摘要:
To provide a method for estimating an absolute distance L between a tracking laser interferometer and a retroreflector 70, the tracking laser interferometer including; the retroreflector 70 for reflecting and returning incident measurement light A in an incident direction; and a two-axis rotating mechanism 40 for rotationally moving in an exit direction of the measurement light A so that optical axes of the measurement light A and return light B are collimated, which outputs a measurement value according to an increase or decrease in the distance between the interferometer and the retroreflector 70, wherein the absolute distance L between the interferometer and the retroreflector 70 is estimated by performing arithmetic operation based on an angular position variation θ2 of the two-axis rotating mechanism 40 when a deviation amount d of the return light B from the retroreflector 70 relative to a predetermined position is given as a predetermined value d2. This enables an appropriate increase or decrease of the control amount of a tracking control according to a distance between the interferometer and the retroreflector without forcing an operator to perform a troublesome origin return operation and adding an expensive absolute distance sensor.
摘要:
An exposure apparatus includes a projection optical system configured to project an image of a pattern of a reticle onto a substrate. The exposure apparatus exposes the substrate via the projection optical system and a liquid that is disposed between the projection optical system and the substrate. The exposure apparatus includes a top plate configured to hold the substrate, an auxiliary plate disposed around the substrate on the top plate and having a surface that is substantially flush with a surface of the substrate, and a mirror disposed on the top plate for use in measuring at least one of a position of the top plate and an orientation of the top plate. The auxiliary plate preferably is formed of a low-thermal-expansion material having a coefficient of linear expansion of no greater than 100 ppb.
摘要:
A cooling mechanism for cooling an optical element disposed in a vacuum atmosphere includes a support part for supporting the optical element, which has a channel having an inlet, into which gas is supplied, and an outlet, from which the gas is exhausted, and a decompression mechanism, connected to the channel, for reducing pressure of the gas to be supplied.
摘要:
An exposure apparatus having an exposure mode that transfers a pattern on a reticle onto an object, and a standby mode that waits for exposure includes an optical system for introducing the exposure light to the object in the exposure mode, and a mechanism for allowing the exposure light to enter the reticle and/or the optical system in the standby mode, and for preventing the exposure light from entering the object in the standby mode.
摘要:
Disclosed is a holding system and an exposure apparatus having the same, wherein deformation of an optical member resulting from its thermal expansion and causing degradation of imaging performance can be reduced to assure desired imaging performance. The holding system for holding an optical member includes a barrel for at least partially surrounding the optical member and/or a heat source, an average of radiation coefficient of an inside surface of the barrel is not less than 0.8.
摘要:
A semiconductor device manufacturing system is provided in which chip position information is read without removing resin from a package so that the cause of a failure can be quickly identified and removed and the yield of chips can be rapidly improved. A replacement address reading device reads redundancy addresses from a semiconductor device which is determined as faulty in a test performed after the semiconductor device has been sealed into a package. A chip position analyzing device estimates, from the combination of these redundancy addresses, a lot number, a wafer number and a chip number of the faulty semiconductor device. A failure distribution mapping device maps the distribution of faulty chips in each wafer in the lot based on these numbers thus obtained. A failure cause determining device identifies which manufacturing device or processing step has caused the failures in the wafer process based on the above distribution.
摘要:
A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient as recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.
摘要:
A processing apparatus includes a sealed vacuum chamber which contains a processing portion; a pressure controlling system which keeps the internal pressure of the sealed vacuum chamber constant at a predetermined level by exhausting the ambient gas in the sealed vacuum chamber; and an ambient gas recirculating system which recirculates the ambient gas exhausted from the sealed vacuum chamber back into the sealed vacuum chamber; wherein the ambient as recirculated by the ambient gas recirculating system is blown into the sealed vacuum chamber so that a gas flow is generated in a predetermined direction along the processing portion.
摘要:
In a cleaning nozzle, a trumpet-shaped portion made up of multiple inclined portions or a curved portion is formed upstream of a minimum diameter portion of an ejection nozzle portion of a converging-diverging shape, and a gas ejection port is opened to an intermediate part of the trumpet-shaped portion. Inside the gas ejection port is formed a cleaning liquid ejection port. A gas is ejected at a higher speed than that of a cleaning liquid from the cleaning liquid ejection port to transform the cleaning liquid into droplets, which are further accelerated by a tapered portion formed downstream of the minimum diameter portion before being ejected. A small amount of liquid may be supplied to a pressurized gas passage between a powder injection portion and the cleaning nozzle to prevent a possible clogging of passage due to powder.
摘要:
A processing system includes a supplying part for storing an object to be fed and for being maintained at an atmospheric pressure a processing chamber for being maintained at a reduced pressure or vacuum atmosphere and for executing a predetermined processing to the object, the object being fed between the supplying part and the processing chamber, a vacuum chamber, arranged between the supplying part and the processing chamber, for storing the object at a pressure of 100 Pa or less, the vacuum chamber having a replaceable atmosphere, and a first load lock chamber, arranged between the supplying part and said vacuum chamber, for receiving and supplying the object between the supplying part and said vacuum chamber, the first load lock chamber having a replaceable atmosphere.