Super Junction Semiconductor Device Comprising a Cell Area and an Edge Area
    1.
    发明申请
    Super Junction Semiconductor Device Comprising a Cell Area and an Edge Area 有权
    包括单元区域和边缘区域的超级结半导体器件

    公开(公告)号:US20140001552A1

    公开(公告)日:2014-01-02

    申请号:US13539973

    申请日:2012-07-02

    摘要: A drift layer of a super junction semiconductor device includes first portions of a first conductivity type and second portions of a second conductivity type opposite to the first conductivity type. The first and second portions are formed both in a cell area and in an edge area surrounding the cell area, wherein an on-state or forward current through the drift layer flows through the first portions in the cell area. At least one of the first and second portions other than the first portions in the cell area includes an auxiliary structure or contains auxiliary impurities to locally reduce the avalanche rate. Locally reducing the avalanche rate increases the total voltage blocking capability of the super junction semiconductor device.

    摘要翻译: 超结半导体器件的漂移层包括第一导电类型的第一部分和与第一导电类型相反的第二导电类型的第二部分。 第一和第二部分在单元区域和围绕单元区域的边缘区域中形成,其中通过漂移层的导通状态或正向电流流过单元区域中的第一部分。 电池区域中除了第一部分之外的第一和第二部分中的至少一个包括辅助结构或包含辅助杂质以局部降低雪崩率。 本地降低雪崩率提高了超结半导体器件的总电压阻断能力。

    Super junction semiconductor device comprising a cell area and an edge area
    2.
    发明授权
    Super junction semiconductor device comprising a cell area and an edge area 有权
    超结半导体器件包括单元区域和边缘区域

    公开(公告)号:US08866221B2

    公开(公告)日:2014-10-21

    申请号:US13539973

    申请日:2012-07-02

    IPC分类号: H01L29/66

    摘要: A drift layer of a super junction semiconductor device includes first portions of a first conductivity type and second portions of a second conductivity type opposite to the first conductivity type. The first and second portions are formed both in a cell area and in an edge area surrounding the cell area, wherein an on-state or forward current through the drift layer flows through the first portions in the cell area. At least one of the first and second portions other than the first portions in the cell area includes an auxiliary structure or contains auxiliary impurities to locally reduce the avalanche rate. Locally reducing the avalanche rate increases the total voltage blocking capability of the super junction semiconductor device.

    摘要翻译: 超结半导体器件的漂移层包括第一导电类型的第一部分和与第一导电类型相反的第二导电类型的第二部分。 第一和第二部分在单元区域和围绕单元区域的边缘区域中形成,其中通过漂移层的导通状态或正向电流流过单元区域中的第一部分。 电池区域中除了第一部分之外的第一和第二部分中的至少一个包括辅助结构或包含辅助杂质以局部降低雪崩率。 本地降低雪崩率提高了超结半导体器件的总电压阻断能力。

    Semiconductor Devices Including Superjunction Structure and Method of Manufacturing
    3.
    发明申请
    Semiconductor Devices Including Superjunction Structure and Method of Manufacturing 审中-公开
    包括超结构结构和制造方法的半导体器件

    公开(公告)号:US20130307058A1

    公开(公告)日:2013-11-21

    申请号:US13475302

    申请日:2012-05-18

    IPC分类号: H01L29/78 H01L29/06 H01L21/20

    摘要: A semiconductor device includes a semiconductor body having a first surface and a second surface opposite to the first surface. A superjunction structure in the semiconductor body includes drift regions of a first conductivity type and compensation structures alternately disposed in a first direction parallel to the first surface. Each of the charge compensation structures includes a first semiconductor region of a second conductivity type complementary to the first conductivity type and a first trench including a second semiconductor region of the second conductivity type adjoining the first semiconductor region. The first semiconductor region and the first trench are disposed one after another in a second direction perpendicular to the first surface.

    摘要翻译: 半导体器件包括具有第一表面和与第一表面相对的第二表面的半导体本体。 半导体主体中的超结构结构包括第一导电类型的漂移区域和在与第一表面平行的第一方向上交替设置的补偿结构。 每个电荷补偿结构包括与第一导电类型互补的第二导电类型的第一半导体区域和包括与第一半导体区域相邻的第二导电类型的第二半导体区域的第一沟槽。 第一半导体区域和第一沟槽在垂直于第一表面的第二方向上依次布置。