MULTILAYER CERAMIC ELECTRONIC COMPONENT
    81.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号:US20160196917A1

    公开(公告)日:2016-07-07

    申请号:US14857809

    申请日:2015-09-17

    IPC分类号: H01G4/01 H01G4/236 H01G4/30

    摘要: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween, and external electrodes disposed on outer surfaces of the ceramic body. Opposite edge portions of at least one or more of the first and second internal electrodes in a width direction of the ceramic body are thicker than a central portion thereof, and a ratio (T2/T1) of a thickness (T2) of the edge portion to a thickness (T1) of the central portion satisfies 1.0

    摘要翻译: 多层陶瓷电子部件包括:陶瓷体,其包括电介质层,第一和第二内部电极,设置成彼此相对设置,各介电层插入其间,外部电极设置在陶瓷体的外表面上。 陶瓷体的宽度方向上的至少一个以上的第一内部电极和第二内部电极的相对的边缘部分比其中心部分厚,并且边缘部分的厚度(T2)的比(T2 / T1) 到中心部分的厚度(T1)满足1.0

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    84.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20150380160A1

    公开(公告)日:2015-12-31

    申请号:US14484614

    申请日:2014-09-12

    IPC分类号: H01G4/008 H01G4/12 H01G4/30

    CPC分类号: H01G4/0085 H01G4/12 H01G4/30

    摘要: There are provided a multilayer ceramic electronic component capable of preventing problems occurring due to a difference in sintering behavior between ceramic layers and internal electrodes and having excellent reliability, and a manufacturing method thereof. The multilayer ceramic electronic component may include a ceramic body including a plurality of ceramic layers; and internal electrodes disposed in the ceramic body. The internal electrodes may contain a conductive ceramic oxide.

    摘要翻译: 提供了一种能够防止由于陶瓷层和内部电极之间的烧结行为的差异而产生的问题并且具有优异的可靠性的多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件可以包括包括多个陶瓷层的陶瓷体; 以及设置在陶瓷体中的内部电极。 内部电极可以包含导电陶瓷氧化物。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY BOARD HAVING THE SAME
    87.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY BOARD HAVING THE SAME 有权
    多层陶瓷电子元器件及其组装板

    公开(公告)号:US20150255213A1

    公开(公告)日:2015-09-10

    申请号:US14335494

    申请日:2014-07-18

    摘要: The present application describes a multilayer ceramic electronic component including a ceramic body having a thickness greater than a width and includes a dielectric layers, and has upper and lower surfaces opposing each other in a thickness direction. First and second side surfaces oppose each other in a width direction, and first and second end surfaces oppose each other in a length direction. First and second internal electrodes are stacked with at least one of the dielectric layers interposed therebetween within the ceramic body in the width direction. A volume increasing part is disposed in a lower portion of the ceramic body in the thickness direction to allow a volume of a lower margin portion of the ceramic body to be greater than that of an upper margin portion thereof.

    摘要翻译: 本申请描述了一种多层陶瓷电子部件,其包括厚度大于宽度的陶瓷体,并且包括电介质层,并且具有在厚度方向上彼此相对的上表面和下表面。 第一和第二侧面在宽度方向上彼此相对,并且第一和第二端面在长度方向上彼此相对。 第一和第二内部电极在宽度方向上在陶瓷体内插入至少一个电介质层。 体积增加部分沿着厚度方向设置在陶瓷体的下部,以使陶瓷体的下边缘部分的体积大于其上边缘部分的体积。

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    88.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电容器及其制造方法

    公开(公告)号:US20150085422A1

    公开(公告)日:2015-03-26

    申请号:US14142668

    申请日:2013-12-27

    IPC分类号: H01G4/232 H01G4/30

    摘要: A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers.

    摘要翻译: 多层陶瓷电容器包括:陶瓷体,其包括电介质层; 第一和第二内部电极彼此面对,同时具有介电层,并且交替地暴露于陶瓷体的端面; 电连接到第一和第二内部电极的第一和第二外部电极,其中第一和第二外部电极中的每一个包括由含有铜和玻璃的材料形成的第一外部电极层,并且从陶瓷体的端面延伸到 陶瓷体的主表面和侧表面; 由含有玻璃的材料形成的第二外部电极层,设置在所述第一外部电极层上,并且比所述第一外部电极层短,以暴露所述第一外部电极层的部分; 以及由含有铜和玻璃的材料形成并覆盖第一和第二外部电极层的第三外部电极层。

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    89.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150053471A1

    公开(公告)日:2015-02-26

    申请号:US14083017

    申请日:2013-11-18

    IPC分类号: H05K1/18 H01G2/06 H01G4/30

    摘要: A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 μm≦G

    摘要翻译: 要嵌入板中的多层陶瓷电子部件包括:陶瓷体,其包括电介质层,并具有主表面,侧表面和端表面; 第一和第二内部电极,包括暴露于主表面的第一和第二引线; 以及形成在所述端面上并延伸到所述主表面的第一外部电极和第二外部电极,其中,当形成在所述主表面上的所述第一或第二外部电极的一端的一端到所述第一或第二外部电极接触点 第一和第二引线是G,从第一或第二外部电极的端部之一到端面的长度为BW,以及从端面到第一或第二外部电极接触第一外部电极的点的长度 第二引线为M,30μm≦̸满足G

    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME
    90.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME 审中-公开
    多层陶瓷电容器及其安装板

    公开(公告)号:US20150014037A1

    公开(公告)日:2015-01-15

    申请号:US14067808

    申请日:2013-10-30

    IPC分类号: H01G4/30 H05K1/18

    摘要: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers stacked in a width direction, a plurality of first and second internal electrodes, first and second lead parts having at least one space part and extended from the first internal electrode to be exposed through the bottom surface of the ceramic body and be spaced apart from each other in a length direction, a third lead part positioned between the first and second lead parts and extended from the second internal electrode, first and second external electrodes formed on the bottom surface of the ceramic body and electrically connected to the first and second lead parts, respectively, and a third external electrode formed between the first and second external electrodes and electrically connected to the third lead part.

    摘要翻译: 提供一种多层陶瓷电容器,其包括陶瓷体,该陶瓷体包括在宽度方向上堆叠的多个电介质层,多个第一和第二内部电极,具有至少一个空间部分并从第一内部电极延伸的第一和第二引线部 通过陶瓷体的底面露出并沿长度方向彼此隔开,位于第一和第二引线部分之间并从第二内部电极延伸的第三引线部分,形成在第一和第二引线部分上的第一和第二外部电极 陶瓷体的底面分别电连接到第一和第二引线部分,第三外部电极分别形成在第一和第二外部电极之间并电连接到第三引线部分。