公开(公告)号：US11876233B2

公开(公告)日：2024-01-16

申请号：US16796636

申请日：2020-02-20

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Qianwen Chen

IPC: H01M50/10 ,  H01M10/0585 ,  H01M50/502

CPC classification number: H01M50/10 ,  H01M10/0585 ,  H01M50/502

Abstract: Thin Film Batteries are made of battery layers. Each battery layer has a substrate with one or more battery structures on the substrate surface. The battery structures have a first electrode connection and a second electrode, a first electrode (e.g. a cathode or anode) is electrically connected to the first electrode connection and a second electrode (e.g. an anode or cathode) is electrically connected to the second electrode connection. An electrolyte is at least partial disposed between and electrically connected to the first and second electrodes. A first edge connection on one of the substrate edges is physically and electrically connected to the first electrode connection. A second edge connection on one of the substrate edges is physically and electrically connected to the second electrode connection. An electrically insulating lamination is disposed on the substrate and covers the components except for the first and second edge connections, connected to respective battery electrodes. A first stack external connection electrical connects two or more of the first edge connections and a second stack external connection electrical connects two or more of the second edge connections. A first and second battery pole are connected to the respective first and second stack external connections. The TFBs are hermetically sealed.

公开(公告)号：US11850068B2

公开(公告)日：2023-12-26

申请号：US16697284

申请日：2019-11-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Rajeev Narayanan ,  Bing Dang ,  Katsuyuki Sakuma

IPC: A61B5/00 ,  H01B9/00

CPC classification number: A61B5/6826 ,  A61B5/0002 ,  A61B5/0017 ,  A61B2562/222 ,  H01B9/003

Abstract: A method, a structure, and a computer system for a modular sensing unit. The structure comprises a sensor module, a power cable ribbon, and a component module, wherein the component module is in communication with and detachable from the sensor module via the power cable ribbon.

公开(公告)号：US20230293013A1

公开(公告)日：2023-09-21

申请号：US18203619

申请日：2023-05-30

Applicant: International Business Machines Corporation

Inventor： Bo Wen ,  Bing Dang ,  Jeffrey L. Rogers ,  Duixian Liu

IPC: A61B5/00

CPC classification number: A61B5/0024 ,  A61B5/0022 ,  A61B5/0028 ,  A61B5/6833 ,  A61B5/7225 ,  A61B2562/046

Abstract: A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor. The server processor implements a software controller; and a skin-mountable WON tethered satellite that includes a wired satellite-server interface, coupled to the wearable WON server, and a tethered satellite near-field communications (NFC) wireless interface, configured to communicate with the hub-satellite NFC wireless interface, and coupled to the wired satellite-server interface.

公开(公告)号：US11685580B2

公开(公告)日：2023-06-27

申请号：US16535038

申请日：2019-08-07

Applicant: International Business Machines Corporation

Inventor： Rajeev Narayanan ,  Bing Dang

IPC: B65D55/06 ,  B65D55/02 ,  A61J1/03 ,  H04L67/12

CPC classification number: B65D55/028 ,  A61J1/035 ,  A61J2200/70 ,  H04L67/12

Abstract: A device for detecting a tampering of a product in a product packaging material. The device comprises a network of sensors integrated into the product packaging material; a microcontroller, the microcontroller configured to detect, by accessing the sensors of the sensor network, the tampering of the product packaging material; and a communication device for relaying information regarding a status of the product packaging material.

公开(公告)号：US20220363264A1

公开(公告)日：2022-11-17

申请号：US17302869

申请日：2021-05-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Erhan Bilal ,  Bo Wen ,  Nicholas Andrew Barra ,  JEFFREY L. ROGERS ,  Bing Dang ,  TIAN HAO

IPC: B60W40/08 ,  B60W50/14 ,  B60W10/04 ,  B60W10/18 ,  B60W10/20

Abstract: A method, a structure, and a computer system for assessing a cognitive state of a driver of a vehicle. The exemplary embodiments may include collecting data from one or more sensors positioned around the vehicle and calculating a distraction value, an engagement value, and a workload value corresponding to the driver of the vehicle based on the data. The exemplary embodiments may further include determining whether the driver exhibits a low cognitive state based on the distraction value and the engagement value, and, based on determining that the driver exhibits the low cognitive state, assuming control of the vehicle.

公开(公告)号：US11121005B2

公开(公告)日：2021-09-14

申请号：US16777977

申请日：2020-01-31

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US10833296B2

公开(公告)日：2020-11-10

申请号：US15715722

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525 ,  H01M10/0565 ,  H01M10/0562 ,  H01M10/04 ,  H01M6/40 ,  H01M6/18 ,  H01M2/10 ,  H01M2/08

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US20200274113A1

公开(公告)日：2020-08-27

申请号：US16283654

申请日：2019-02-22

Applicant: International Business Machines Corporation ,  FRONT EDGE TECHNOLOGY, INC.

Inventor： Bing Dang ,  Qianwen Chen ,  Yu Luo ,  John Knickerbocker ,  Jae-Woong Nah ,  Kai Liu ,  Po-wen Cheng ,  Tung-hsiu Shih ,  Mengnian Niu ,  Kai-wei Nieh

IPC: H01M2/06 ,  H01M10/052 ,  H01M10/0585 ,  H01M2/30

Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.

公开(公告)号：US20200083082A1

公开(公告)日：2020-03-12

申请号：US16670023

申请日：2019-10-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/683 ,  C08G59/06 ,  C09J163/00 ,  C09J171/00 ,  C08L63/00 ,  C08K3/04 ,  C09J9/00 ,  C08L71/00 ,  H01L21/02

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US10522406B2

公开(公告)日：2019-12-31

申请号：US15903973

申请日：2018-02-23

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/48 ,  H01L21/56 ,  H01L25/065

Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.