公开(公告)号：US20110133272A1

公开(公告)日：2011-06-09

申请号：US12633956

申请日：2009-12-09

申请人： Anton Mauder ,  Rudolf Berger ,  Franz Hirler ,  Ralf Siemieniec ,  Hans-Joachim Schulze

发明人： Anton Mauder ,  Rudolf Berger ,  Franz Hirler ,  Ralf Siemieniec ,  Hans-Joachim Schulze

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/66719 ,  H01L29/0878 ,  H01L29/407 ,  H01L29/408 ,  H01L29/42368 ,  H01L29/513 ,  H01L29/66734 ,  H01L29/7813

摘要： A semiconductor device includes a source, a drain, and a gate configured to selectively enable a current to pass between the source and the drain. The semiconductor device includes a drift zone between the source and the drain and a first field plate adjacent the drift zone. The semiconductor device includes a dielectric layer electrically isolating the first field plate from the drift zone and charges within the dielectric layer close to an interface of the dielectric layer adjacent the drift zone.

摘要翻译： 半导体器件包括源极，漏极和被配置为选择性地使电流在源极和漏极之间通过的栅极。 半导体器件包括源极和漏极之间的漂移区和邻近漂移区的第一场板。 半导体器件包括将第一场板与漂移区电隔离的电介质层，并且电介质层内的电荷接近靠近漂移区的电介质层的界面。

公开(公告)号：US07821033B2

公开(公告)日：2010-10-26

申请号：US11706860

申请日：2007-02-15

申请人： Stefan Sedlmaier ,  Anton Mauder ,  Armin Willmeroth ,  Franz Hirler

发明人： Stefan Sedlmaier ,  Anton Mauder ,  Armin Willmeroth ,  Franz Hirler

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7813 ,  H01L29/0653 ,  H01L29/165 ,  H01L29/407 ,  H01L29/66734 ,  H01L29/7804

摘要： A semiconductor component is disclosed herein comprising a drift zone and a drift control zone. The drift control zone is arranged adjacent to the drift zone and is dielectrically insulated from the drift zone by a dielectric layer. The drift control zone includes at least one first semiconductor layer and one second semiconductor layer. The first semiconductor layer has a higher charge carrier mobility than the second semiconductor layer.

摘要翻译： 本文公开了一种半导体元件，其包括漂移区和漂移控制区。 漂移控制区域布置成与漂移区相邻，并且通过介电层与漂移区介电绝缘。 漂移控制区包括至少一个第一半导体层和一个第二半导体层。 第一半导体层具有比第二半导体层更高的电荷载流子迁移率。

公开(公告)号：US20100078775A1

公开(公告)日：2010-04-01

申请号：US12241985

申请日：2008-09-30

申请人： Anton Mauder ,  Franz Hirler ,  Armin Willmeroth ,  Michael Rueb ,  Holger Kapels

发明人： Anton Mauder ,  Franz Hirler ,  Armin Willmeroth ,  Michael Rueb ,  Holger Kapels

IPC分类号： H01L21/20 ,  H01L29/06

CPC分类号： H01L29/36 ,  H01L21/266 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/0634 ,  H01L29/0688 ,  H01L29/0878 ,  H01L29/105 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/66712 ,  H01L29/7395 ,  H01L29/7811

摘要： A semiconductor device has a cell field with drift zones of a first type of conductivity and charge carrier compensation zones of a second type of conductivity complementary to the first type. An edge region which surrounds the cell field has a higher blocking strength than the cell field, the edge region having a near-surface area which is undoped to more weakly doped than the drift zones, and beneath the near-surface area at least one buried, vertically extending complementarily doped zone is positioned.

摘要翻译： 半导体器件具有具有与第一类型互补的第二导电类型的漂移区和具有第二类型导电性的电荷载体补偿区的电池区。 围绕细胞场的边缘区域具有比细胞场更高的阻挡强度，边缘区域具有未漂移至比漂移区更弱掺杂的近表面区域，并且在近表面区域下方至少有一个埋置 垂直延伸的互补掺杂区定位。

公开(公告)号：US20100078713A1

公开(公告)日：2010-04-01

申请号：US12241828

申请日：2008-09-30

申请人： Anton Mauder ,  Stefan Sedlmaier ,  Ralf Erichsen ,  Hans Weber ,  Oliver Haeberlen ,  Franz Hirler

发明人： Anton Mauder ,  Stefan Sedlmaier ,  Ralf Erichsen ,  Hans Weber ,  Oliver Haeberlen ,  Franz Hirler

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L29/7813 ,  H01L21/76224 ,  H01L27/0629 ,  H01L29/0646 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/407 ,  H01L29/66734 ,  H01L29/7804

摘要： A method for producing a semiconductor structure and a semiconductor component are described.

摘要翻译： 对半导体结构体及半导体部件的制造方法进行说明。

公开(公告)号：US20100078710A1

公开(公告)日：2010-04-01

申请号：US11874591

申请日：2007-10-18

申请人： Armin Willmeroth ,  Anton Mauder ,  Franz Hirler ,  Stefan Sedlmaier

发明人： Armin Willmeroth ,  Anton Mauder ,  Franz Hirler ,  Stefan Sedlmaier

IPC分类号： H01L29/78

CPC分类号： H01L29/7813 ,  H01L29/0634 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/407 ,  H01L29/41766 ,  H01L29/7804

摘要： A semiconductor component has a drift zone and a drift control zone, a drift control zone dielectric, which is arranged in sections between the drift zone and the drift control zone, and has a first and a second connection zone, which are doped complementarily with respect to one another and which form a pn junction between the drift control zone and a section of the drift zone.

摘要翻译： 半导体部件具有漂移区和漂移控制区，漂移控制区电介质，其布置在漂移区和漂移控制区之间的部分中，并且具有第一和第二连接区，其相互掺杂互补 并且在漂移控制区域和漂移区段的一部分之间形成pn结。

公开(公告)号：US20090322417A1

公开(公告)日：2009-12-31

申请号：US12163037

申请日：2008-06-27

申请人： Franz Hirler ,  Thoralf Kautzsch ,  Anton Mauder

发明人： Franz Hirler ,  Thoralf Kautzsch ,  Anton Mauder

IPC分类号： G05F1/10

CPC分类号： H01L29/7813 ,  H01L29/0653 ,  H01L29/407 ,  H01L29/41766 ,  H01L29/7397 ,  H01L29/7803 ,  H01L29/7804 ,  H03K2217/0036

摘要： Disclosed is a semiconductor including a component having a drift zone and a drift control zone. A first connection zone is adjacent to the drift zone and is doped more highly than the drift zone. A drift control zone is arranged adjacent to the drift zone and is coupled to the first connection zone. A drift control zone is dielectric arranged between the drift zone and the drift control zone. At least one rectifier element is arranged between the first connection zone and the drift control zone. A charging circuit is connected to the drift control zone.

摘要翻译： 公开了一种包括具有漂移区和漂移控制区的分量的半导体。 第一连接区域与漂移区相邻，并且掺杂比漂移区更高。 漂移控制区被布置成与漂移区相邻并且耦合到第一连接区。 漂移控制区是介于漂移区和漂移控制区之间的电介质。 至少一个整流元件布置在第一连接区域和漂移控制区域之间。 充电电路连接到漂移控制区。

公开(公告)号：US07459365B2

公开(公告)日：2008-12-02

申请号：US11540922

申请日：2006-09-29

申请人： Michael Rüb ,  Herbert Schäfer ,  Armin Willmeroth ,  Anton Mauder ,  Stefan Sedlmaier ,  Roland Rupp ,  Manfred Pippan ,  Hans Weber ,  Frank Pfirsch ,  Franz Hirler ,  Hans-Joachim Schulze

发明人： Michael Rüb ,  Herbert Schäfer ,  Armin Willmeroth ,  Anton Mauder ,  Stefan Sedlmaier ,  Roland Rupp ,  Manfred Pippan ,  Hans Weber ,  Frank Pfirsch ,  Franz Hirler ,  Hans-Joachim Schulze

IPC分类号： H01L21/336

CPC分类号： H01L29/7813 ,  H01L21/76224 ,  H01L29/0653 ,  H01L29/165 ,  H01L29/66734 ,  H01L29/7804 ,  H01L29/7849

摘要： The fabrication of a semiconductor component having a semiconductor body in which is arranged a very thin dielectric layer having sections which run in the vertical direction and which extend very deeply into the semiconductor body is disclosed. In one method a trench is formed in a drift zone region proceeding from the front side of a semiconductor body, a sacrificial layer is produced on at least a portion of the sidewalls of the trench and at least a portion of the trench is filled with a semiconductor material which is chosen such that the quotient of the net dopant charge of the semiconductor material in the trench and the total area of the sacrificial layer on the sidewalls of the trench between the semiconductor material and the drift zone region is less than the breakdown charge of the semiconductor material, and the sacrificial layer is replaced with a dielectric.

摘要翻译： 公开了具有半导体主体的半导体部件的制造，其中布置有具有在垂直方向上延伸并且非常深地延伸到半导体本体中的截面的非常薄的电介质层。 在一种方法中，在从半导体主体的前侧开始的漂移区域中形成沟槽，在沟槽的至少一部分侧壁上产生牺牲层，并且沟槽的至少一部分填充有 半导体材料被选择为使得沟槽中的半导体材料的净掺杂剂电荷的商和半导体材料和漂移区域之间的沟槽的侧壁上的牺牲层的总面积小于击穿电荷 的半导体材料，并且牺牲层被电介质代替。

公开(公告)号：US20140001552A1

公开(公告)日：2014-01-02

申请号：US13539973

申请日：2012-07-02

申请人： Franz Hirler ,  Hans Weber ,  Hans-Joachim Schulze ,  Uwe Wahl

发明人： Franz Hirler ,  Hans Weber ,  Hans-Joachim Schulze ,  Uwe Wahl

IPC分类号： H01L29/772 ,  H01L21/20 ,  H01L29/02

CPC分类号： H01L29/66712 ,  H01L29/0634 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/161 ,  H01L29/167 ,  H01L29/408 ,  H01L29/7395 ,  H01L29/7811 ,  H01L29/8611

摘要： A drift layer of a super junction semiconductor device includes first portions of a first conductivity type and second portions of a second conductivity type opposite to the first conductivity type. The first and second portions are formed both in a cell area and in an edge area surrounding the cell area, wherein an on-state or forward current through the drift layer flows through the first portions in the cell area. At least one of the first and second portions other than the first portions in the cell area includes an auxiliary structure or contains auxiliary impurities to locally reduce the avalanche rate. Locally reducing the avalanche rate increases the total voltage blocking capability of the super junction semiconductor device.

摘要翻译： 超结半导体器件的漂移层包括第一导电类型的第一部分和与第一导电类型相反的第二导电类型的第二部分。 第一和第二部分在单元区域和围绕单元区域的边缘区域中形成，其中通过漂移层的导通状态或正向电流流过单元区域中的第一部分。 电池区域中除了第一部分之外的第一和第二部分中的至少一个包括辅助结构或包含辅助杂质以局部降低雪崩率。 本地降低雪崩率提高了超结半导体器件的总电压阻断能力。

公开(公告)号：US20060118862A1

公开(公告)日：2006-06-08

申请号：US11262483

申请日：2005-10-28

申请人： Franz Hirler ,  Uwe Wahl ,  Thorsten Meyer ,  Michael Rub ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Carsten Schaffer

发明人： Franz Hirler ,  Uwe Wahl ,  Thorsten Meyer ,  Michael Rub ,  Armin Willmeroth ,  Markus Schmitt ,  Carolin Tolksdorf ,  Carsten Schaffer

IPC分类号： H01L29/94

CPC分类号： H01L29/66689 ,  H01L21/26586 ,  H01L29/0696 ,  H01L29/1045 ,  H01L29/1095 ,  H01L29/41758 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/66666 ,  H01L29/66704 ,  H01L29/78 ,  H01L29/7825

摘要： A lateral trench transistor has a semiconductor body having a source region, a source contact, a body region, a drain region, and a gate trench, in which a gate electrode which is isolated from the semiconductor body is embedded. A heavily doped semiconductor region is provided within the body region or adjacent to it, and is electrically connected to the source contact, and whose dopant type corresponds to that of the body region.

公开(公告)号：US20130307058A1

公开(公告)日：2013-11-21

申请号：US13475302

申请日：2012-05-18

申请人： Uwe Wahl ,  Franz Hirler ,  Hans Weber

发明人： Uwe Wahl ,  Franz Hirler ,  Hans Weber

IPC分类号： H01L29/78 ,  H01L29/06 ,  H01L21/20

CPC分类号： H01L29/0634 ,  H01L29/0653 ,  H01L29/1095 ,  H01L29/404 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/66143 ,  H01L29/66333 ,  H01L29/66348 ,  H01L29/66712 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/7802 ,  H01L29/7811 ,  H01L29/7813 ,  H01L29/872

摘要： A semiconductor device includes a semiconductor body having a first surface and a second surface opposite to the first surface. A superjunction structure in the semiconductor body includes drift regions of a first conductivity type and compensation structures alternately disposed in a first direction parallel to the first surface. Each of the charge compensation structures includes a first semiconductor region of a second conductivity type complementary to the first conductivity type and a first trench including a second semiconductor region of the second conductivity type adjoining the first semiconductor region. The first semiconductor region and the first trench are disposed one after another in a second direction perpendicular to the first surface.

摘要翻译： 半导体器件包括具有第一表面和与第一表面相对的第二表面的半导体本体。 半导体主体中的超结构结构包括第一导电类型的漂移区域和在与第一表面平行的第一方向上交替设置的补偿结构。 每个电荷补偿结构包括与第一导电类型互补的第二导电类型的第一半导体区域和包括与第一半导体区域相邻的第二导电类型的第二半导体区域的第一沟槽。 第一半导体区域和第一沟槽在垂直于第一表面的第二方向上依次布置。