Contact release capsule useful for chemical mechanical planarization slurry
    8.
    发明授权
    Contact release capsule useful for chemical mechanical planarization slurry 有权
    用于化学机械平面化浆料的接触释放胶囊

    公开(公告)号:US08980122B2

    公开(公告)日:2015-03-17

    申请号:US13542651

    申请日:2012-07-05

    申请人: Robin Ihnfeldt

    发明人: Robin Ihnfeldt

    摘要: The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.

    摘要翻译: 本发明涉及包含颗粒,化学有效载荷和聚合物涂层的接触释放胶囊,其中颗粒被化学有效载荷浸渍,并且化学有效载荷通过聚合物涂层保持在颗粒内,直到接触释放胶囊接触 表面和剪切力去除聚合物涂层,允许化学有效载荷释放到颗粒外部。 接触释放胶囊可用于化学机械平面化浆料中。 特别地,接触释放胶囊可以包含用聚合物涂覆的甘氨酸浸渍的二氧化硅纳米颗粒,其中接触释放胶囊分散在水溶液中并用于铜化学机械平面化工艺中。 在用于铜化学机械平面化的浆料中使用接触释放胶囊可以显着地提高平坦化效率,减少不必要的蚀刻和腐蚀,并且提高分散稳定性。