Organic thin film transistor having a phthalocyanine semiconductor layer
    81.
    发明授权
    Organic thin film transistor having a phthalocyanine semiconductor layer 失效
    具有酞菁半导体层的有机薄膜晶体管

    公开(公告)号:US5969376A

    公开(公告)日:1999-10-19

    申请号:US702073

    申请日:1996-08-23

    申请人: Zhenan Bao

    发明人: Zhenan Bao

    摘要: Thin film transistors in which the active layer is an ordered film of a pthalocyanine coordination compound with a field-effect mobility greater than 10.sup.-3 cm.sup.2 /Vs and a conductivity in the range of about 10.sup.-9 S/cm to about 10.sup.-7 S/cm at 20.degree. C. are disclosed. Examples of suitable pthalocyanines include copper pthalocyanine, zinc pthalocyanine, hydrogen pthalocyanine, and tin pthalocyanine. Thin film devices made of these materials have an on/off ratio of at least about 10.sup.4. It is advantageous if the device is fabricated using a process in which the substrate is heated to a temperature in the range of about 30.degree. C. to about 200.degree. C. when the film is formed thereon.

    摘要翻译: 薄膜晶体管,其中有源层是具有场效应迁移率大于10-3cm 2 / Vs并且导电率在约10-9S / cm至约10-7的范围内的酞菁配位化合物的有序膜 公开了20℃下的S / cm。 合适的酞菁的实例包括铜酞菁,锌酞菁,氢酞菁和锡酞菁。 由这些材料制成的薄膜器件具有至少约104的开/关比。如果该器件是使用其中将衬底加热到​​约30℃至约 当其上形成膜时为200℃。

    Patterning of organic semiconductor materials
    82.
    发明授权
    Patterning of organic semiconductor materials 有权
    有机半导体材料图案化

    公开(公告)号:US09520563B2

    公开(公告)日:2016-12-13

    申请号:US12743772

    申请日:2008-11-20

    IPC分类号: H01L29/08 H01L51/00 H01L51/05

    摘要: Organic semiconductor material can be patterned from a solution onto a substrate by selectively wetting the substrate with the solution while applying a mechanical disturbance (such as stirring the solution while the substrate is immersed, or wiping the solution on the substrate). The organic semiconductor material can then be precipitated out of the solution, for example to bridge gaps between source and drain electrodes to form transistor devices. In some embodiments, the solution containing the organic semiconductor material can be mixed in an immiscible host liquid. This can allow the use of higher concentration solutions while also using less of the organic semiconductor material.

    摘要翻译: 通过在施加机械扰动(例如在浸渍基材时搅拌溶液或将基板上的溶液擦拭)的机械干扰(例如搅拌溶液),通过在溶液中选择性地润湿基材,可以将有机半导体材料从溶液图案化。 然后可以将有机半导体材料从溶液中沉淀出来,例如以桥接源极和漏极之间的间隙以形成晶体管器件。 在一些实施方案中,含有有机半导体材料的溶液可以混合在不混溶的主体液体中。 这可以允许使用更高浓度的溶液,同时也使用少量的有机半导体材料。

    Method Of Manufacturing Electric Device, Array Of Electric Devices, And Manufacturing Method Therefor
    85.
    发明申请
    Method Of Manufacturing Electric Device, Array Of Electric Devices, And Manufacturing Method Therefor 有权
    电气设备制造方法,电气设备阵列及其制造方法

    公开(公告)号:US20130001554A1

    公开(公告)日:2013-01-03

    申请号:US13173986

    申请日:2011-06-30

    IPC分类号: H01L29/12 H01L21/66 H01L51/30

    摘要: An example embodiment relates to a method of manufacturing an array of electric devices that includes attaching a platform including a micro-channel structure to a substrate. The method includes injecting first and second solutions into the micro-channel structure to form at least three liquid film columns, where the first and second solutions include different solvent composition ratios and the liquid columns each, respectfully, include different solvent composition ratios. The method further includes detaching the platform the substrate, removing solvent from the liquid film columns to form thin film columns, and treating the thin film columns under different conditions along a length direction of the thin film columns. The solvent is removed from the thin film columns and the thin film columns are treated under different conditions along a length direction of the thin film columns.

    摘要翻译: 示例性实施例涉及一种制造电气设备阵列的方法,其包括将包括微通道结构的平台附接到基板。 该方法包括将第一和第二溶液注入到微通道结构中以形成至少三个液膜柱,其中第一和第二溶液包括不同的溶剂组成比,并且液柱各自包括不同的溶剂组成比。 该方法还包括将基板分离,从液膜柱移除溶剂以形成薄膜柱,以及沿着薄膜柱的长度方向在不同条件下处理薄膜柱。 从薄膜柱中除去溶剂,并在薄膜柱的长度方向上在不同的条件下处理薄膜柱。

    Interface Apparatus And Methods
    86.
    发明申请
    Interface Apparatus And Methods 有权
    接口设备及方法

    公开(公告)号:US20120075241A1

    公开(公告)日:2012-03-29

    申请号:US13229338

    申请日:2011-09-09

    IPC分类号: G06F3/045 B32B37/14 B05D5/12

    摘要: Input devices are provided. In accordance with an example embodiment, an input device includes an interface layer that flexes in response to pressure, a plurality of sense electrodes, a dielectric between the sense electrodes and the interface layer, and interconnecting circuitry. The dielectric compresses or expands in response to movement of the interface layer, and exhibits dielectric characteristics that vary based upon a state of compression of the dielectric. The interconnecting circuitry is to the sense electrodes and provides an output indicative of both the position of each sense electrode and an electric characteristic at each sense electrode that provides an indication of pressure applied to the dielectric adjacent the respective sense electrodes.

    摘要翻译: 提供输入设备。 根据示例实施例,输入装置包括响应于压力而弯曲的界面层,多个感测电极,感测电极和界面层之间的电介质以及互连电路。 电介质根据界面层的移动而压缩或膨胀,并且表现出基于电介质的压缩状态而变化的介电特性。 互连电路是针对感测电极并提供指示每个感测电极的位置和每个感测电极处的电特性两者的输出,该电特性提供施加到邻近各个感测电极的电介质的压力的指示。

    FULLERENE-DOPED NANOSTRUCTURES AND METHODS THEREFOR
    87.
    发明申请
    FULLERENE-DOPED NANOSTRUCTURES AND METHODS THEREFOR 有权
    全能的纳米结构及其方法

    公开(公告)号:US20110204319A1

    公开(公告)日:2011-08-25

    申请号:US13011402

    申请日:2011-01-21

    摘要: Nanostructures are doped to set conductivity characteristics. In accordance with various example embodiments, nanostructures such as carbon nanotubes are doped with a halogenated fullerene type of dopant material. In some implementations, the dopant material is deposited from solution or by vapor deposition, and used to dope the nanotubes to increase the thermal and/or electrical conductivity of the nanotubes.

    摘要翻译: 掺杂纳米结构以设定电导率特性。 根据各种示例性实施例,纳米结构如碳纳米管掺杂有卤化富勒烯型掺杂剂材料。 在一些实施方案中,掺杂剂材料从溶液沉积或通过气相沉积沉积,并用于掺杂纳米管以增加纳米管的热和/或电导率。

    PATTERNING OF ORGANIC SEMICONDUCTOR MATERIALS
    88.
    发明申请
    PATTERNING OF ORGANIC SEMICONDUCTOR MATERIALS 有权
    有机半导体材料的构图

    公开(公告)号:US20100308309A1

    公开(公告)日:2010-12-09

    申请号:US12743772

    申请日:2008-11-20

    IPC分类号: H01L51/00 H01L51/40 G03F7/20

    摘要: Organic semiconductor material can be patterned from a solution onto a substrate by selectively wetting the substrate with the solution while applying a mechanical disturbance (such as stirring the solution while the substrate is immersed, or wiping the solution on the substrate). The organic semiconductor material can then be precipitated out of the solution, for example to bridge gaps between source and drain electrodes to form transistor devices. In some embodiments, the solution containing the organic semiconductor material can be mixed in an immiscible host liquid. This can allow the use of higher concentration solutions while also using less of the organic semiconductor material.

    摘要翻译: 通过在施加机械扰动(例如在浸渍基材时搅拌溶液或将基板上的溶液擦拭)的机械干扰(例如搅拌溶液),通过在溶液中选择性地润湿基材,可以将有机半导体材料从溶液图案化。 然后可以将有机半导体材料从溶液中沉淀出来,例如以桥接源极和漏极之间的间隙以形成晶体管器件。 在一些实施方案中,含有有机半导体材料的溶液可以混合在不混溶的主体液体中。 这可以允许使用更高浓度的溶液,同时也使用少量的有机半导体材料。