公开(公告)号：US20080079781A1

公开(公告)日：2008-04-03

申请号：US11742792

申请日：2007-05-01

Applicant: Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Chan-bong Jun ,  Hyung Choi ,  Yong-won Jeong

Inventor： Dong-sik Shim ,  Yong-seop Yoon ,  Moon-chul Lee ,  Chan-bong Jun ,  Hyung Choi ,  Yong-won Jeong

IPC: B41J2/05 ,  G11B5/127

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1631

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate through which an ink feed hole to supply ink is formed, a chamber layer stacked above the substrate and including a plurality of ink chambers filled with ink supplied from the ink feed hole, and a nozzle layer stacked on the chamber layer, wherein a plurality of nozzles through which ink is ejected and a plurality of via holes are formed in the nozzle layer.

Abstract translation: 喷墨打印头及其制造方法。 喷墨打印头可以包括基板，通过该基板形成供墨的供墨孔，层叠在基板上方的室层，并且包括填充有从供墨孔供应的墨的多个墨室，以及堆叠在墨槽上的喷嘴层 其中在所述喷嘴层中形成有喷射墨水的多个喷嘴和多个通孔。

公开(公告)号：US20080049073A1

公开(公告)日：2008-02-28

申请号：US11705457

申请日：2007-02-13

Applicant: Moon-chul Lee ,  Sang-hyun Kim ,  Dong-sik Shim ,  Hyung Choi ,  Keon Kuk ,  Yong-seop Yoon

Inventor： Moon-chul Lee ,  Sang-hyun Kim ,  Dong-sik Shim ,  Hyung Choi ,  Keon Kuk ,  Yong-seop Yoon

IPC: B41J2/05

CPC classification number: B41J2/1404 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1639

Abstract: An inkjet printhead and a method of manufacturing the same. The inkjet printhead includes a substrate including one or more ink feed holes to supply ink, which penetrates through the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers, in which the ink supplied from the ink feed hole is filled, a nozzle layer stacked on the chamber layer and including a plurality of nozzles, through which the ink is ejected, and a support member attached on a lower surface of the substrate to support the substrate.

Abstract translation: 喷墨打印头及其制造方法。 喷墨打印头包括一个基板，该基板包括一个或多个墨水供给孔，用于供应穿过基板的墨水，层叠在基板上的腔室层，并且包括多个墨水室，从墨水供给孔供应的墨水被填充 ，层叠在所述室层上并且包括喷射所述墨的多个喷嘴的喷嘴层，以及附着在所述基板的下表面上以支撑所述基板的支撑构件。

公开(公告)号：US07263883B2

公开(公告)日：2007-09-04

申请号：US11141054

申请日：2005-06-01

Applicant: Tae-sik Park ,  Moon-chul Lee ,  Chang-youl Moon

Inventor： Tae-sik Park ,  Moon-chul Lee ,  Chang-youl Moon

IPC: G01P1/02

CPC classification number: B81C1/0023 ,  B81B2207/07 ,  G01C19/56 ,  H01L2224/16225

Abstract: Provided are a gyro-sensor including a plurality of component units and a method of fabricating the gyro-sensor. The gyro-sensor includes: a substrate; a micro electro mechanical system structure including a surface including a predetermined area in which a cavity is formed and connected to an upper surface of the substrate to output a vibration signal proportional to an external rotation force; and a circuit unit positioned in the cavity, converting the vibration signal into a predetermined electric signal proportional to a circular angular velocity, and outputting the predetermined electric signal.

Abstract translation: 提供了包括多个部件单元的陀螺仪传感器和制造陀螺仪传感器的方法。 陀螺传感器包括：基板; 微电子机械系统结构，其包括包括形成空腔的预定区域的表面并且连接到所述基板的上表面以输出与外部旋转力成比例的振动信号; 以及位于所述空腔中的电路单元，将所述振动信号转换成与圆形角速度成比例的预定电信号，并输出所述预定电信号。

公开(公告)号：US07225524B2

公开(公告)日：2007-06-05

申请号：US11002241

申请日：2004-12-03

Applicant: Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

Inventor： Moon-chul Lee ,  Hyung Choi ,  Seok-jin Kang

IPC: H04R31/00

CPC classification number: G01C19/5769 ,  B81B3/0035 ,  B81B2201/0242 ,  B81C1/00579 ,  B81C1/0092 ,  B81C1/00936 ,  H01R13/52 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T74/12 ,  Y10T74/1229

Abstract: Method for fabricating a gyroscope including: fabricating a SMS wafer where a first wafer, a metal film, and a second wafer are sequentially stacked; forming a cantilever or a bridge shaped-structure on the relevant portion of the first wafer through the photolithography process; attaching to the surface of the first wafer, a first cap made of glass and having a predetermined space for sealing the movable structure in a vacuum state; separating and removing the metal film and the second wafer from the first wafer; and attaching to the backside of the first wafer, the second cap which is structurally and materially symmetric to the first cap. The SMS wafer is fabricated by depositing the metal film on the second wafer and bonding the first wafer on the metal film using metal paste or material of polymer series. With lower material costs, improvements in performance and characteristics can be achieved.

Abstract translation: 制造陀螺仪的方法，包括：制造顺序堆叠第一晶片，金属膜和第二晶片的SMS晶片; 通过光刻工艺在第一晶片的相关部分上形成悬臂或桥形结构; 附接到第一晶片的表面，由玻璃制成的第一盖，并且具有用于在真空状态下密封可移动结构的预定空间; 从第一晶片分离和去除金属膜和第二晶片; 并且附接到所述第一晶片的所述背面，所述第二盖在所述第一盖结构和物理上对称。 通过在第二晶片上沉积金属膜并使用金属浆料或聚合物系列材料将第一晶片接合在金属膜上来制造SMS晶片。 随着材料成本的降低，可以实现性能和特性的提高。

公开(公告)号：US20060290457A1

公开(公告)日：2006-12-28

申请号：US11400637

申请日：2006-04-10

Applicant: Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Jea-shik Shin ,  Jun-sik Hwang ,  Eun-sung Lee

Inventor： Moon-chul Lee ,  Jong-oh Kwon ,  Woon-bae Kim ,  Jea-shik Shin ,  Jun-sik Hwang ,  Eun-sung Lee

IPC: H01F5/00

CPC classification number: H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01L27/08 ,  Y10T29/4902 ,  Y10T29/4906 ,  Y10T29/49064 ,  Y10T29/49073 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Abstract translation: 嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到 线圈电极。 电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

公开(公告)号：US20060255443A1

公开(公告)日：2006-11-16

申请号：US11391211

申请日：2006-03-29

Applicant: Jun-sik Hwang ,  Woon-bae Kim ,  Chang-youl Moon ,  Moon-chul Lee ,  Kyu-dong Jung

Inventor： Jun-sik Hwang ,  Woon-bae Kim ,  Chang-youl Moon ,  Moon-chul Lee ,  Kyu-dong Jung

IPC: H01L23/02

CPC classification number: B81C1/0023 ,  B81B7/007 ,  B81C2203/0118 ,  H01L23/04 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/48463 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16235 ,  H01L2924/19041 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multi stack packaging chip and a method of manufacturing the chip are provided. The method includes forming at least one second circuit element on a first wafer; forming a second wafer having a cavity and a one third circuit element formed opposite to the cavity; forming a solder on the second wafer; and combining the second wafer with the first wafer so that the second circuit element and the cavity correspond. The chip includes a flip-chip packaged chip in which a first circuit element is packaged using a first wafer; a second circuit element formed on the first wafer; a second wafer having a cavity and combined with the first wafer so that the cavity and the second circuit element correspond; a third circuit element formed on the second wafer; and a solder formed on the second wafer, the solder electrically coupling the second wafer to a packaging substrate.

Abstract translation: 提供了一种多层封装芯片及其制造方法。 该方法包括在第一晶片上形成至少一个第二电路元件; 形成具有空腔的第二晶片和与所述腔相对形成的一个第三电路元件; 在第二晶片上形成焊料; 以及将所述第二晶片与所述第一晶片组合以使得所述第二电路元件和所述空腔对应。 芯片包括倒装芯片封装芯片，其中使用第一晶片封装第一电路元件; 形成在第一晶片上的第二电路元件; 第二晶片，其具有空腔并与所述第一晶片组合，使得所述空腔和所述第二电路元件对应; 形成在第二晶片上的第三电路元件; 以及形成在所述第二晶片上的焊料，所述焊料将所述第二晶片电耦合到封装衬底。

公开(公告)号：US20060073502A1

公开(公告)日：2006-04-06

申请号：US11225507

申请日：2005-09-13

Applicant: Sung-hee Lee ,  Jung-ho Kang ,  Young-il Kim ,  Moon-chul Lee ,  Tae-sik Park

Inventor： Sung-hee Lee ,  Jung-ho Kang ,  Young-il Kim ,  Moon-chul Lee ,  Tae-sik Park

IPC: C12Q1/68 ,  C12M1/34

CPC classification number: G01N33/5438 ,  G01N33/553

Abstract: An apparatus and method for detecting a bio-bonding includes monitoring of a change of an electrical property before and after bio-bonding. The apparatus includes a signal transducer section having a substrate, a metallic thin film stepped on a surface of a certain region of the substrate, probe biomolecules formed on the metallic thin film, an input port connected with one side of the signal transducer section and into which a signal for monitoring an electrical property of the signal transducer section is input and a detector section for characteristic quantity connected with the other side of the signal transducer section so as to monitor an electrical property of the signal transducer section. The probe biomolecules are immobilized on the metallic thin film. The bio-bonding is detected through monitoring the electrical property of the signal transducer section before and after the bio-bonding.

Abstract translation: 用于检测生物粘合的装置和方法包括监测生物粘合之前和之后的电特性的变化。 该装置包括：信号传感器部，具有基板，在基板的特定区域的台阶上阶梯状的金属薄膜，形成在金属薄膜上的探针生物分子，与信号换能器部的一侧连接的输入口， 输入用于监视信号换能器部分的电气性能的信号，以及用于与信号换能器部分的另一侧连接的特征量的检测器部分，以监测信号换能器部分的电气特性。 探针生物分子固定在金属薄膜上。 通过在生物粘合之前和之后监测信号传感器部分的电性能来检测生物粘合。

公开(公告)号：US06952965B2

公开(公告)日：2005-10-11

申请号：US10744099

申请日：2003-12-24

Applicant: Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Seog-soo Hong

Inventor： Seok-jin Kang ,  Seok-whan Chung ,  Moon-chul Lee ,  Kyu-dong Jung ,  Seog-soo Hong

IPC: B81B7/00 ,  B81B3/00 ,  B81B5/00 ,  B81C1/00 ,  G01C19/56 ,  G01C19/5762 ,  G01C19/5769 ,  G01P9/04

CPC classification number: G01C19/5762 ,  B81B3/0059 ,  B81B2201/0242 ,  B81B2203/051 ,  B81B2203/053

Abstract: A vertical MEMS gyroscope by horizontal driving includes a substrate, a support layer fixed on an upper surface of an area of the substrate, a driving structure floating above the substrate and having a portion fixed to an upper surface of the support layer and another portion in parallel with the fixed portion, the driving structure having a predetermined area capable of vibrating in a predetermined direction parallel to the substrate, a detecting structure fixed to the driving structure on a same plane as the driving structure, and having a predetermined area capable of vibrating in a vertical direction with respect to the substrate, a cap wafer bonded with the substrate positioned above the driving structure and the detecting structure, and a fixed vertical displacement detection electrode formed at a predetermined location of an underside of the cap wafer, for detecting displacement of the detecting structure in the vertical direction.

Abstract translation: 通过水平驱动的垂直MEMS陀螺仪包括基板，固定在基板的区域的上表面上的支撑层，浮动在基板上方并具有固定到支撑层的上表面的部分的驱动结构， 平行于固定部分，驱动结构具有能够在与基板平行的预定方向上振动的预定区域;检测结构，其在与驱动结构相同的平面上固定到驱动结构，并且具有能够振动的预定区域 在相对于基板的垂直方向上，与位于驱动结构上方的基板接合的盖晶片和检测结构，以及形成在盖晶片的下侧的预定位置处的固定垂直位移检测电极，用于检测位移 的检测结构。

公开(公告)号：US20130147320A1

公开(公告)日：2013-06-13

申请号：US13592821

申请日：2012-08-23

Applicant: Sang Uk Son ,  Duck Hwan KIM ,  Chul Soo KIM ,  Ho Soo Park ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

Inventor： Sang Uk Son ,  Duck Hwan KIM ,  Chul Soo KIM ,  Ho Soo Park ,  In Sang Song ,  Jea Shik Shin ,  Moon Chul Lee ,  Jing Cui

IPC: H01L41/053 ,  H01L41/22

CPC classification number: H03H9/02102 ,  H03H9/02149 ,  H03H9/1014 ,  H03H9/173 ,  H03H9/564 ,  H03H9/587 ,  Y10T29/42

Abstract: Provided is a bulk acoustic wave resonator (BAWR). The BAWR may include a first electrode, a piezoelectric layer disposed on the first electrode, a second electrode disposed on the piezoelectric layer. In various aspects, at least one of the first electrode, the piezoelectric layer, and the second electrode are formed of a carbon-based material.

Abstract translation: 提供了一种体声波谐振器（BAWR）。 BAWR可以包括第一电极，设置在第一电极上的压电层，设置在压电层上的第二电极。 在各个方面，第一电极，压电层和第二电极中的至少一个由碳基材料形成。

公开(公告)号：US08254121B2

公开(公告)日：2012-08-28

申请号：US12868061

申请日：2010-08-25

Applicant: Moon-chul Lee ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

Inventor： Moon-chul Lee ,  Min-soo Kim ,  Yong-soo Lee ,  Sru Kim

IPC: H05K7/20 ,  F01D9/00

CPC classification number: H05K7/20972 ,  F04D25/166 ,  F04D29/441 ,  F04D29/444 ,  F05D2250/52 ,  H05K7/20172

Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.

Abstract translation: 一种冷却器和包括该冷却器的显示装置。 冷却器包括：一个外壳; 吹风单元，其设置在所述壳体内部并吸入外部空气并吹送所述壳体中的外部空气，其中所述吹风单元包括多个组，每组包括两个鼓风机; 引导叶片，其设置在所述吹风单元的上方，并且引导从所述送风单元流出的空气沿不同方向流动; 以及设置在送风单元和导向叶片之间的多个辅助导向叶片，并且每个辅助导向叶片各自设置在每个组中，每个组包括两个鼓风机，以便引导在吹风单元下方流动的空气流向导向叶片。