公开(公告)号：US20150145007A1

公开(公告)日：2015-05-28

申请号：US14089557

申请日：2013-11-25

申请人： APTINA IMAGING CORPORATION

发明人： Shung Chieh ,  BRIAN KEELAN

IPC分类号： H01L27/146

CPC分类号： H01L27/1461 ,  H01L27/14612 ,  H01L27/1464

摘要： An imaging system may include an image sensor having an array of image pixels. Some image pixels in the array may be provided with responsivity adjustment structures. For example, broadband pixels in a pixel array may include responsivity adjustment circuitry. The responsivity adjustment circuitry may be configured to narrow the spectral response or to reduce the conversion gain of the broadband pixels in high light conditions. For example, a deep photodiode may divert charge away from a signal photodiode during an integration period. The deep photodiode may divert charge to a power supply or the charge may be transferred to a storage node and used in image processing, if desired. The responsivity adjustment circuitry may include channel-dependent conversion circuitry that is formed in pixels corresponding to a first color channel, while the conversion gains of pixels corresponding to a second color channel may remain fixed.

摘要翻译： 成像系统可以包括具有图像像素阵列的图像传感器。 阵列中的一些图像像素可以具有响应度调整结构。 例如，像素阵列中的宽带像素可以包括响应度调整电路。 响应度调整电路可以被配置为在高光条件下缩小光谱响应或减小宽带像素的转换增益。 例如，深度光电二极管可以在积分期间将电荷从信号光电二极管转移。 深光电二极管可以将电荷转移到电源，或者如果需要，电荷可以被传送到存储节点并用于图像处理。 响应度调整电路可以包括以对应于第一颜色通道的像素形成的依赖于频道的转换电路，而对应于第二颜色通道的像素的转换增益可以保持固定。

公开(公告)号：US20150144790A1

公开(公告)日：2015-05-28

申请号：US14092611

申请日：2013-11-27

申请人： Aptina Imaging Corporation

发明人： Sergey Velichko ,  Gennadiy Agranov

IPC分类号： G01B11/24 ,  G01S17/08 ,  H01L27/148

CPC分类号： G01S17/08 ,  G01S7/4816 ,  G01S7/4863 ,  G01S17/89 ,  H01L27/14875

摘要： Electronic devices may include time-of-flight (ToF) image pixels. Each ToF pixel may include a photodiode, a first capacitor coupled to the photodiode via a first transfer gate, a second capacitor coupled to the photodiode via a second transfer gate, and a third capacitor coupled to the photodiode via a third transfer gate. The first transfer gate may be turned on for a given duration to store a first charge in the first capacitor. The second transfer gate may be turned on for the given duration to store a second charge in the second capacitor. The third transfer gate may be turned on for a duration that is longer than the given duration to store a third charge in the third capacitor. Depth information may be computed based on the first, second, and third stored charges and a corresponding pixel constant.

摘要翻译： 电子设备可以包括飞行时间（ToF）图像像素。 每个ToF像素可以包括光电二极管，经由第一传输栅极耦合到光电二极管的第一电容器，经由第二传输栅极耦合到光电二极管的第二电容器，以及经由第三传输栅极耦合到光电二极管的第三电容器。 第一传输门可以被打开一段给定的持续时间以将第一电荷存储在第一电容器中。 第二传输门可以在给定的持续时间内导通以将第二电荷存储在第二电容器中。 第三传输门可以接通持续时间长于给定的持续时间以将第三电荷存储在第三电容器中。 可以基于第一，第二和第三存储的电荷和相应的像素常数来计算深度信息。

公开(公告)号：US20150035966A1

公开(公告)日：2015-02-05

申请号：US13959491

申请日：2013-08-05

申请人： NANOSCOPIA (CAYMAN), INC.

发明人： Kenneth Edward Salsman

IPC分类号： G02B21/36

CPC分类号： G02B21/34 ,  G02B21/0008

摘要： A handheld diagnostic system may include a disposable sample holder and an analysis module having a chip-scale microscope. The sample holder may have a transparent portion having test chambers for containing respective portions of a biological sample. The analysis module may having a housing with an opening configured to receive the transparent portion of the sample holder. The chip-scale microscope may include an image sensor for capturing images of the biological sample as the transparent portion of the sample holder is inserted into the opening of the analysis module. The analysis module may include a light source for illuminating the sample during image capture operations and optics for gathering light from the sample and focusing the light onto the image sensor. The analysis module may transmit sample imaging information to a portable electronic device, which may in turn display corresponding sample analysis information for a user.

摘要翻译： 手持式诊断系统可以包括一次性样品保持器和具有芯片级显微镜的分析模块。 样品保持器可以具有透明部分，其具有用于容纳生物样品的各部分的测试室。 分析模块可以具有壳体，其具有构造成接收样品架的透明部分的开口。 芯片尺度显微镜可以包括用于在样品保持器的透明部分插入分析模块的开口中时捕获生物样品的图像的图像传感器。 分析模块可以包括用于在图像捕获操作期间照亮样品的光源和用于收集来自样品的光并将光聚焦到图像传感器上的光学器件。 分析模块可以将样本成像信息发送到便携式电子设备，便携式电子设备可以依次显示用户的相应样本分析信息。

公开(公告)号：US20150009379A1

公开(公告)日：2015-01-08

申请号：US13967272

申请日：2013-08-14

申请人： Aptina Imaging Corporation

发明人： Hai Yan ,  Kwang-bo Cho

IPC分类号： H04N5/369 ,  H01L27/148

CPC分类号： H04N5/378 ,  H04N5/3559 ,  H04N5/37452 ,  H04N5/37455

摘要： An imager may include an array of pixels. The pixel array may be arranged in rows and columns. Each pixel of the pixel array may include a photodiode that is coupled to a floating diffusion region by a transfer gate. A source-follower transistor may be coupled between the floating diffusion region and a pixel output node. The imager may include ramp circuitry that provides a ramp signal to the floating diffusion region. A capacitor interposed between the ramp circuitry and the floating diffusion region may be used in conveying the ramp signal to the floating diffusion region. The pixel may be coupled to a comparator that is implemented using separate circuitry or may include portions of the pixel.

摘要翻译： 成像器可以包括像素阵列。 像素阵列可以以行和列排列。 像素阵列的每个像素可以包括通过传输门耦合到浮动扩散区的光电二极管。 源极跟随器晶体管可以耦合在浮动扩散区域和像素输出节点之间。 成像器可以包括向浮动扩散区域提供斜坡信号的斜坡电路。 插入在斜坡电路和浮动扩散区域之间的电容器可以用于将斜坡信号传送到浮动扩散区域。 像素可以耦合到使用单独的电路实现的比较器，或者可以包括像素的部分。

公开(公告)号：US08913153B2

公开(公告)日：2014-12-16

申请号：US13646453

申请日：2012-10-05

申请人： Aptina Imaging Corporation

发明人： Huai Dong Li ,  Peng Lin

IPC分类号： H04N5/228 ,  H04N5/235 ,  H04N5/232 ,  H04N5/238

CPC分类号： H04N5/35581 ,  H04N5/23254 ,  H04N5/2353 ,  H04N5/2355 ,  H04N5/35536 ,  H04N5/35554 ,  H04N5/35563

摘要： Electronic devices may include image sensors. Image sensors may be used to capture images having rows of long-exposure image pixel values that are interleaved with rows of short-exposure image pixel values. The long-exposure and short-exposure values in each interleaved image frame may be interpolated to form interpolated values. A combined long-exposure image and a combined short-exposure image may be generated using the long-exposure and the short-exposure values from the interleaved image frames and the interpolated values from a selected one of the interleaved image frames. The combined long-exposure and short-exposure images may each include image pixel values from either of the interleaved image frames in a non-motion edge region and image pixel values based only on the image pixel values or the interpolated values from the selected one of the interleaved images in a motion or non-edge region. High-dynamic-range images may be generated using the combined long-exposure and short-exposure images.

摘要翻译： 电子设备可以包括图像传感器。 图像传感器可用于捕获具有与短曝光图像像素值行交错的长曝光图像像素值行的图像。 每个交错图像帧中的长曝光和短曝光值可被内插以形成内插值。 组合的长曝光图像和组合的短曝光图像可以使用来自交织的图像帧的长曝光值和短曝光值以及来自所选交织图像帧中的内插值来生成。 组合的长曝光和短曝光图像可以各自包括来自非运动边缘区域中的交织图像帧中的任一个的图像像素值，以及仅基于图像像素值的图像像素值或来自所选择的图像像素值的内插值 运动或非边缘区域中的交错图像。 可以使用组合的长曝光和短曝光图像来生成高动态范围图像。

公开(公告)号：US08890221B2

公开(公告)日：2014-11-18

申请号：US14031804

申请日：2013-09-19

申请人： Aptina Imaging Corporation

发明人： Victor Lenchenkov ,  Xianmin Yi

IPC分类号： H01L31/062 ,  H01L31/113 ,  H01L21/00 ,  H04N5/335 ,  H01L27/146

CPC分类号： H01L27/14627 ,  H01L27/14623 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/14685 ,  H04N5/335

摘要： A backside illuminated image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode and associated pixel circuits formed in a front surface of a semiconductor substrate. Silicon inner microlenses may be formed on a back surface of the semiconductor substrate. In particular, positive inner microlenses may be formed over the photodiodes, whereas negative inner microlenses may be formed over the associated pixel circuits. Buried light shielding structures may be formed over the negative inner microlenses to prevent pixel circuitry that is formed in the substrate between two neighboring photodiodes from being exposed to incoming light. The buried light shielding structures may be lined with absorptive antireflective coating material to prevent light from being reflected off the surface of the buried light shielding structures. Forming buried light shielding structures with antireflective coating material can reduce optical pixel crosstalk and enhance global shutter efficiency.

摘要翻译： 提供具有图像传感器像素阵列的背面照明图像传感器。 每个图像像素可以包括形成在半导体衬底的前表面中的光电二极管和相关联的像素电路。 硅内部微透镜可以形成在半导体衬底的背面上。 特别地，正内部微透镜可以形成在光电二极管上，而负的内部微透镜可以形成在相关联的像素电路上。 掩埋的光屏蔽结构可以形成在负的内部微透镜上，以防止形成在两个相邻光电二极管之间的衬底中的像素电路暴露于入射光。 掩埋的遮光结构可以衬有吸收性抗反射涂层材料，以防止光从掩埋的光屏蔽结构的表面反射出来。 用防反射涂层材料形成掩埋的光屏蔽结构可以减少光学像素串扰并增强全局快门效率。

公开(公告)号：US08873882B2

公开(公告)日：2014-10-28

申请号：US13074976

申请日：2011-03-29

申请人： Johannes Solhusvik ,  Sohrab Yaghmai ,  Peng Lin

发明人： Johannes Solhusvik ,  Sohrab Yaghmai ,  Peng Lin

IPC分类号： G06K9/36 ,  G06T5/50

CPC分类号： G06T5/50 ,  G06T2207/10144 ,  G06T2207/20208

摘要： Multiple-exposure high dynamic range image processing may be performed that filters pixel values that are distorted by blooming from nearby saturated pixels. Pixel values that are near saturated pixels may be identified as pixels that may be affected by blooming. The contributions from those pixels may be minimized when producing a final image. Multiple-exposure images may be linearly combined to produce a final high dynamic range image. Pixel values that may be distorted by blooming may be given less weight in the linear combination.

摘要翻译： 可以执行多次曝光高动态范围图像处理，其对来自附近的饱和像素的渐变而失真的像素值进行滤波。 靠近饱和像素的像素值可以被识别为可能受到开花影响的像素。 当产生最终图像时，这些像素的贡献可能被最小化。 多曝光图像可以被线性组合以产生最终的高动态范围图像。 在线性组合中可能会发生可能由于起霜而变形的像素值。

公开(公告)号：US08846494B2

公开(公告)日：2014-09-30

申请号：US13540905

申请日：2012-07-03

申请人： Gianluca Testa ,  Giovanni De Amicis

发明人： Gianluca Testa ,  Giovanni De Amicis

IPC分类号： H01L21/30 ,  H01L23/544 ,  H01L27/146

CPC分类号： H01L27/14634 ,  H01L23/544 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components such as color filters and microlenses. The imager integrated circuit may be mounted to a carrier wafer with alignment marks. Bonding marks on the carrier wafer and the imager integrated circuit may be used to align the carrier wafer accurately to the imager integrated circuit. The alignment marks on the carrier wafer may be read, by fabrication equipment, to align backside components of the imager integrated circuit, such as color filters and microlenses, with backside components of the imager integrated circuit, such as photodiodes.

摘要翻译： 成像系统可以包括具有前置部件的成像器集成电路，诸如成像像素和背面部件，例如滤色器和微透镜。 成像器集成电路可以安装到具有对准标记的载体晶片。 可以使用载体晶片和成像器集成电路上的接合标记将载体晶片与成像器集成电路精确对准。 可以通过制造设备读取载体晶片上的对准标记，以将成像器集成电路的背面部件（例如滤色器和微透镜）与成像器集成电路的背侧部件（例如光电二极管）对准。

公开(公告)号：US08803979B2

公开(公告)日：2014-08-12

申请号：US13248120

申请日：2011-09-29

申请人： Johannes Solhusvik ,  Tore Martinussen

发明人： Johannes Solhusvik ,  Tore Martinussen

IPC分类号： H04N17/00 ,  H04N17/02

CPC分类号： H04N17/002 ,  H04N5/378 ,  H04N9/097

摘要： An imager including a self test mode. The imager includes a pixel array for providing multiple pixel output signals via multiple columns; and a test switch for (a) receiving a test signal from a test generator and (b) disconnecting a pixel output signal from a column of the pixel array. The test switch provides the test signal to the column of the pixel array. The test signal includes a test voltage that replaces the pixel output signal. The test signal is digitized by an analog-to digital converter (ADC) and provided to a processor. The processor compares the digitized test signal to an expected pixel output signal. The processor also interpolates the output signal from a corresponding pixel using adjacent pixels, when the test switch disconnects the pixel output signal from the column of the pixel array.

摘要翻译： 包括自检模式的成像仪。 该成像器包括用于通过多列提供多个像素输出信号的像素阵列; 以及用于（a）从测试发生器接收测试信号的测试开关和（b）从像素阵列的列中断开像素输出信号。 测试开关向像素阵列的列提供测试信号。 测试信号包括替代像素输出信号的测试电压。 测试信号由模数转换器（ADC）数字化并提供给处理器。 处理器将数字化测试信号与期望的像素输出信号进行比较。 当测试开关断开像素阵列的列的像素输出信号时，处理器还使用相邻像素来内插来自相应像素的输出信号。

公开(公告)号：US08797432B2

公开(公告)日：2014-08-05

申请号：US13071342

申请日：2011-03-24

申请人： Kwang-Bo Cho

发明人： Kwang-Bo Cho

IPC分类号： H04N5/335 ,  H04N5/369 ,  H04N5/374 ,  H01L27/146 ,  H04N5/376 ,  H04N5/225

CPC分类号： H04N5/2258 ,  H01L27/14601 ,  H01L27/14634 ,  H01L27/14643 ,  H04N5/3696 ,  H04N5/3698 ,  H04N5/3741 ,  H04N5/376

摘要： An integrated circuit may have rows and columns of imaging pixel arrays. Row driver circuitry and column readout circuitry may be shared between the imaging pixel arrays. Control circuit blocks may bypass inactive pixel arrays and may shift signals between different signal paths on the integrated circuit. The control circuit blocks may include synchronizing circuitry for deskewing control signals and buffer circuitry for regenerating weak signals as they are distributed across the integrated circuit. An array of lenses may be associated with the integrated circuit. The spacing between imaging pixel arrays may differ at different parts of the integrated circuit. Images from multiple image sensor pixel arrays may be combined to form a single digital image. Image sensors may be provided with unique lenses, different color responses, different image pixels, different image pixel patterns, and other differences. Reference pixels may be interposed in the gaps between image sensor arrays.

摘要翻译： 集成电路可以具有成像像素阵列的行和列。 行驱动器电路和列读出电路可以在成像像素阵列之间共享。 控制电路块可以绕过非活动像素阵列并且可以在集成电路上的不同信号路径之间移位信号。 控制电路块可以包括用于去偏移控制信号的同步电路和用于在分布在集成电路上的弱信号时再生弱信号的缓冲电路。 透镜阵列可以与集成电路相关联。 成像像素阵列之间的间距在集成电路的不同部分可能不同。 来自多个图像传感器像素阵列的图像可以被组合以形成单个数字图像。 图像传感器可以具有独特的透镜，不同的颜色响应，不同的图像像素，不同的图像像素图案以及其他差异。 参考像素可以插入在图像传感器阵列之间的间隙中。