摘要:
A dynamic memory device including 1-transistor, 1-capacitor type dynamic memory cell, wherein a half voltage of the writing voltage is applied to a cell plate, and a constant voltage is applied to the substrate.
摘要:
When any one of memory cells (MC.sub.1R, MC.sub.NR and MC.sub.1L, MC.sub.NL) connected with respective bit lines (3.sub.R, 4.sub.R and 3.sub.L, 4.sub.L) is addressed, the gate potential of a transfer transistor group (7.sub.R, 8.sub.R or 7.sub.L, 8.sub.L) connected with the bit lines on the non-selected side is clamped at bit line precharge voltage, whereby the said transfer transistor group (7.sub.R, 8.sub.R or 7.sub.L, 7.sub.L) is turned off. Thus, the bit lines on the non-selected side are cut off at a high speed from a sense amplifier.
摘要:
A random access type semiconductor memory comprises a plurality of word lines (44; 54) of a metal arranged in parallel, at least first to fourth bit lines (BL1, BL2, BL1, BL2) orthogonal to the word lines, a plurality of memory cells (48; 58a, 58b), each of which is arranged corresponding to one of cross points between each of the word lines and each of the bit lines, a first sense amplifier (SA1) connected to the first and third bit lines (BL1, BL1) and a second sense amplifier (SA2) connected to the second and fourth bit lines (BL2, BL2). The first sense amplifier (SA1) amplifies a voltage applied to said first or third bit line from a selected first memory cell and the second sense amplifier (SA2) amplifies a voltage applied to the second or fourth bit line from a selected second memory cell.
摘要:
An input protective circuit of MIS type device is used by applying reverse bias voltage to a semiconductor substrate and a variable-conductivity element is connected between the input terminal of the MIS type device and the ground so that the input terminal is in conductive state to the ground when the reverse bias voltage is not applied to the semiconductor substrate and the input terminal is in non-conductive state to the ground when the reverse bias voltage is applied to the semiconductor substrate.
摘要:
The single input gate electrode in a conventional CCD shift register is replaced by four spaced electrodes. The fourth electrode adjacent to the first transfer electrode has an area larger than that of the second electrode which always has a DC voltage applied thereto. Three driving pulses are applied in a predetermined sequence to the first, third and fourth electrodes while the two bit values of 2-bit information are written into the register and a charge is accumulated directly under the fourth input gate electrode at one of four levels as determined by the combination of the write bit values. Then the accumulated charge is stepwise transferred in the same manner as in conventional CCD shift registers.
摘要:
The disclosure described a substrate bias generating circuit in which an internal RAS (Row Address Strobe) signal and an internal CAS (Column Address Strobe) signal, both of which are synchronized with an external RAS signal and external CAS supplied from outside in addition to self-oscillator, activate circuits .[.comprising.]. .Iadd.including .Iaddend.capacitors and rectifying elements respectively so as to reduce wattage dissipation thereof during holding time of RAM and be obtained increased charge pump current during operation thereof.
摘要:
A semiconductor memory device comprises a plurality of memory cells arranged in a plurality of rows and columns, a plurality of row decoders for selecting one row of the plurality of rows, spare memory cells arranged in one row and a spare decoder for selecting the spare memory cells arranged in the one row. Each of the row decoders comprises a link element which can be melted by a laser beam. A plurality of decoder state determining logical circuits are provided corresponding to the plurality of row decoders. If and when a defective memory cell exists of the memory cells arranged in one row corresponding to each of the row decoders, the link element in the row decoder is melted in advance. When the row decoder having the link element melted in advance is selected by address signals, a corresponding decoder state determining logical circuit generates an SEE signal. The spare decoder is selected in place of the row decoder by the SEE signal.
摘要:
A semiconductor memory device includes a plurality of operation mode control circuits provided on a memory chip of the device for respectively executing a corresponding plurality of writing/reading operation modes including at least a static column mode, a high speed page mode and a nibble mode, and a plurality of operation mode selection circuits provided on the memory chip, each of the operation mode selection circuits having a fuse element and a bonding pad for selecting one of the plurality of the operation mode control circuits when the fuse element is cut off or the bonding pad is selectively wired, so that various functions can be selectively effected on the same chip.
摘要:
44Gate potentials of transistors Q.sub.R0 and Q.sub.R1 provided in an active pull-up circuit APo are always controlled to be appropriate values by a clock signal .phi..sub.p. As a result, reverse flow of electric charge from a capacitor C.sub.R0 or C.sub.R1 to a bit line LB or BL can be prevented and unfavorable influence due to such reverse flow of electric charge can be avoided in operation of the active pull-up circuit APo.
摘要:
A semiconductor memory device comprises a data input switching circuit (20) connected between the output side of a write check bit generating circuit (2) and the input side of a check bit memory cell array (32), a data output switching circuit (30) connected to the input side of an address decoder (9), and an address switching circuit (10) connected to the output side of the address decoder (9). When a test mode is entered, the data input switching circuit (2), data output switching circuit (30) and address switching circuit (10) connect a data input signal line (l), data output signal line (m) and address signal line (n), respectively, to the check bit memory cell array (32), enabling the check bit memory cell array (32) to be accessed from the outside.