公开(公告)号：US11908762B2

公开(公告)日：2024-02-20

申请号：US16979678

申请日：2019-03-01

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Naoki Tomori ,  Tomohiro Nagoya ,  Takahiro Kuroda

IPC: C09J7/29 ,  H01L23/31 ,  C09J7/38 ,  H01L21/56 ,  H01L23/495 ,  B32B7/027 ,  C09J201/02

CPC classification number: H01L23/3142 ,  B32B7/027 ,  C09J7/29 ,  C09J7/38 ,  H01L21/561 ,  H01L23/49579 ,  C09J201/02

Abstract: A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.

公开(公告)号：US11686094B2

公开(公告)日：2023-06-27

申请号：US17557331

申请日：2021-12-21

Applicant: Holcim Technology Ltd

Inventor： Jiansheng Tang ,  Joseph Carr

IPC: C09J183/00 ,  E04D5/14 ,  C09J109/00 ,  E04D11/00 ,  C09J175/04 ,  C08G65/336 ,  C09D171/02 ,  C09J171/00 ,  E04D3/36 ,  E04D7/00 ,  B32B7/12 ,  B32B11/04 ,  B32B25/16 ,  B32B37/12 ,  C09J5/00 ,  C09J201/02 ,  C09J201/10 ,  E04D5/08 ,  E04D11/02 ,  E04D12/00 ,  E04D15/04

CPC classification number: E04D5/148 ,  B32B7/12 ,  B32B11/044 ,  B32B25/16 ,  B32B37/12 ,  C08G65/336 ,  C09D171/02 ,  C09J5/00 ,  C09J109/00 ,  C09J171/00 ,  C09J175/04 ,  C09J201/02 ,  C09J201/10 ,  E04D3/36 ,  E04D5/08 ,  E04D7/005 ,  E04D11/00 ,  E04D11/02 ,  E04D12/00 ,  B32B2255/26 ,  B32B2307/728 ,  B32B2319/00 ,  B32B2395/00 ,  B32B2419/06 ,  C09J2499/00 ,  E04D2015/042

Abstract: A method is provided for forming an adhered membrane roof system that meets Factory Mutual (FM) 4470/4474 standards for wind uplift. The method comprises applying a bond adhesive to a substrate on a roof to form an adhesive layer and applying a membrane directly to the adhesive layer. The bond adhesive includes a moisture-curable polymer.

公开(公告)号：US11655395B2

公开(公告)日：2023-05-23

申请号：US16263525

申请日：2019-01-31

Applicant: TOPPAN PRINTING CO., LTD. ,  HISAMITSU PHARMACEUTICAL CO., INC.

Inventor： Koji Sakairi ,  Atsushi Matsushima ,  Tomohiro Shinoda ,  Atsushi Sonobe

IPC: C09J7/29 ,  C09J201/02 ,  B32B27/40 ,  C09J201/00

CPC classification number: C09J7/29 ,  B32B27/40 ,  C09J201/00 ,  C09J201/02 ,  C09J2301/162 ,  C09J2400/12 ,  C09J2471/001 ,  C09J2475/001 ,  C09J2475/006

Abstract: A support film for a tape material, includes a film-shaped support formed of polyurethane; and a barrier layer containing an aromatic isocyanate-based polyurethane and a layered inorganic compound and formed on one surface of the support.

公开(公告)号：US11638666B2

公开(公告)日：2023-05-02

申请号：US15654524

申请日：2017-07-19

Applicant: Smith & Nephew PLC

Inventor： Edward Yerbury Hartwell ,  Christopher John Fryer ,  Sarah Jenny Collinson ,  Marcus Damian Phillips

IPC: A61M1/00 ,  A61F13/00 ,  A61F13/02 ,  C09J183/00 ,  A61F17/00 ,  A61L15/22 ,  A61L15/42 ,  A61L15/58 ,  A61M5/19 ,  C09J201/02 ,  A61M27/00 ,  A61K9/22

Abstract: A curable composition for use in wound care comprising, apportioned between at least one Part A and at least one Part B: one or more alkenyl-group containing polymers (i) having at least one alkenyl group or moiety per molecule, one or more SiH-containing polymers (ii) having at least one Si—H unit per molecule; and a catalyst (iii) for curing by addition of alkenyl-containing polymer (i) to SiH-containing polymer (ii), Part A and Part B independently having viscosity at 23° C. in the range 5-300 Pa·s, preferably 10-100 Pa·s, at a shearing rate of 10 s−1, and when combined in one Part having cure time at 23° C. in the range from 0.5 min to 25 min, wherein when dispensed into a location about a wound dressing, said wound dressing overlying a wound site and skin thereabout, said dispensing being so as to intimately contact and overlie an edge of said dressing and skin about said edge, the composition cures in contact with said edge and skin at 32° C. to an elastomer exhibiting zero or low tack at a time in the range from 0.5 to less than 30 minutes, apparatus for use with said composition comprising dispensing apparatus or wound dressing, a kit comprising the same, and methods of dispensing and curing the same and of using the same in sealing a wound dressing and in treating a wound site of a human in need thereof.

公开(公告)号：US11061175B2

公开(公告)日：2021-07-13

申请号：US16301158

申请日：2017-05-16

Applicant: NITTO DENKO CORPORATION

Inventor： Ryo Kanno ,  Takeshi Saito ,  Tatsuya Yamasaki ,  Keisuke Kimura

IPC: G02B5/30 ,  B32B7/12 ,  B32B27/18 ,  B32B27/28 ,  B32B27/30 ,  B32B27/38 ,  C08K5/55 ,  G02F1/1335 ,  C09J201/02 ,  C09D185/00 ,  C09D183/00 ,  G02B1/14 ,  C09J7/30 ,  C09D163/00

Abstract: A polarizing film, comprising a polarizer, and a transparent protective film laminated on/over at least one surface of the polarizer to interpose an adhesive layer between the surface and the transparent protective film, and the polarizing film comprising, on/over the adhesion surface of the polarizer, an adhesion-improving layer interposed between the polarizer and the adhesive layer. The adhesion-improving layer preferably comprises a compound represented by the following general formula (1): wherein X is a functional group containing a reactive group, and R1 and R2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent, and the compound represented by the general formula (1) is interposed between the polarizer and the adhesive layer.

公开(公告)号：US10995195B2

公开(公告)日：2021-05-04

申请号：US15916802

申请日：2018-03-09

Applicant: Lintec of America, Inc.

Inventor： Marcio D. Lima ,  Julia Bykova ,  Takahiro Ueda

IPC: C09J7/38 ,  C08K3/04 ,  B32B3/28 ,  B32B5/02 ,  B32B5/12 ,  B32B7/12 ,  B32B9/00 ,  B32B15/14 ,  C09J9/02 ,  C09J7/22 ,  C08J5/18 ,  C08J7/04 ,  C08J7/043 ,  C08J7/044 ,  B32B7/06 ,  C09J201/02 ,  B32B17/10 ,  B32B27/30 ,  C08J5/04 ,  C08L23/08 ,  C08L29/14 ,  C08K3/08 ,  C08K7/06 ,  B82Y40/00 ,  B32B9/04

Abstract: Examples described include composite nanofibers sheets that have been “infiltrated” with a polymer (i.e., the polymer has flowed past a surface of the nanofiber sheet and into at least some of spaces within the sheet defined by the nanofibers). An adhesive nanofiber tape is formed when the infiltrating polymer is an adhesive and the adhesive infiltrates the nanofiber sheet from a one major surface of the nanofiber sheet. In other described examples, some portions of nanofibers in the sheet have been conformally coated with at least one metal layer.

公开(公告)号：US10899946B2

公开(公告)日：2021-01-26

申请号：US16072324

申请日：2017-01-31

Applicant: NITTO DENKO CORPORATION

Inventor： Takeshi Saito ,  Noritsugu Daigaku ,  Yasuaki Okada ,  Keisuke Kimura

IPC: C08F2/50 ,  C09J4/00 ,  C08L101/02 ,  C08L43/00 ,  C08F30/06 ,  C08L101/00 ,  G02B1/14 ,  C08F2/44 ,  C08F20/56 ,  C08K5/55 ,  C08K5/56 ,  C09J201/02 ,  C09J201/06 ,  G02B1/00 ,  C09J11/06 ,  G02B1/18 ,  B32B7/12 ,  B32B23/08 ,  B32B23/20 ,  B32B27/08 ,  B32B27/30 ,  G02B5/30 ,  G02F1/1335

Abstract: A curable resin composition, comprising a compound represented by the following general formula (1): wherein X is a functional group comprising a reactive group, and R1 and R2 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group, aryl group or heterocyclic group that may have a substituent; and at least organometallic compound selected from the group consisting of metal alkoxides and metal chelates.

公开(公告)号：US10858488B2

公开(公告)日：2020-12-08

申请号：US16098365

申请日：2017-05-24

Applicant: KURARAY CO., LTD.

Inventor： Kaori Maeda ,  Noboru Higashida ,  Takao Hoshiba

IPC: C08J5/18 ,  C08L51/06 ,  C08L101/00 ,  G02B5/30 ,  B32B27/30 ,  C08L33/08 ,  C08L33/12 ,  C08L51/04 ,  C09J201/02

Abstract: Provided is a thermoplastic resin composition that can be firmly bonded to an adherend with an active energy ray-curable adhesive provided therebetween, and provided are a molded product and a film each including such a thermoplastic resin composition. Also provided are a thermoplastic resin composition that is less likely to be whitened even when the adhesive permeates thereinto and a molded product and a film each including such a thermoplastic resin composition. The thermoplastic resin composition according to the present disclosure contains 70 to 95 mass % of a thermoplastic resin and 5 to 30 mass % of a multilayer structure polymer (C) having a multilayer particle structure, and the multilayer structure polymer (C) has a median diameter Da of no less than 200 nm and less than 500 nm when the median diameter Da is measured through a laser diffraction/scattering technique with the thermoplastic resin composition dissolved in acetone.

公开(公告)号：US10795192B2

公开(公告)日：2020-10-06

申请号：US16238479

申请日：2019-01-02

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Su-mi Moon ,  Jin-kyu Park ,  Taegyun Kim ,  Myunghun Baek

IPC: G02F1/1333 ,  G02F1/1335 ,  C09J201/02 ,  H05K5/00 ,  F21V8/00 ,  G02F1/13357

Abstract: A display device including: a display panel including a first substrate and a second substrate that are coupled to and face each other; a first polarizing plate attached to the second substrate of the display panel; a second polarizing plate attached to the first substrate of the display panel; and a side cover layer. The first polarizing plate has a first extended portion that extends outwardly beyond an end portion of the second substrate, and the second polarizing plate has a second extended portion that extends outwardly beyond an end portion of the first substrate. The side cover layer is between the first and second extended portions of the first and second polarizing plates and covers a first side surface of the first substrate and a second side surface of the second substrate that are near the first and second extended portions, respectively.

公开(公告)号：US20200095475A1

公开(公告)日：2020-03-26

申请号：US16579656

申请日：2019-09-23

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi SASAKI ,  Kouji MIZUNO ,  Takayuki TODA

IPC: C09J7/38 ,  C09J201/02

Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (μm) of the intermediate layer, a thickness C (μm) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D≥20 (MPa·N).