USING A MICROFLUID MIXER
    85.
    发明申请
    USING A MICROFLUID MIXER 失效
    使用微流控混合器

    公开(公告)号:US20120163116A1

    公开(公告)日:2012-06-28

    申请号:US13413019

    申请日:2012-03-06

    IPC分类号: B01F15/06 C04B35/64

    摘要: A method includes directing first and second fluids into a plurality of first ports fluidly connected to a mixing chamber disposed between a first plate and a base plate, guiding the first and second fluids into a mixing chamber, directing the first and second fluid into a plurality of second ports fluidly connected to the plurality of first ports, guiding the first and second fluids from the plurality of second ports into another mixing chamber disposed between a second plate and the first plate and fluidly connected to the mixing chamber, activating a heating element to heat one of the first and second fluids entering the mixing chamber, creating a temperature gradient between the first and second fluids entering the mixing chamber, and operating a diaphragm operatively associated with the mixing chamber and the another mixing chamber to agitate the first and second fluids to form a fluid mixture.

    摘要翻译: 一种方法包括将第一和第二流体引导到流体连接到设置在第一板和基板之间的混合室的多个第一端口中,将第一和第二流体引导到混合室中,将第一和第二流体引导到多个 第二端口流体连接到多个第一端口,将第一和第二流体从多个第二端口引导到设置在第二板和第一板之间并流体连接到混合室的另一混合室中,激活加热元件 加热进入混合室的第一和第二流体之一,在进入混合室的第一和第二流体之间产生温度梯度,以及操作与混合室和另一个混合室可操作地相连的隔膜,以搅拌第一和第二流体 以形成流体混合物。

    Microfluid mixer, methods of use and methods of manufacture thereof
    86.
    发明授权
    Microfluid mixer, methods of use and methods of manufacture thereof 失效
    微流体混合器,使用方法及其制造方法

    公开(公告)号:US08206025B2

    公开(公告)日:2012-06-26

    申请号:US11834973

    申请日:2007-08-07

    IPC分类号: B01F11/00 B01F15/06

    摘要: Disclosed herein is a mixer comprising a base plate; a top plate in intimate contact with a surface of the base plate; the intimate contact preventing a fluid loss from the bottom plate; the top plate comprising a plurality of first ports for the entry of a first fluid and a second fluid; a mixing chamber in fluid communication with the plurality of first ports; a first heating element; and an exit channel for removing an intimate mixture of the first fluid and the second fluid; and a reciprocatory device in physical contact with the mixing chamber; the reciprocatory device being operative to agitate the first fluid and the second fluid.

    摘要翻译: 本文公开了一种包括基板的混合器; 顶板与基板的表面紧密接触; 紧密接触防止底板流体流失; 所述顶板包括用于进入第一流体和第二流体的多个第一端口; 与所述多个第一端口流体连通的混合室; 第一加热元件; 以及用于去除第一流体和第二流体的紧密混合物的出口通道; 以及与所述混合室物理接触的往复装置; 往复运动装置可操作以搅拌第一流体和第二流体。

    Microjet module assembly
    88.
    发明授权
    Microjet module assembly 失效
    微型喷枪组件

    公开(公告)号:US07516776B2

    公开(公告)日:2009-04-14

    申请号:US10908622

    申请日:2005-05-19

    IPC分类号: H05K7/20

    摘要: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

    摘要翻译: 低压降热组件,制造用于高功率通量情况的低压降热组件的系统和方法。 歧管主体连接到分配器以形成子组件。 该子组件与衬底表面连通,衬底表面具有需要对其进行热管理的半导体器件。 在目标衬底表面和子组件之间形成封闭空腔,并且空腔的密封件保护驻留在半导体器件的有源表面上的关键部件。 分配器包括与分布式微喷射排放阵列隔离并平行的分布式液体冲击微喷射入口阵列,用于冲击冷却流体并在与目标表面正交的方向上去除用过的热的流体,以最大化传热速率,从而提供高冷却通量 同时实现低压降。

    HIGH POWER MICROJET COOLER
    89.
    发明申请
    HIGH POWER MICROJET COOLER 有权
    高功率微型冷却器

    公开(公告)号:US20080282720A1

    公开(公告)日:2008-11-20

    申请号:US12182304

    申请日:2008-07-30

    IPC分类号: F28D5/00 F25D23/12

    摘要: A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.

    摘要翻译: 一种用于热控制的分配设备,系统和方法,其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征,以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减,同时还增加了暴露于冲击液体的板的表面积,这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。