脂; 甘脲树脂和丙烯酸多元醇树脂的混合物; 或甘脲树脂和自交联丙烯酸树脂的混合物。

公开(公告)号：US07914961B2

公开(公告)日：2011-03-29

申请号：US11869284

申请日：2007-10-09

Applicant: Jin Wu

Inventor： Jin Wu

IPC: G03G5/04

CPC classification number: G03G5/047 ,  G03G5/051 ,  G03G5/0517 ,  G03G5/0521 ,  G03G5/0614 ,  G03G5/0635 ,  G03G5/0661 ,  G03G5/0696 ,  G03G2215/00957

Abstract: A photoconductor comprising a supporting substrate, a photogenerating layer, and at least one charge transport layer comprised of at least one charge transport component, and wherein at least one of the photogenerating layer and the charge transport layer contains at least one of a pyridinium salt and a tetrazolium salt.

Abstract translation: 一种光电导体，包括支撑衬底，光生成层以及由至少一个电荷传输组分构成的至少一个电荷传输层，并且其中光生成层和电荷传输层中的至少一个包含至少一种吡啶鎓盐和 四唑鎓盐。

公开(公告)号：US07914960B2

公开(公告)日：2011-03-29

申请号：US11869252

申请日：2007-10-09

Applicant: Jin Wu ,  Edward F Grabowski ,  Kent J Evans ,  Andronique Ioannidis

Inventor： Jin Wu ,  Edward F Grabowski ,  Kent J Evans ,  Andronique Ioannidis

IPC: G03G5/047

CPC classification number: G03G5/047 ,  G03G5/051 ,  G03G5/0514 ,  G03G5/0517 ,  G03G5/0521 ,  G03G5/0614 ,  G03G5/0696

Abstract: A photoconductor that includes, for example, a supporting substrate, a photogenerating layer, and at least one charge transport layer comprised of at least one charge transport component, and where the charge transport layer contains at least one of an ammonium salt.

Abstract translation: 一种光电导体，其包括例如支撑衬底，光生成层以及由至少一种电荷传输组分构成的至少一个电荷传输层，并且其中电荷输送层含有铵盐中的至少一种。

公开(公告)号：US20110065238A1

公开(公告)日：2011-03-17

申请号：US12769725

申请日：2010-04-29

Applicant: Wen-Chih CHIOU ,  Weng-Jin WU ,  Shau-Lin SHUE

Inventor： Wen-Chih CHIOU ,  Weng-Jin WU ,  Shau-Lin SHUE

IPC: H01L21/50 ,  H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/561 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00

Abstract: A wafer is attached to a carrier by using an adhesive layer, and a portion of the adhesive layer is exposed adjacent to an edge of the wafer. After thinning the wafer, a protection layer is provided to cover the exposed portion of the adhesive layer. A plurality of dies is bonded onto the thinned wafer, and then the thinned wafer and the dies are encapsulated with a molding compound.

Abstract translation: 通过使用粘合剂层将晶片附接到载体，并且粘合剂层的一部分暴露于晶片的边缘附近。 在使晶片变薄之后，提供保护层以覆盖粘合剂层的暴露部分。 将多个模具结合到薄的晶片上，然后用模塑料封装薄化的晶片和模具。

公开(公告)号：US20110053070A1

公开(公告)日：2011-03-03

申请号：US12550492

申请日：2009-08-31

Applicant: Jin Wu ,  Jonathan H. Herko ,  Scott J. Griffin ,  Michael S. Roetker ,  Dante M. Pietrantoni ,  David W. Martin

Inventor： Jin Wu ,  Jonathan H. Herko ,  Scott J. Griffin ,  Michael S. Roetker ,  Dante M. Pietrantoni ,  David W. Martin

IPC: G03G9/00 ,  F16G1/14

CPC classification number: F16G3/10 ,  G03G15/162 ,  Y10T428/1393 ,  Y10T428/31507 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31935

Abstract: A dual layered intermediate transfer member, such as a belt, that includes a substrate that is coated with a layer of a mixture of a glycoluril resin, and a self crosslinking acrylic resin.

Abstract translation: 一种双层中间转印构件，例如带，其包括涂覆有甘脲树脂和自交联丙烯酸树脂的混合物层的基材。