摘要:
A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer, and an element isolation insulating film formed in the space and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and the upper surface of the first semiconductor layer.
摘要:
A semiconductor chip is provided with a phase comparison circuit (1), in addition to an integrated circuit implementing a normal operation. The phase comparison circuit (1) compares phases between an internal signal (A) of the integrated circuit and an external signal and outputs a monitor signal (MONSIG) expressing the result of this comparison outward from the semiconductor chip. Thus, the phase of the internal signal (A) of the integrated circuit can be directly detected.
摘要:
A clock signal, which is generated by utilizing a delay circuit having a delay time depending on the operation frequency of an internal clock signal, is applied to a first circuit for activation thereof, and a clock signal, which has a fixed delay not dependent on the clock frequency and is adjusted in phase with respect to an external clock signal, is applied to a second circuit receiving the output signal of the first circuit for operation thereof. Thus, the operation timing of the second circuit can be set to be as late as possible. Consequently, it is possible to mitigate the operation conditions of the first circuit, to achieve a high speed data transfer. Even in the high speed operation, internal data can be reliably taken in, and transferred accurately.
摘要:
A semiconductor memory device wherein, if an address-input buffer section 3 is arranged away from a central part of a memory chip 8, then a second address-latch circuit section 5 is arranged at a neighborhood of the address-input buffer section 3. By this means, the deterioration of the setup/hold characteristics in the address data IA[0-12] of the internal address signal due to coupling noise between wiring lines and the like can be prevented. A first address-latch circuit section 4 is arranged at a central part of the memory chip 8, so that delays in a bank-control signal for memory banks 2a to 2d and the like can be prevented. Further, if the address-input buffer section 3 is divided into a plurality of address-input buffers, for example, two buffers 3a and 3b, and arranged on the memory chip 8, then the second address-latch circuit section 5 is also divided into two address-latch circuits 5a and 5b, corresponding to the address-input buffers 3a and 3b, and the address-latch circuit 5a is arranged at a neighborhood of the address-input buffer 3a, and the address-latch circuit 5b is arranged at a neighborhood of the address-input buffer 3b.
摘要:
A pattern density inspection apparatus is provided which improves the detection accuracy of a pattern data density error region, and outputs detection results for a designer to efficiently perform a correction operation without performing detection of pattern data density error regions which do not require correction. A control section 1 reads out layout data from a layout storage section 2, and stores this in an input processing section 3 and an output processing section 7. A data density computation processing section 4, while displacing layout data of the input processing section 3 from a position where pattern data was computed immediately before, in either one of an X axis direction and a Y axis direction, performs computations of the pattern density in the detection range after movement, and judges if the pattern data density is above 50%, and makes that above 50% a temporary error region. An error overlap removal processing section 5 takes a logical sum of temporary error regions, and creates an aggregate temporary error region. An error region width computation processing section 6 judges if an aggregate temporary error region is an error shape which contains a 400 &mgr;m square error judgment reference shape.
摘要:
Data buses are arranged in a one-to-one correspondence to pads. These data buses are arranged in common to a plurality of memory arrays. A read data driver is rendered active selectively according to a word configuration to switch equivalently the connection between a memory array and a data bus.
摘要:
A command decoder receives an externally supplied command independently of an internal clock signal, decodes the command, generates a column access mode instruction signal, and activates a column address activation signal when the internal clock signal rises. An internal column address signal generating circuit generates an internal column address signal from an externally supplied address signal according to the column address activation signal. Accordingly, the internal column address is generated at an advanced timing to enable a following column selecting operation to be started at a faster timing. A synchronous semiconductor memory device capable of performing the column selecting operation at a high speed is thus provided.
摘要:
In a method of processing figure arrays in a figure processing apparatus, first and second figure arrays are sequentially inputted. A fractionalizing process is selectively performed to divide each of figure elements of the second figure array into a plurality of types of fractions based on presence/non-presence of an overlapping portion between the first and second figure arrays and an array data of the second figure array. The array data indicates an array pitch in each of horizontal and vertical directions and a number of figures in the direction. A figure array of fractions is produced for each type and the produced figure arrays is registered in chain groups which includes a chain group of the first figure array, such that the registered figure arrays have the same array data. Then, a figure operating process is performed to the chain group.
摘要:
First and second global input/output lines are twisted between first and second main blocks. First and second SD signal lines in the first main block are respectively arranged adjacent to first and second global input/output lines. First and second SD signal lines in the second main block are respectively arranged adjacent to the second and first global input/output lines. An SD signal supplied for the first or second SD signal line makes noises applied to the first and second global input/output lines identical, so that an influence by the noises is substantially eliminated between the first and second global input/output lines. As a result, the global input/output line is provided with higher resistance to noise without any increase in a layout area.
摘要:
A semiconductor memory device comprises a MOS-type transistor formed on a semiconductor substrate, a capacitor formed in the interior of an opening portion formed in the semiconductor substrate to be adjacent to the MOS-type transistor, the capacitor having a capacitor insulating film formed of a high dielectric film, and a line layer for connecting respective gate electrodes of the MOS-type transistor separated to be island-shaped to prevent from being presented on a region where the opening portion is formed, the line layer formed of a conductive layer different from the gate electrodes in its level.