摘要:
A DRAM comprises equalizing capacitance for equalizing the difference between a potential on a bit line to which a selected memory cell is connected and a potential on a reference bit line paired with the bit line when the selected memory cell stores "H" information and that when the selected memory cell stores "L" information, before sensing operation is started. The amplitude of a potential on a selected word line is at an operating power-supply voltage Vcc level of the DRAM.
摘要:
A circuit for generating a boosted signal for a word line, coupled to a word line driving signal line for transmitting a voltage signal to the word line, coupled to a first power supply, and coupled to a second power supply for providing a voltage higher than the voltage of the first power supply, can supply a compensating voltage for the word line from the second power supply through the word line driving signal line when a voltage of the word line is decreased.
摘要:
A dynamic type MOS-RAM constructed of folded type bit lines and having sense operation cycles for amplifying potential difference appearing on respective pairs of bit lines after selection of a word line and restore operation cycles for further amplifying the potential difference on the pairs of bit lines after the sense operation cycles, wherein non-selected word lines are completely brought into electrically floating states in intervals including the sense operation cycles and the restore operation cycles.
摘要:
A semiconductor memory comprises memory cells (15-18, 27-30), a data writing terminal (1), a data readout terminal (48), transistors (3-10, 35-42), address signal input terminals (23-26), subdecode signal input terminals (43-46), driving signal generating circuits (49-52), parallel readout circuits (79-82) and test mode switching signal input terminal (53, 88). In writing of function test data for the memory cells, the driving signal generating circuits turn all of the transistors (3-10) on in response to a test mode switching signal with no regard to address signals, thereby to simultaneously write data in the memory cells (15-18). Further, in readout of the function test data for the memory cells, the parallel readout circuits read the storage contents of the memory cells (27-30) storing the test data in response to a test mode switching signal with no regard to subdecode signals. Logic circuit means (90, 91, 94) may be provided to output logical value corresponding to the test data stored in the memory cells when all of the logical values of the test data are at the same level.
摘要:
A semiconductor memory device with a laser programmable redundancy circuit, which includes: a plurality of decoders for selecting a row or column of the memory; at least one spare decoder which is selected instead of a decoder connected to a faulty memory cell; a link element inserted in series with the precharging transistor and connected between the power supply and the decoder output line; a signal generator which generates a non-selection signal for making the object decoder unselected only when a spare decoder is selected, the signal generator being provided in the spare decoder; and a transistor, having a gate to which the non-selection signal is input, with the drain and the source thereof being connected to the decoder output and ground, respectively, the transistor being provided in the decoder.
摘要:
Disclosed is a semiconductor memory device which is operable in a selected one of page mode and nibble mode, depending upon the length of time in which an external column address strobe signal stays at a specific level. The semiconductor memory device comprises a circuit for discriminating the length of time where the external column address strobe signal is at a specific level with a predetermined period of time. Data is outputted in page mode in response to one of results of such discrimination and in nibble mode in response to the other result of the discrimination. The discriminating circuit may comprise a second internal column address strobe signal generator and a delay circuit. The second internal column address strobe signal generator includes a NAND circuit at its first stage, and the delay circuit is designed to have different delay times at the building-up and downward edges of an input signal applied thereto. The output of the discriminator is used to operate and reset an output circuit whereby one of the output modes is selected.
摘要:
A semiconductor dynamic random access memory is provided comprising bit line pairs divided into groups and sense amplifiers, one for each bit line pair group provided on one side of the bit line pairs in a line. When a word line is selected, only one bit line pair is released from a precharge.equalize state to be connected to a corresponding sense amplifier in each bit line pair group in accordance with address information of the word line. Memory cells are arranged such that only one memory cell is connected to the selected word line in each bit line pair group.
摘要:
A semiconductor dynamic RAM provided with an I/O load (5) rendered inactive during a writing cycle comprises a monostable multivibrator (16) for receiving a read/write indicating signal W for indicating reading and writing data from and into a memory cell (2) and outputting a signal W having a shorter duration than that of the signal W at a down edge of the signal W as a trigger. The output signal W of the monostable multivibrator (16) is supplied as a control signal for rendering the I/O load (5) inactive.
摘要:
44Gate potentials of transistors Q.sub.R0 and Q.sub.R1 provided in an active pull-up circuit APo are always controlled to be appropriate values by a clock signal .phi..sub.p. As a result, reverse flow of electric charge from a capacitor C.sub.R0 or C.sub.R1 to a bit line LB or BL can be prevented and unfavorable influence due to such reverse flow of electric charge can be avoided in operation of the active pull-up circuit APo.
摘要:
A semiconductor memory device comprises a data input switching circuit (20) connected between the output side of a write check bit generating circuit (2) and the input side of a check bit memory cell array (32), a data output switching circuit (30) connected to the input side of an address decoder (9), and an address switching circuit (10) connected to the output side of the address decoder (9). When a test mode is entered, the data input switching circuit (2), data output switching circuit (30) and address switching circuit (10) connect a data input signal line (l), data output signal line (m) and address signal line (n), respectively, to the check bit memory cell array (32), enabling the check bit memory cell array (32) to be accessed from the outside.