摘要:
A semiconductor disk wherein a flash memory into which data is rewritten in block unit is employed as a storage medium, the semiconductor disk including a data memory in which file data are stored, a substitutive memory which substitutes for blocks of errors in the data memory, an error memory in which error information of the data memory are stored, and a memory controller which reads data out of, writes data into and erases data from the data memory, the substitutive memory and the error memory. Since the write errors of the flash memory can be remedied, the service life of the semiconductor disk can be increased.
摘要:
Disclosed herewith is a circuit system for improving a slew rate while reducing the power consumption in an operational amplifier that requires a comparatively high supply voltage (e.g., 5 V or upper) operation. The operational amplifier includes level shift circuits, differential pairs whose source connected serially, current voltage conversion circuit and output stage. The level shift circuits convert a differential input signal level and output to differential pairs. Combination of level shift circuit and differential pairs realize input signal difference detection and driving current control in the common circuit.
摘要:
Provided are a stream distribution system and a failure detection method capable of easily identifying the cause of quality loss in stream distribution. This stream distribution system includes a first server for communicating with a client terminal via a router and sending stream data, and a second server configured as a redundant server of the first server and connected to the first server. The first server has a communication status notification unit for sending a connection management table concerning the communication with the client terminal to the second server. The second server has a packet recording unit for acquiring a mirror packet, which is a copy of a packet sent to the first server, from the router, and a network failure monitoring unit for detecting a failure in a network between the first server and the client terminal based on the connection management table and a packet buffer.
摘要:
A trench is formed in an insulation film formed on top of a semiconductor substrate, and a barrier metal film is formed on the surface of the trench. After a copper or copper alloy film is formed on the barrier metal film, an oxygen absorption film in which a standard energy of formation of an oxidation reaction in a range from room temperature to 400° C. is negative, and in which an absolute value of the standard energy of formation is larger than that of the barrier metal film is formed, and the assembly is heated in a temperature range of 200 to 400° C. A semiconductor device can thereby be provided that has highly reliable wiring, in which the adhesion to the barrier metal film in the copper interface is enhanced, copper diffusion in the interface is suppressed, and electromigration and stress migration are prevented.
摘要:
There are provided with a wiring structure and a method for manufacturing the same wherein in a wiring structure of multi-layered wiring in which a metal wiring is formed on a substrate forming a semiconductor element thereby obtaining connection of the element, no damage to insulation property between the abutting wirings by occurrence of leakage current and no deterioration of insulation resistance property between the abutting wirings are achieved in case that fine metal wiring is formed in a porous insulation film. The insulation barrier layer 413 is formed between an interlayer insulation film and the metal wiring, in the metal wiring structure on the substrate forming the semiconductor element. The insulation barrier layer enables to reduce leakage current between the abutting wirings and to elevate the insulation credibility.
摘要:
There are disclosed a stencil printing ink having an ink thread-forming length when a 15 mm diameter chrome steel ball is pulled out of the ink at 150 mm/s of 30 mm or longer at 23° C.; and a stencil printing ink comprising a water-based ink comprising an unsaturated straight-chain carboxylic acid-based water-soluble polymer.
摘要:
The present invention provides a multilayer wiring technology by which high adhesiveness and high insulation reliability between wirings are obtained, while maintaining effective low capacitance between wirings. A semiconductor device is characterized in that a first insulating film is an insulating film formed of at least one layer which contains a siloxane structure containing silicon, oxygen and carbon; the siloxane structure in the inner part of the first insulating film contains a larger number of carbon atoms than the number of silicon atoms; and a modified layer which containing a smaller number of carbon atoms and a larger number of oxygen atoms per unit volume than the inner part of the first insulating film is formed on at least one of an interface between the first insulating film and the metal and an interface between the first insulating film and a second insulating film.
摘要:
A content delivery system includes a delivery server, a storage apparatus having a logical unit for storing data regarding content items, and a management apparatus having a content management unit for managing a delivery server. The delivery server includes a conversion unit and a delivery unit. The conversion units acquires original data regarding a content item from an external origin server in response to a content addition request from the content management unit, converts the original data to data for delivery, and stores the content data for delivery in the first logical unit. The delivery unit reads, in response to a content delivery request from the client, the data for delivery from the logical unit and transmits it to the client.
摘要:
A method of forming a porous insulation film uses an organic silica material gas having a 3-membered SiO cyclic structure and a 4-membered SiO cyclic structure, or an organic silica material gas having a 3-membered SiO cyclic structure and a straight-chain organic silica structure, and uses a plasma reaction in the filming process. A porous interlevel dielectric film having a higher strength and a higher adhesive property can be obtained.