公开(公告)号：US20070295480A1

公开(公告)日：2007-12-27

申请号：US11426423

申请日：2006-06-26

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/908 ,  Y10T29/49002 ,  H01L2924/00

摘要： A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

摘要翻译： 提供多流体冷却系统及其制造方法，用于从一个或多个电子设备去除热量。 冷却系统包括具有至少一个第一流体入口孔口和至少一个第二流体入口孔口的多流体歧管结构，用于在采用冷却系统时同时单独地将第一流体和第二流体注入待冷却的表面上 以冷却一个或多个电子设备，其中所述第一流体和所述第二流体是不混溶的，并且所述第一流体具有比所述第二流体低的沸点温度。 当冷却系统用于冷却一个或多个电子装置和第一流体沸腾时，放出的第一流体蒸汽通过与较高沸点温度的第二流体直接接触而原位冷凝。

公开(公告)号：US07283358B2

公开(公告)日：2007-10-16

申请号：US11184524

申请日：2005-07-19

申请人： Levi A. Campbell ,  Ricahrd C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Ricahrd C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  F24F13/04 ,  H05K7/20736

摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

摘要翻译： 提供了一种装置和方法，用于促进使用联接到电子机架的空气输送结构的电子机架的冷却。 空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流 。 输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却 的电子机架。

公开(公告)号：US07233494B2

公开(公告)日：2007-06-19

申请号：US11124064

申请日：2005-05-06

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

公开(公告)号：US07206203B2

公开(公告)日：2007-04-17

申请号：US10873432

申请日：2004-06-22

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

IPC分类号： H05K7/20 ,  H01L23/34 ,  H02G3/03 ,  F28F7/00

CPC分类号： H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

摘要翻译： 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。

公开(公告)号：US09480186B2

公开(公告)日：2016-10-25

申请号：US11958528

申请日：2007-12-18

申请人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

发明人： Steven J. Ahladas ,  David P. Graybill ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Prabjit Singh ,  Gerard V. Weber, Jr.

IPC分类号： H05K5/00 ,  H05K7/20

CPC分类号： H05K7/20745 ,  H05K7/20736

摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.

摘要翻译： 提供了用于促进电子机架的空气冷却的装置和方法。 该装置包括瓦片组件，温度传感器和控制器。 瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。 温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。 基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。 在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

公开(公告)号：US09207002B2

公开(公告)日：2015-12-08

申请号：US13271304

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12 ,  F25B21/02 ,  F25B43/00 ,  H05K7/20 ,  B23P15/26

CPC分类号： F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

摘要： Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

摘要翻译： 提供了便于冷却电子部件的装置和方法。 该装置包括蒸气压缩式制冷系统，其包括膨胀部件，蒸发器，压缩机和流体连通的冷凝器。 蒸发器与电子部件联接并冷却。 该装置还包括与制冷剂流动路径流体连通的污染物分离器。 分离器包括制冷剂冷滤器和热电阵列。 通过制冷剂流路的制冷剂的至少一部分通过冷过滤器，并且热电阵列向冷过滤器提供冷却以冷却通过过滤器的制冷剂。 通过冷却通过过滤器的制冷剂，污染物从制冷剂中固化，并沉积在冷过滤器中。 分离器还可以包括耦合到热电阵列的热侧的制冷剂热过滤器，用于进一步过滤制冷剂。

公开(公告)号：US09167721B2

公开(公告)日：2015-10-20

申请号：US13305937

申请日：2011-11-29

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20281 ,  F24F3/14 ,  F24F11/30 ,  F24F2110/20 ,  F25B2600/13 ,  F25D17/02 ,  F25D31/002 ,  F25D2317/04131 ,  H05K7/20781 ,  H05K7/20836

摘要： A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

摘要翻译： 提供了一种冷却装置和方法。 冷却装置包括冷却剂冷却的热交换器，用于便于散发在电子机架内产生的热量和冷却剂控制装置。 冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。 控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂 泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

公开(公告)号：US09045995B2

公开(公告)日：2015-06-02

申请号：US13103233

申请日：2011-05-09

申请人： David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Enrico A. Romano ,  Roger R. Schmidt ,  Gerard V. Weber, Jr.

发明人： David P. Graybill ,  Allan R. Hoeft ,  Madhusudan K. Iyengar ,  Donald W. Porter ,  Enrico A. Romano ,  Roger R. Schmidt ,  Gerard V. Weber, Jr.

IPC分类号： F01D15/10 ,  F02C6/00 ,  H02K7/18 ,  H02P9/04 ,  F02B63/04 ,  F03G7/08 ,  F03B13/00 ,  F03B13/10 ,  F01D15/08

CPC分类号： F01D15/10 ,  F01D15/08 ,  F03B13/00

摘要： An electronics rack with a cooling apparatus and a liquid-coolant-driven, electricity-generating system. The generating system includes a housing coupled in fluid communication with a fluid transport pipe of the cooling apparatus, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the electronics rack.

摘要翻译： 具有冷却装置和液体冷却剂驱动的发电系统的电子机架。 所述发电系统包括与所述冷却装置的流体输送管道流体连通的壳体，设置在所述壳体内并且被定位成随着流过所述叶轮的流体而转动的叶轮，一个或多个磁性结构， 叶轮和电路。 通过一个或多个磁性结构的转动为电路产生电，并且被提供给设置在电子机架中或与电子机架相关联的电负载。

公开(公告)号：US08824143B2

公开(公告)日：2014-09-02

申请号：US13271262

申请日：2011-10-12

申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20627 ,  H05K7/20772 ,  H05K7/20836

摘要： A combined power and cooling apparatus is provided facilitating powering and cooling one or more electronics racks, which are distinct from the power and cooling apparatus. The power and cooling apparatus includes a frame, one or more bulk power assemblies associated with the frame, and one or more heat exchange assemblies associated with the frame. The one or more bulk power assemblies are configured to provide power to the one or more electronics racks, and the one or more heat exchange assemblies are configured to cool system coolant provided to the one or more electronics racks. Heat is transferred by the one or more heat exchange assemblies from the system coolant to a facility coolant. In operation, the power and cooling apparatus is coupled to provide both power and cooling to the one or more electronics racks.

摘要翻译： 提供了组合的动力和冷却装置，其有助于对与动力和冷却装置不同的一个或多个电子机架供电和冷却。 动力和冷却装置包括框架，与框架相关联的一个或多个主体动力组件以及与框架相关联的一个或多个热交换组件。 所述一个或多个主体动力组件被配置成向所述一个或多个电子机架提供动力，并且所述一个或多个热交换组件被配置为冷却提供给所述一个或多个电子机架的系统冷却剂。 热量由一个或多个热交换组件从系统冷却剂传送到设备冷却剂。 在操作中，电源和冷却装置被耦合以向一个或多个电子机架提供电力和冷却。

公开(公告)号：US08813515B2

公开(公告)日：2014-08-26

申请号：US12939574

申请日：2010-11-04

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC分类号： F25D23/12

CPC分类号： F25B21/02 ,  F25B40/00 ,  H05K7/20836

摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

摘要翻译： 提供了用于促进电子部件的冷却的装置和方法。 该装置包括制冷剂回路，耦合到制冷剂回路的压缩机以及与制冷剂回路热连通地设置的可控热电阵列。 流过制冷剂回路的制冷剂有助于从电子部件散发热量，并且热电阵列设置有位于压缩机上游的制冷剂回路的第一部分与阵列的第一侧热接触，第二部分 位于压缩机下游的制冷剂回路的一部分与阵列的第二侧热接触。 热电阵列确保进入压缩机的制冷剂回路中的制冷剂通过将通过第二部分的制冷剂的热量传递通过制冷剂回路的第一部分的制冷剂而处于过热的热力学状态。