公开(公告)号：US07411207B2

公开(公告)日：2008-08-12

申请号：US11782760

申请日：2007-07-25

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/274 ,  G01N21/47 ,  G01N21/4738 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01N2021/8854

摘要： An apparatus for inspecting particles and/or pattern defects of an object under inspection. Data processing means obtains information on size of the particles and/or the pattern defects from an intensity of the scattered light detected by the light detecting means by referring to a relationship between an intensity of scattered light from a standard particle and a size of the standard particle, and using a calibration coefficient for compensating for a change in intensity of the light of the illuminating means from a predetermined intensity.

摘要翻译： 一种用于检查被检查物体的颗粒和/或图案缺陷的装置。 数据处理装置通过参考来自标准粒子的散射光的强度与标准尺寸之间的关系，从光检测装置检测到的散射光的强度获得关于颗粒尺寸和/或图案缺陷的信息 并且使用用于从预定强度补偿照明装置的光的强度变化的校准系数。

公开(公告)号：US07332359B2

公开(公告)日：2008-02-19

申请号：US10082593

申请日：2002-02-22

申请人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

发明人： Akira Hamamatsu ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama

IPC分类号： H01L31/26

CPC分类号： H01L21/67271 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/95615

摘要： Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is inspected with the inspection condition. In an embodiment of the present invention, inspection uses images formed by the irradiation of white light, a laser light, or an electron beam. Data obtained from the inspection is used to generate a revised inspection condition. Semiconductor devices are inspected using the revised inspection condition.

摘要翻译： 检查半导体器件的技术。 设置使用芯片矩阵数据和芯片尺寸数据的检查条件。 在检查条件下检查至少一个半导体器件的复杂电路图案。 在本发明的实施例中，检查使用通过照射白光，激光或电子束形成的图像。 使用从检查获得的数据来生成修订的检查条件。 使用修订的检查条件检查半导体器件。

公开(公告)号：US20070265797A1

公开(公告)日：2007-11-15

申请号：US11782760

申请日：2007-07-25

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ohshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G06F15/00

CPC分类号： G01N21/274 ,  G01N21/47 ,  G01N21/4738 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956 ,  G01N2021/8854

摘要： An apparatus for inspecting particles and/or pattern defects of an object under inspection. Data processing means obtains information on size of the particles and/or the pattern defects from an intensity of the scattered light detected by the light detecting means by referring to a relationship between an intensity of scattered light from a standard particle and a size of the standard particle, and using a calibration coefficient for compensating for a change in intensity of the light of the illuminating means from a predetermined intensity.

摘要翻译： 一种用于检查被检查物体的颗粒和/或图案缺陷的装置。 数据处理装置通过参考来自标准粒子的散射光的强度与标准尺寸之间的关系，从光检测装置检测到的散射光的强度获得关于颗粒尺寸和/或图案缺陷的信息 并且使用用于从预定强度补偿照明装置的光的强度变化的校准系数。

公开(公告)号：US20070165212A1

公开(公告)日：2007-07-19

申请号：US11727037

申请日：2007-03-23

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Tetsuya Watanabe ,  Takuaki Sekiguchi

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Tetsuya Watanabe ,  Takuaki Sekiguchi

IPC分类号： G01N21/88

CPC分类号： G01N21/94 ,  G01N21/9501 ,  Y02P90/04 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/265

摘要： A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom.

摘要翻译： 用于监测异物的系统包括具有多个处理处理装置的生产线，管理制造线中的工件的处理的生产管理系统，与至少一个工件相关地监视异物的多个光学头，以及 提供指示其的输出信号，以及至少一个图像信号处理单元，其以比用于处理其输出信号的多个光学头的数量少的数量提供。

公开(公告)号：US20070146697A1

公开(公告)日：2007-06-28

申请号：US11681996

申请日：2007-03-05

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/88

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection apparatus includes an illumination optical unit for obliquely illuminating an object with a slit-like shaped laser, a first detection optical unit for detecting a first image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a first direction substantially normal to a surface of the object, a second detection optical unit for detecting a second image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a second direction inclined to the normal direction to the surface of the object, an image signal processing unit which processes a signal outputted from the first detection optical unit and a signal outputted from the second detection optical unit, and an output unit which outputs information processed by the image signal processing unit.

摘要翻译： 缺陷检查装置包括：用狭缝状激光器对物体进行倾斜照明的照明光学单元;第一检测光学单元，用于检测由所述狭缝状激光的照射而从物体反射的光形成的第一图像;以及 反射在基本上垂直于物体的表面的第一方向上;第二检测光学单元，用于检测由通过照射狭缝状激光而从物体反射的光形成的第二图像，并以与第二方向倾斜的第二方向反射 对象物的表面的正常方向，处理从第一检测光学单元输出的信号的图像信号处理单元和从第二检测光学单元输出的信号，以及输出单元，其输出由图像信号处理单元处理的信息 。

公开(公告)号：US20070146696A1

公开(公告)日：2007-06-28

申请号：US11681981

申请日：2007-03-05

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： G01N21/88

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for detecting defects on a specimen includes mounting a specimen on a table with which is movable, obliquely projecting a laser as a line onto a surface of the specimen, detecting with an image sensor an image of light formed by light reflected from the specimen and passed through a filter which blocks scattered light resulting from repetitive patterns formed on the specimen, processing a signal outputted from the image sensor to extract defects of the specimen, and a displaying information of defects extracted by the signal processor.

摘要翻译： 一种检测试样缺陷的方法，其特征在于，将试样安装在可移动的台面上，将作为线的激光线倾斜投射到试样的表面上，用图像传感器检测由试样反射的光形成的光的图像 通过滤波器，该滤波器阻挡由样本上形成的重复图案产生的散射光，处理从图像传感器输出的信号，提取样本的缺陷，以及由信号处理器提取的缺陷的显示信息。

公开(公告)号：US07211797B2

公开(公告)日：2007-05-01

申请号：US11098699

申请日：2005-04-05

申请人： Hidetoshi Nishiyama ,  Mari Nozoe

发明人： Hidetoshi Nishiyama ,  Mari Nozoe

IPC分类号： G21K7/00

CPC分类号： H01J37/026 ,  H01J37/226 ,  H01J37/28 ,  H01J2237/047 ,  H01J2237/2594 ,  H01J2237/2817

摘要： The present invention provides an inspection technique using a charged particle beam by which a method of setting a condition for optimally charging an object to be inspected without relying on an operator's experience is established and a voltage contrast image with higher efficiency of defect detection than ever before can be obtained. The inspection method comprises the steps of scanning an area on a surface of a substrate having a specific pattern formed thereon with a primary charged particle beam, detecting signals of secondary electrons emitted from the area, forming an image of the area from detected signals, and generating a histogram from the image. All these steps are performed each time a condition of irradiation with the charged particle beam is changed. When two or more separate peaks appear in the histogram, the histogram is determined as an optimal condition for inspection, and inspection is performed based on the image obtained under that condition.

摘要翻译： 本发明提供了使用带电粒子束的检查技术，通过该技术，建立了不依赖于操作者的经验来设定用于最佳地对被检查物体进行充电的条件的方法以及比以往更高的缺陷检测效率的电压对比图像 可以获得。 检查方法包括以下步骤：利用初级带电粒子束扫描其上形成有特定图案的基板的表面上的区域，检测从该区域发射的二次电子的信号，从检测到的信号形成该区域的图像，以及 从图像生成直方图。 每当改变带电粒子束照射的条件时，都执行所有这些步骤。 当直方图中出现两个或多个单独的峰时，直方图被确定为检查的最佳条件，并且基于在该条件下获得的图像进行检查。

公开(公告)号：US07115892B2

公开(公告)日：2006-10-03

申请号：US11302847

申请日：2005-12-13

申请人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

发明人： Hidetoshi Nishiyama ,  Minori Noguchi ,  Yoshimasa Ooshima ,  Akira Hamamatsu ,  Kenji Watanabe ,  Tetsuya Watanabe ,  Takahiro Jingu

IPC分类号： G01N21/88

CPC分类号： G01N21/4738 ,  G01N21/8806 ,  G01N21/93 ,  G01N21/94 ,  G01N21/9501 ,  G01N2015/1486 ,  G01N2015/1493

摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

公开(公告)号：US07098055B2

公开(公告)日：2006-08-29

申请号：US11244078

申请日：2005-10-06

申请人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

发明人： Minori Noguchi ,  Yoshimasa Ohshima ,  Hidetoshi Nishiyama ,  Shunichi Matsumoto ,  Yukio Kembo ,  Ryouji Matsunaga ,  Keiji Sakai ,  Takanori Ninomiya ,  Tetsuya Watanabe ,  Hisato Nakamura ,  Takahiro Jingu ,  Yoshio Morishige ,  Shuichi Chikamatsu

IPC分类号： H01L21/66 ,  G01R31/26

CPC分类号： B82Y15/00 ,  G01N21/94 ,  G01N21/95623 ,  G01N21/95684 ,  G01N2021/8822 ,  G01R31/308 ,  H01J37/00 ,  H01J2237/022 ,  H01J2237/0225 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/681 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.

公开(公告)号：US06924482B2

公开(公告)日：2005-08-02

申请号：US10395197

申请日：2003-03-25

申请人： Mari Nozoe ,  Mitsuo Suga ,  Yoichiro Neo ,  Hidetoshi Nishiyama

发明人： Mari Nozoe ,  Mitsuo Suga ,  Yoichiro Neo ,  Hidetoshi Nishiyama

IPC分类号： G01R31/28 ,  G01Q10/00 ,  G01Q30/04 ,  G01R31/307 ,  H01L21/00 ,  H01L21/66 ,  G21K7/00

CPC分类号： H01J37/222 ,  G01R31/307 ,  H01J37/256 ,  H01J37/263 ,  H01J37/265 ,  H01J37/266 ,  H01J2237/043 ,  H01J2237/24564 ,  H01J2237/2594 ,  H01J2237/2813 ,  H01J2237/2817 ,  H01J2237/304

摘要： Electron beam is irradiated to a wafer in the midst of steps at predetermined intervals by a plurality of times under a condition in which a junction becomes rearward bias and a difference in characteristic of a time period of alleviating charge in the rearward bias is monitored. As a result, charge is alleviated at a location where junction leakage is caused in a time period shorter than that of a normal portion and therefore, a potential difference is produced between the normal portion and a failed portion and is observed in a potential contrast image as a difference in brightness. By consecutively repeating operation of acquiring the image, executing an image processing in real time and storing a position and brightness of the failed portion, the automatic inspection of a designated region can be executed. Information of image, brightness and distribution of the failed portion is preserved and outputted automatically after inspection.

摘要翻译： 电子束在连接点成为向后偏置的状态下以预定间隔在步骤中照射到晶片，并且监视在向后偏置中减轻电荷的时间段的特性差。 结果，在比正常部分短的时间段内产生结漏电的位置处的电荷被减轻，因此在正常部分和失效部分之间产生电位差，并且在潜在对比图像中观察到电荷 作为亮度的差异。 通过连续重复获取图像的操作，实时执行图像处理并存储失败部分的位置和亮度，可以执行指定区域的自动检查。 故障部分的图像，亮度和分布信息在检查后自动保存并输出。