摘要:
There is provided a multi-axis force sensor including first and second bridge circuit groups detecting resistances of respective first and second groups of strain resistance elements provided at respective strain producing portions. The strain producing portions are formed on two axes intersecting with respect to each other at a right angle. The first group of strain resistance elements are arranged on one axis across an action portion so as to face with respect to each other, and the second group of strain resistance elements are arranged on another axis across the action portion so as to face with respect to each other. The first bridge circuit groups respectively output a positive voltage when receiving tensile force, and the second bridge circuit groups respectively output a negative voltage when receiving tensile force.
摘要:
An inertia force sensor includes a detection element having an acceleration detection section (1). This detection element (1) has: two orthogonal arms obtained by connecting first arms (8) to second arms (10) so as to be orthogonal to each other, a support section (12) for supporting one ends of the two first arm (8), a fixation section (4) connected to the other ends of the two first arms (8), and weight sections (2) fixed to tip ends of the second arms (10). The first arm (8) has a thickness thinner than thicknesses of the second arm (10) and weight section (2) to thereby provide an increased detection sensitivity.
摘要:
A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.
摘要:
A method for correcting a mask pattern used for dry-etching an object with higher accuracy, and for manufacturing an acceleration sensor and an angular velocity sensor. The object is first etched by a dry-etching process using an uncorrected reference mask pattern. Then, distribution of the size of expansion of a tapered portion formed in a surface of the object is measured. Thereafter, the measured distribution is approximated by using a quadratic curve (Y=AX2+B) so as to determine A and B. Consequently, an amount t of correction for the tapered portion, which is expressed by the following equation (1) and related to a width of an opening of the mask pattern in a position at a distance r from a center of the object to be etched, can be set. In this way, the correction for the tapered portion can be carried out. t=(Ar2+B)/2 (1)
摘要:
The acceleration sensor package comprises an acceleration sensor chip having a pad forming surface formed with a plurality of pads at at least one edge portion, a control chip having a terminal forming surface formed with connecting terminals, and a case body having a storage concave section for accommodating the acceleration sensor chip and the control chip therein and bottom face terminals respectively disposed at positions corresponding to the pads at a bottom face of the storage concave section. The pads of the acceleration sensor chip are respectively electrically connected to the bottom face terminals of the case body. A back surface located on the side opposite to the terminal forming surface, of the control chip is mated with its corresponding back surface located on the side of the pad forming surface, of the acceleration sensor chip.
摘要:
A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.
摘要:
A micromachine includes a movable section formed of a conductor and a support section formed of a conductor, wherein the movable section and the support section are separated from each other, an insulating layer is provided on the conductor, a conductive layer is provided on the insulating layer, and the conductive layer is formed so as to straddle the movable section and the support section.
摘要:
A acceleration sensor includes a supporting part, a beam part connected to the supporting part, a weight part connected to the beam part, and a protruding part formed beneath the beam part so that the protruding part supports the beam part. With such an arrangement, the adjustment of the sensitivity of the acceleration sensor can be easily performed, as well as the evaluation of the acceleration sensor.
摘要:
A system and method for inputting motion measurement data into a computationally based device are provided. In a first version three-axis accelerometer determines components of an inertial force vector with respect to an orthogonal coordinate system. The accelerometer includes a sensor die made of a semiconductor substrate having a frame element, a proof mass element, and an elastic element mechanically coupling the frame and the proof mass. The accelerometer also has three or more stress-sensitive IC components integrated into the elastic element adjacent to the frame element for electrical connectivity without metal conductor traversal of the elastic element.
摘要:
An acceleration sensor includes a base portion shaped into the form of a frame, a weight portion located inside the base portion and disposed away from the base portion, a flexible beam portion disposed over an upper portion of the base portion and an upper portion of the weight portion and a stopper portion disposed above the base portion and disposed over the weight portion away from the weight portion, wherein the stopper portion restricts an amount of displacement of the weight portion in the direction of the stopper portion.