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126 条记录 (耗时 0.046 秒)

    Method of manufacture for microelectromechanical devices
    83.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07704772B2

    公开(公告)日：2010-04-27

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Diffusion barrier layer for MEMS devices
    84.
    发明授权
    Diffusion barrier layer for MEMS devices 失效
    用于MEMS器件的扩散阻挡层

    公开(公告)号：US07630114B2

    公开(公告)日：2009-12-08

    申请号：US11261236

    申请日：2005-10-28

    申请人： Hsin-Fu Wang ,  Ming-Hau Tung ,  Stephen Zee

    发明人： Hsin-Fu Wang ,  Ming-Hau Tung ,  Stephen Zee

    IPC分类号： G02B26/00

    CPC分类号： G02B26/001 ,  B81B3/0072 ,  B81B2201/047 ,  B81C1/00793 ,  B81C2201/0167

    摘要： Described herein is the use of a diffusion barrier layer between metallic layers in MEMS devices. The diffusion barrier layer prevents mixing of the two metals, which can alter desired physical characteristics and complicate processing. In one example, the diffusion barrier layer may be used as part of a movable reflective structure in interferometric modulators.

    摘要翻译： 这里描述的是在MEMS器件中在金属层之间使用扩散阻挡层。 扩散阻挡层防止两种金属的混合，这可以改变期望的物理特性并使加工变得复杂。 在一个示例中，扩散阻挡层可以用作干涉式调制器中的可移动反射结构的一部分。

    Non-planar surface structures and process for microelectromechanical systems
    85.
    发明授权
    Non-planar surface structures and process for microelectromechanical systems 失效
    微机电系统的非平面表面结构和工艺

    公开(公告)号：US07623287B2

    公开(公告)日：2009-11-24

    申请号：US11406866

    申请日：2006-04-19

    申请人： Teruo Sasagawa ,  Lior Kogut ,  Ming-Hau Tung

    发明人： Teruo Sasagawa ,  Lior Kogut ,  Ming-Hau Tung

    IPC分类号： G02B26/00

    CPC分类号： B81B3/0008 ,  G02B26/001

    摘要： Methods of making MEMS devices including interferometric modulators involve depositing various layers, including stationary layers, movable layers and sacrificial layers, on a substrate. A non-planar surface is formed on one or more layers by flowing an etchant through a permeable layer. In one embodiment the non-planar surface is formed on a sacrificial layer. A movable layer formed over the non-planar surface of the sacrificial layer results in a non-planar interface between the sacrificial and movable layers. Removal of the sacrificial layer results in a released MEMS device having reduced contact area between the movable and stationary layers when the MEMS device is actuated. The reduced contact area results in lower adhesion forces and reduced stiction during actuation of the MEMS device. These methods may be used to manufacture released and unreleased interferometric modulators.

    摘要翻译： 制造包括干涉式调制器的MEMS器件的方法包括在衬底上沉积包括固定层，可移动层和牺牲层的各种层。 通过使蚀刻剂流过可渗透层而在一个或多个层上形成非平面表面。 在一个实施例中，非平面表面形成在牺牲层上。 形成在牺牲层的非平面表面上的可移动层导致牺牲层和可移动层之间的非平面界面。 牺牲层的去除导致释放的MEMS器件在MEMS器件致动时具有减小可移动层和固定层之间的接触面积。 减小的接触面积导致MEMS器件的致动期间较低的粘附力和降低的静摩擦力。 这些方法可用于制造释放和未释放的干涉式调制器。

    MEMS device and interconnects for same
    86.
    发明授权
    MEMS device and interconnects for same 失效
    MEMS器件和互连相同

    公开(公告)号：US07580172B2

    公开(公告)日：2009-08-25

    申请号：US11540485

    申请日：2006-09-29

    申请人： Alan G. Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory D. U'Ren ,  Stephen Zee

    发明人： Alan G. Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory D. U'Ren ,  Stephen Zee

    IPC分类号： G02F1/03 ,  G02B26/00

    CPC分类号： B81B7/0006 ,  B81B7/007 ,  B81B2201/047 ,  G02B26/001 ,  H02N1/006

    摘要： A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

    摘要翻译： 一种微机电系统装置，其具有在所述装置外部的电路和所述装置内的电极和可移动​​层中的至少一个之间的电互连。 电互连的至少一部分由与电极和器件的机械层之间的导电层相同的材料形成。 在一个实施例中，该导电层是牺牲层，其随后被去除以在电极和可移动​​层之间形成空腔。 牺牲层优选由钼，掺杂硅，钨或钛形成。 根据另一实施例，导电层是优选包括铝的可移动反射层。

    Method of fabricating interferometric devices using lift-off processing techniques
    87.
    发明授权
    Method of fabricating interferometric devices using lift-off processing techniques 失效
    使用剥离处理技术制造干涉仪的方法

    公开(公告)号：US07553684B2

    公开(公告)日：2009-06-30

    申请号：US11155379

    申请日：2005-06-17

    申请人： Clarence Chui ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Ming-Hau Tung

    IPC分类号： H01L21/00 ,  G02F1/03 ,  G02F1/07

    CPC分类号： G02B26/001

    摘要： Embodiments of the present disclosure include a method of fabricating interferometric devices using lift-off processing techniques. Use of lift-off processing in the fabrication of various layers of interferometric modulators, such as an optical stack or a flex layer, advantageously avoids individualized chemistries associated with the plurality of materials associated with each layer thereof. Moreover, use of lift-off processing allows much greater selection in both materials and facilities available for fabrication of interferometric modulators.

    摘要翻译： 本公开的实施例包括使用剥离处理技术制造干涉仪的方法。 在诸如光学堆叠或柔性层的各种干涉式调制器的制造中使用剥离处理有利地避免了与与其每层相关联的多种材料相关联的个体化化学物质。 此外，使用剥离处理可以在可用于制造干涉式调制器的材料和设备中进行更大的选择。

    MICROELECTROMECHANICAL DEVICE AND METHOD UTILIZING CONDUCTING LAYERS SEPARATED BY STOPS
    89.
    发明申请
    MICROELECTROMECHANICAL DEVICE AND METHOD UTILIZING CONDUCTING LAYERS SEPARATED BY STOPS 失效
    微电子设备和利用STOPS分离的导电层的方法

    公开(公告)号：US20080239455A1

    公开(公告)日：2008-10-02

    申请号：US11692734

    申请日：2007-03-28

    申请人： Lior Kogut ,  Ming-Hau Tung

    发明人： Lior Kogut ,  Ming-Hau Tung

    IPC分类号： G02B26/00 ,  G09G5/00 ,  H01S4/00

    CPC分类号： B81B3/001 ,  B81B2201/047 ,  G02B26/001 ,  G02B26/0841 ,  Y10T29/49002

    摘要： A microelectromechanical system (MEMS) device includes a reflective element that includes at least one stop member. The device also includes an electrode and an aperture that extends at least partially through the electrode. The aperture has a boundary. The device has an electrically nonconductive surface within the aperture or on a portion of the boundary of the aperture. A support structure separates the reflective element from the electrode. The reflective element can be moved between a first position and a second position. The stop member is spaced from the electrically nonconductive surface when the reflective element is in the first position. A portion of the stop member is in contact with the electrically nonconductive surface when the reflective element is in the second position. The reflective element and the electrode are electrically isolated from each other when the reflective element is in the second position.

    摘要翻译： 微机电系统（MEMS）装置包括包括至少一个止动构件的反射元件。 该装置还包括至少部分延伸穿过电极的电极和孔。 光圈有一个边界。 该装置在孔的内部或孔的边界的一部分上具有非导电表面。 支撑结构将反射元件与电极分开。 反射元件可以在第一位置和第二位置之间移动。 当反射元件处于第一位置时，止动件与非导电表面间隔开。 当反射元件处于第二位置时，止动构件的一部分与非导电表面接触。 当反射元件处于第二位置时，反射元件和电极彼此电隔离。

    Spatial light modulator with integrated optical compensation structure
    90.
    发明授权
    Spatial light modulator with integrated optical compensation structure 有权
    具有集成光学补偿结构的空间光调制器

    公开(公告)号：US07342705B2

    公开(公告)日：2008-03-11

    申请号：US11036965

    申请日：2005-01-14

    申请人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    发明人： Clarence Chui ,  Jeffrey B. Sampsell ,  William J. Cummings ,  Ming-Hau Tung

    IPC分类号： G02B26/00

    CPC分类号： G02F1/21 ,  G02B26/001 ,  G02F1/1335 ,  G02F2001/13356

    摘要： A spatial light modulator comprises an integrated optical compensation structure, e.g., an optical compensation structure arranged between a substrate and a plurality of individually addressable light-modulating elements, or an optical compensation structure located on the opposite side of the light-modulating elements from the substrate. The individually addressable light-modulating elements are configured to modulate light transmitted through or reflected from the transparent substrate. Methods for making such spatial light modulators involve fabricating an optical compensation structure over a substrate and fabricating a plurality of individually addressable light-modulating elements over the optical compensation structure. The optical compensation structure may be a passive optical compensation structure. The optical compensation structure may include one or more of a supplemental frontlighting source, a diffuser, a black mask, a diffractive optical element, a color filter, an anti-reflective layer, a structure that scatters light, a microlens array, and a holographic film.

    摘要翻译： 空间光调制器包括集成的光学补偿结构，例如，布置在基板和多个可单独寻址的光调制元件之间的光学补偿结构，或位于光调制元件的相对侧上的光学补偿结构 基质。 可单独寻址的光调制元件被配置为调制透射通过或从透明基板反射的光。 制造这种空间光调制器的方法包括在衬底上制造光学补偿结构，并在光学补偿结构上制造多个单独可寻址的光调制元件。 光学补偿结构可以是无源光学补偿结构。 光学补偿结构可以包括补充前照明光源，漫射器，黑色掩模，衍射光学元件，滤色器，抗反射层，散射光的结构，微透镜阵列和全息图中的一个或多个 电影。