Method of making monolithic hub and strain relief
    81.
    发明授权
    Method of making monolithic hub and strain relief 失效
    制造单片轮毂和应变消除的方法

    公开(公告)号:US06273404B1

    公开(公告)日:2001-08-14

    申请号:US08971456

    申请日:1997-11-17

    IPC分类号: B29C4514

    摘要: A hub assembly for a catheter tube having a lumen therethrough. The hub assembly includes a hub portion having a proximal end and a distal end, and an integral connector disposed at the proximal end. A lumen is defined through the hub portion extending from the proximal end to the distal end. The strain relief includes a proximal end and a distal end is disposed at the distal end of the hub portion. The proximal end of the strain relief can be integrally connected to the distal end of the hub portion. The strain relief is preferably more flexible than the hub portion. The strain relief defines a passage configured to receive the catheter such that a lumen through the hub portion is in fluid communication with the catheter tube lumen.

    摘要翻译: 一种用于导管的轮毂组件,其具有通过其的腔。 毂组件包括具有近端和远端的毂部分,以及设置在近端处的整体式连接器。 通过从近端延伸到远端的毂部分限定内腔。 应变消除部包括近端,远端设置在轮毂部的远端。 应变消除器的近端可以一体地连接到毂部的远端。 应变消除优选比毂部更灵活。 应变消除部分限定了构造成接收导管的通道,使得穿过轮毂部分的内腔与导管管腔流体连通。

    Vertical connector based packaging solution for integrated circuits
    84.
    发明授权
    Vertical connector based packaging solution for integrated circuits 失效
    用于集成电路的垂直连接器封装解决方案

    公开(公告)号:US6005776A

    公开(公告)日:1999-12-21

    申请号:US2775

    申请日:1998-01-05

    摘要: An assembly featuring a substrate and a plurality of components. The plurality of components are packaged to be connected in a vertical orientation to the substrate. These components include (i) a vertical chip-scale package (CSP), (ii) an integrated circuit die and (iii) an interconnect. Including a plurality of connection leads, the vertical CSP contains the die which is generally situated along a vertical plane. The interconnect, capable of transferring information between the plurality of connection leads and the integrated circuit die, includes a first segment generally perpendicular to the vertical plane and connected to at least one connection lead. The interconnect further includes a second segment generally in parallel to the vertical plane and connected to the integrated circuit die.

    摘要翻译: 一种具有基板和多个部件的组件。 多个部件被封装成垂直定向地连接到基板。 这些组件包括(i)垂直芯片级封装(CSP),(ii)集成电路管芯和(iii)互连。 包括多个连接引线,垂直CSP包含通常沿垂直平面定位的管芯。 能够在多个连接引线和集成电路管芯之间传送信息的互连件包括大致垂直于垂直平面并连接到至少一个连接引线的第一段。 互连还包括大致平行于垂直平面并连接到集成电路管芯的第二段。

    Encoder and decoder for an SEC-DED-S4ED rotational code
    85.
    发明授权
    Encoder and decoder for an SEC-DED-S4ED rotational code 失效
    用于SEC-DED-S4ED旋转码的编码器和解码器

    公开(公告)号:US5856987A

    公开(公告)日:1999-01-05

    申请号:US801617

    申请日:1997-02-18

    申请人: Thomas J. Holman

    发明人: Thomas J. Holman

    IPC分类号: H03M7/36 H03M13/15 H03M13/00

    CPC分类号: H03M13/151

    摘要: A computer system employs a SEC-DED-S4ED rotational error control code (ECC) wherein all columns of H matrix are linearly independent and have an odd weight, and are arranged to allow detection of 4-bit byte errors. The ECC includes check bits arranged in a specific manner in designated columns of the matrix to permit detection and correction of single bit errors, as well as detection of double, triple and quadruple bit errors. The computer system employing the ECC also includes a data path having a variety of implementations; e.g., a single 72-bit path, two 36-bit paths, or a single 36-bit path.

    摘要翻译: 计算机系统采用SEC-DED-S4ED旋转误差控制码(ECC),其中H矩阵的所有列都是线性独立的并且具有奇数权重,并且被布置为允许检测4位字节错误。 ECC包括以特定方式布置在矩阵的指定列中的校验位,以允许检测和校正单个位错误,以及检测双重,三重和四重位错误。 采用ECC的计算机系统还包括具有各种实现的数据路径; 例如单个72位路径,两个36位路径或单个36位路径。

    Internal medical devices for delivery of therapeutic agent in conjunction with a source of electrical power
    87.
    发明授权
    Internal medical devices for delivery of therapeutic agent in conjunction with a source of electrical power 有权
    用于与电力源一起递送治疗剂的内部医疗装置

    公开(公告)号:US08538515B2

    公开(公告)日:2013-09-17

    申请号:US12939363

    申请日:2010-11-04

    IPC分类号: A61N1/30

    摘要: The invention generally relates to internal (e.g., implantable, insertable, etc.) drug delivery devices which contain the following: (a) one or more sources of one or more therapeutic agents; (b) one or more first electrodes, (c) one or more second electrodes and (d) one or more power sources for applying voltages across the first and second electrodes. The power sources may be adapted, for example, to promote electrically assisted therapeutic agent delivery within a subject, including electroporation and/or iontophoresis. In one aspect of the invention, the first and second electrodes are adapted to have tissue of a subject positioned between them upon deployment of the medical device within the subject, such that an electric field may be generated, which is directed into the tissue. Furthermore, the therapeutic agent sources are adapted to introduce the therapeutic agents into the electric field. In another aspect, the therapeutic agent sources are polymeric regions that contain one or more types of ion-conductive polymers and one or more types of charged therapeutic agents. In yet another aspect, the therapeutic agent sources are polymeric regions that contain one or more types of electrically conductive polymers and one or more types of charged therapeutic agents.

    摘要翻译: 本发明一般涉及含有以下物质的内部(例如,可植入,可插入等)药物递送装置:(a)一种或多种一种或多种治疗剂来源; (b)一个或多个第一电极,(c)一个或多个第二电极和(d)用于在第一和第二电极上施加电压的一个或多个电源。 电源可以适应于例如促进受试者内的电辅助治疗剂递送,包括电穿孔和/或离子电渗疗法。 在本发明的一个方面中,第一和第二电极适于在医疗装置在受试者内展开时使被检体的组织位于它们之间,使得可以产生被引导到组织中的电场。 此外,治疗剂源适于将治疗剂引入电场。 另一方面,治疗剂来源是含有一种或多种类型的离子导电聚合物和一种或多种类型的带电治疗剂的聚合物区域。 在另一方面,治疗剂来源是含有一种或多种类型的导电聚合物和一种或多种类型的带电治疗剂的聚合物区域。