公开(公告)号：US20060102827A1

公开(公告)日：2006-05-18

申请号：US11272895

申请日：2005-11-15

Applicant: Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

Inventor： Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

IPC: H01L27/00

CPC classification number: H04N5/374 ,  H01L27/14609 ,  H01L27/14643 ,  H04N5/35509 ,  H04N5/35554 ,  H04N5/3575

Abstract: Provided is a solid-state imaging device which can obtain an output characteristic without preventing linearity even in a high light-intensity range, and at the same time achieve a much wider dynamic range. The solid-state imaging device 1 includes: a photo-detecting element (a photoelectric transducer PD) for transducing incident light to electric charges and accumulate the electric charges; an accumulation element (a floating de-fusion FD) for accumulating the electric charges; and a transfer circuit (a MOS transistor Q11 and a pulse generating circuit 50a) for transferring the electric charges accumulated in the photo-detecting element to the accumulation element, wherein the transfer circuit has two operation modes as follows: a whole transfer for transferring almost all of the accumulated electric charges to the accumulation element; and a partial transfer for transferring only a part of the accumulated electric charges which exceeds a predetermined amount to the accumulation element.

Abstract translation: 提供了即使在高的光强度范围也可以获得输出特性而不防止线性，同时实现更宽的动态范围的固态成像装置。 固态成像装置1包括：用于将入射光转换成电荷并积累电荷的光检测元件（光电变换器PD） 用于累积电荷的累积元件（浮动解耦FD）; 以及用于将累积在光检测元件中的电荷转移到累积元件的转移电路（MOS晶体管Q 11和脉冲发生电路50a），其中传输电路具有如下两种操作模式： 将几乎所有累积的电荷转移到积聚元件; 以及仅将一部分超过预定量的累积电荷传送到累积元件的部分传送。

公开(公告)号：US06870401B1

公开(公告)日：2005-03-22

申请号：US10902095

申请日：2004-07-30

Applicant: Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

Inventor： Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

IPC: G09G3/36 ,  G11C19/18 ,  G11C19/28 ,  H04N5/335 ,  H03K19/094

CPC classification number: G09G3/3677 ,  G09G2310/0286 ,  G11C19/184 ,  G11C19/28

Abstract: The signal transmission circuit is provided, said signal transmission circuit being capable of stable operations even with a source power of low voltage and a fast operation. The signal transmission circuit comprises plural stages of circuit in each of which the pulse voltage according to the driving pulse is sequentially outputted. The circuit of each stage includes: the output transistor T12 for outputting the pulse voltage to the source, according to the driving pulse; the bootstrap capacitor C1 connected between the gate and the source of the output transistor; the first charging transistor T11 for charging the bootstrap capacitor; the first and the second discharging transistor T13 and T14 for discharging the electric charge of the bootstrap capacitor; and the logical circuit which (i) turns on the first and the second discharging transistor, according to the driving pulse for each circuit of the other stages, and (ii) turns off the first and the second discharging transistor, according to the gate signal of the charging transistor.

Abstract translation: 提供信号传输电路，所述信号传输电路即使具有低电压和快速操作的源功率也能够稳定地工作。 信号传输电路包括多个电路，其中根据驱动脉冲的脉冲电压被依次输出。 每级的电路包括：输出晶体管T12，用于根据驱动脉冲将脉冲电压输出到源; 所述自举电容器C1连接在所述输出晶体管的栅极和源极之间; 用于对自举电容器充电的第一充电晶体管T11; 用于放电自举电容器的电荷的第一和第二放电晶体管T13和T14; 和逻辑电路（i）根据其他级的每个电路的驱动脉冲导通第一和第二放电晶体管，以及（ii）根据栅极信号关断第一和第二放电晶体管 的充电晶体管。

公开(公告)号：US20050046445A1

公开(公告)日：2005-03-03

申请号：US10902095

申请日：2004-07-30

Applicant: Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

Inventor： Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata

IPC: G09G3/36 ,  G11C19/18 ,  G11C19/28 ,  H04N5/335 ,  H03K19/094

CPC classification number: G09G3/3677 ,  G09G2310/0286 ,  G11C19/184 ,  G11C19/28

Abstract: The signal transmission circuit is provided, said signal transmission circuit being capable of stable operations even with a source power of low voltage and a fast operation. The signal transmission circuit comprises plural stages of circuit in each of which the pulse voltage according to the driving pulse is sequentially outputted. The circuit of each stage includes: the output transistor T12 for outputting the pulse voltage to the source, according to the driving pulse; the bootstrap capacitor C1 connected between the gate and the source of the output transistor; the first charging transistor T11 for charging the bootstrap capacitor; the first and the second discharging transistor T13 and T14 for discharging the electric charge of the bootstrap capacitor; and the logical circuit which (i) turns on the first and the second discharging transistor, according to the driving pulse for each circuit of the other stages, and (ii) turns off the first and the second discharging transistor, according to the gate signal of the charging transistor.

Abstract translation: 提供信号传输电路，所述信号传输电路即使具有低电压和快速操作的源功率也能够稳定地工作。 信号传输电路包括多个电路，其中根据驱动脉冲的脉冲电压被依次输出。 每级的电路包括：输出晶体管T12，用于根据驱动脉冲将脉冲电压输出到源; 所述自举电容器C1连接在所述输出晶体管的栅极和源极之间; 用于对自举电容器充电的第一充电晶体管T11; 用于放电自举电容器的电荷的第一和第二放电晶体管T13和T14; 和逻辑电路（i）根据其他级的每个电路的驱动脉冲导通第一和第二放电晶体管，以及（ii）根据栅极信号关断第一和第二放电晶体管 的充电晶体管。

公开(公告)号：US5462626A

公开(公告)日：1995-10-31

申请号：US98813

申请日：1993-07-29

Applicant: Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

Inventor： Shinji Kanayama ,  Akira Kabeshita ,  Kenichi Nishino ,  Satoshi Ohnakada ,  Takahiko Murata ,  Kazuhiro Kimura ,  Kazuto Nishida

IPC: H05K3/34 ,  H05K3/36 ,  H05K13/04 ,  B32B31/00

CPC classification number: H05K3/363 ,  H05K13/0465 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/10681 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/3421 ,  H05K3/3494

Abstract: A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.

Abstract translation: 一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部 使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。 灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。 在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。 在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触 电极。 激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分 的外部引线和电极。

公开(公告)号：US5266828A

公开(公告)日：1993-11-30

申请号：US884826

申请日：1992-05-18

Applicant: Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

Inventor： Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

IPC: G02B6/42 ,  H04N1/031 ,  H01L27/14

CPC classification number: H04N1/0312 ,  G02B6/4249 ,  H01L27/14618 ,  H01L27/14625 ,  H04N1/0311 ,  H04N1/0316 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041

Abstract: This invention relates to an image sensor with photo sensors (13). An object thereof is to simplify mounting operation of an image sensor chip (12) provided with the photo sensors (13). In order to accomplish this object, according to this invention, the photo sensors (13) and electrodes (15) are disposed on the underside of the image sensor chip (12). The image sensor chip (12) is bonded to the upper side of a transparent substrate (18) by means of a transparent photo-setting type insulating resin (16), so that the electrodes (15) come into contact with circuit conductor layers (17) disposed on the upper side of the transparent substrate (18). With the above-mentioned construction, since fine metal wire (75) by which the electrodes (15) and the circuit conductor layers (17) are connected to each other is not required, mounting operation can be simplified.

Abstract translation: 本发明涉及具有光传感器（13）的图像传感器。 其目的在于简化设置有光传感器（13）的图像传感器芯片（12）的安装操作。 为了实现该目的，根据本发明，光传感器（13）和电极（15）设置在图像传感器芯片（12）的下侧。 图像传感器芯片12通过透明光固定型绝缘树脂16与透明基板18的上侧接合，使得电极15与电路导体层（ 17）设置在透明基板（18）的上侧。 利用上述结构，由于不需要将电极（15）和电路导体层（17）彼此连接的细金属线（75），因此可以简化安装操作。

公开(公告)号：US5138145A

公开(公告)日：1992-08-11

申请号：US739562

申请日：1991-08-21

Applicant: Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

Inventor： Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

IPC: G02B6/42 ,  H04N1/031

CPC classification number: H04N1/0312 ,  G02B6/4249 ,  H01L27/14618 ,  H01L27/14683 ,  H04N1/0311 ,  H04N1/0316 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041

Abstract: Methods for the production of image sensors having simplified chip mounting are provided which comprise disposing a photo-setting type insulating resin on the upper side of a substrate, a portion of the substrate being transparent and having circuit conductor layers on its upper side; bringing an image sensor chip, the underside of which has electrodes, into contact with the upper side of the substrate so that the photo-setting type resin is wedged away and the electrodes come into contact with the corresponding circuit conductor layers; flowing current into the image sensor chip through the circuit conductor layers to determine that the image sensor chip operates in a normal manner; and irradiating the photo-setting type resin with light so that the resin is hardened.

公开(公告)号：US4711077A

公开(公告)日：1987-12-08

申请号：US803720

申请日：1985-12-02

Applicant: Mitsuhiro Kutsukake ,  Takahiko Murata ,  Gunji Saito ,  Takeshi Komatsuzaki ,  Kuniaki Uehara ,  Toshinobu Kato ,  Takeo Hattori ,  Morimasa Hayashida

Inventor： Mitsuhiro Kutsukake ,  Takahiko Murata ,  Gunji Saito ,  Takeshi Komatsuzaki ,  Kuniaki Uehara ,  Toshinobu Kato ,  Takeo Hattori ,  Morimasa Hayashida

IPC: A01D34/81 ,  F02B63/02 ,  A01D67/00

CPC classification number: A01D34/81 ,  F02B63/02 ,  A01D2101/00

Abstract: A cutter housing for use in a power-driven lawn mower has a substantially cylindrical skirt wall and a top wall covering the upper end of the skirt wall. The top wall has a substantially central recess for accomodating the engine of the lawn mower and includes a pair of half members positioned one on each side of the recess and lying substantially flush with each other in symmetrical and contiguous relation. The cutter housing also has a rear housing portion extending rearwardly in contiguous relation to the skirt wall and the top wall, and a partition disposed in the rear housing portion and dividing the rear housing portion into two spaces. The skirt wall, the top wall, the rear housing portion, and the partition are integrally molded of synthetic resin.

Abstract translation: 用于动力割草机的切割器壳体具有基本上圆柱形的裙部壁和覆盖裙壁的上端的顶壁。 顶壁具有用于容纳割草机的发动机的基本上中心的凹部，并且包括一对半部件，该半部件位于凹部的每一侧上且以对称和连续的关系彼此基本齐平。 切割器壳体还具有后端壳体部分，该后部壳体部分以与裙壁和顶壁相邻的方式向后延伸，以及设置在后壳体部分中并将后壳体部分分成两个空间的分隔件。 裙壁，顶壁，后壳体部分和隔板由合成树脂一体模制。

公开(公告)号：US4567529A

公开(公告)日：1986-01-28

申请号：US617566

申请日：1984-06-05

Applicant: Kazufumi Yamaguchi ,  Takahiko Murata

Inventor： Kazufumi Yamaguchi ,  Takahiko Murata

IPC: H04N5/369 ,  H04N1/10 ,  H04N3/14

CPC classification number: H04N3/1581

Abstract: A linear image sensor of a self-scanning type comprising a phototransistor array and a scanning circuit, whose circuit comprises decoders of current switches connected dendritically, input signal converter circuits generating input signals for driving the current switches, and a current switch array which turns on or off charging currents to the phototransistors according to whether or not an output current of decoder exists, so that video signals from the phototransistors, when the output currents of decoder flow, are obtainable from the phototransistors in the charge storage mode, all the transistors for scanning circuit being operated in nonsaturation condition for high-speed operation and the input signals being encoded so that the input signals to the decoder vary by one bit at each scanning step for noise reduction. The cancellation circuit of dark signal and noise signal is also provided.

Abstract translation: 包括光电晶体管阵列和扫描电路的自扫描型的线性图像传感器，其电路包括树状连接的电流开关的解码器，产生用于驱动电流开关的输入信号的输入信号转换器电路以及导通的电流开关阵列 或根据解码器的输出电流是否存在对截止的光电晶体管的充电电流，使得来自光电晶体管的视频信号在解码器流的输出电流可从电荷存储模式中的光电晶体管获得时，所有晶体管用于 扫描电路在非饱和条件下工作，用于高速操作，并且输入信号被编码，使得在每个扫描步骤对解码器的输入信号改变一位，以降低噪声。 还提供暗信号和噪声信号的消除电路。

公开(公告)号：US08319871B2

公开(公告)日：2012-11-27

申请号：US12947423

申请日：2010-11-16

Applicant: Takahiko Murata ,  Shigetaka Kasuga ,  Takumi Yamaguti

Inventor： Takahiko Murata ,  Shigetaka Kasuga ,  Takumi Yamaguti

IPC: H04N3/14 ,  H04N5/335

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/13091 ,  H04N5/2251 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Provided is a light-receiving chip whose transparent protection plate has an area equal to or smaller than an area of the light-receiving chip, and which does not require a base portion for mounting. Provision of the light-receiving chip contributes to reduction in size and weight of cameras. In addition, provision of a solid-state imaging apparatus having excellent productivity contributes to reduction in price of cameras. A solid-state imaging apparatus (10) having: a solid-state imaging device (11) (a light-receiving chip) provided with a plurality of light-receiving cells arranged either one dimensionally or two dimensionally on one main surface of a base substrate; and a transparent protection plate (12) provided to cover a light-receiving area (18) (the plurality of light-receiving cells), where an area of the transparent protection plate is equal to or smaller than an area of the light-receiving chip, and a space (20) is formed between the light-receiving cells and the transparent protection plate.

Abstract translation: 提供一种透光保护板的面积等于或小于受光片的面积，并且不需要安装用基座的受光片。 提供光接收芯片有助于减小相机的尺寸和重量。 此外，提供具有优异生产率的固态成像装置有助于降低相机的价格。 一种固态成像装置（10），其具有：固态成像装置（11）（受光芯片），其设置有在基板的一个主面上一维或二维地配置的多个受光单元 基质; 以及透明保护板（12），设置成覆盖所述透光保护板的面积等于或小于所述受光区域（18）的光接收区域（多个光接收单元） 并且在光接收单元和透明保护板之间形成有空间（20）。

公开(公告)号：US07973840B2

公开(公告)日：2011-07-05

申请号：US11946987

申请日：2007-11-29

Applicant: Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata ,  Takayoshi Yamada

Inventor： Shigetaka Kasuga ,  Takumi Yamaguchi ,  Takahiko Murata ,  Takayoshi Yamada

IPC: H04N3/14 ,  H04N5/335

CPC classification number: H04N5/335

Abstract: A solid-state imaging device includes: a plurality of pixels arranged in a matrix, the matrix defining columns of the pixels, and each of the pixels outputting an analog signal by performing photoelectric conversion; an analog-digital converter provided for each of columns which sequentially converts a plurality of analog signals outputted from the pixels in a column into a plurality of digital signals; a memory circuit provided for each column which includes memories and performs, in parallel, a process of storing a one of the digital signals in one of the memories and a process of outputting another of the digital signals previously stored in another of the memories; and data buses connected to the memory in each column.

Abstract translation: 固态成像装置包括：矩阵排列的多个像素，矩阵定义像素列，并且每个像素通过进行光电转换而输出模拟信号; 为每列提供的模数转换器，其将从列中的像素输出的多个模拟信号顺序地转换成多个数字信号; 为每列提供的包括存储器的存储电路，并行地执行将一个数字信号存储在其中一个存储器中的处理，以及输出先前存储在另一个存储器中的另一个数字信号的处理; 和数据总线连接到每列的存储器。