公开(公告)号：US20240256739A1

公开(公告)日：2024-08-01

申请号：US18564241

申请日：2022-05-31

申请人： TOYOBO CO., LTD. ,  National Institute of Maritime, Port and Aviation Technology ,  Toray ENGINEERING CO., LTD. ,  Toray Engineering D Solutions Co., Ltd.

发明人： Daisuke ITAKURA ,  Kenji FURUICHI ,  Ryoichi ISHIHARA ,  Yoshihiro UCHIDA ,  Tsuyoshi MATSUO ,  Satoshi SAWADA ,  Akira HYAKUSAI

IPC分类号： G06F30/23 ,  G06F113/22 ,  G06F113/26

CPC分类号： G06F30/23 ,  G06F2113/22 ,  G06F2113/26

摘要： A method for molding analysis of a plate-like intermediate base material containing resin and reinforcing material when the base material is molded, including applying a base material model having anisotropy between out-of-plane direction and an in-plane direction orthogonal to the out-of-plane direction, and calculating viscosity distribution in a cross-section direction of a molded article using each viscosity in accordance with a flow field, and the viscosity distribution indicates that under a boundary condition there is no slip flow of the base material on a wall surface of the mold, as a result of a shear field in the vicinity of the wall surface, a low viscosity layer that is more affected by an out-of-plane shear viscosity than a central portion of the base material is automatically formed in the vicinity of the wall surface, and the base material in the vicinity of the wall surface functions as a lubricating layer.

公开(公告)号：US20240149468A1

公开(公告)日：2024-05-09

申请号：US18549824

申请日：2021-12-15

申请人： TORAY ENGINEERING CO., LTD.

发明人： Hiroto TANAKA ,  Kenji HAMAKAWA ,  Tomonori KAWAMURA

IPC分类号： B25J15/04 ,  B25J15/06

CPC分类号： B25J15/0441 ,  B25J15/0616

摘要： A collet replacement mechanism for replacing a collet of a pickup tool that is configured to pick up chip components by suction using the collet comprises an attachment configured to hold the collet on a bottom surface thereof, an attachment holder disposed at a lower part of the pickup tool and configured to hold an upper part of the attachment by magnetic force, and an attachment storage unit having a guide that is configured to latch the attachment to store the attachment, the attachment being detachable from the attachment holder in a state of being latched to the guide.

公开(公告)号：US20230163096A1

公开(公告)日：2023-05-25

申请号：US18152478

申请日：2023-01-10

申请人： TORAY ENGINEERING CO., LTD.

发明人： Katsumi TERADA ,  Kenji HAMAKAWA ,  Takashi HARE ,  Yasushi TAMURA ,  Kensuke TASHIMA

IPC分类号： H01L23/00 ,  H05K13/04 ,  H05K13/08

CPC分类号： H01L24/75 ,  H05K13/04 ,  H05K13/0812 ,  H05K13/0815 ,  H01L24/83 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/75804 ,  H01L2224/83201 ,  H01L2224/83132 ,  H01L2224/8313

摘要： A mounting device comprises a substrate stage, a mounting head, an elevating unit, a recognition mechanism, and a control unit. The recognition mechanism acquires position information about a chip recognition mark and a substrate recognition mark using an imaging unit. The control unit calculates an amount of positional deviation between a chip component and a substrate from the position information about the chip recognition mark and the substrate recognition mark, and performs alignment by driving the mounting head and/or the substrate stage according to the amount of the positional deviation. The chip component and the substrate are brought closer with each other and the alignment is performed in a state in which the imaging unit simultaneously images the chip recognition mark and the substrate recognition mark within a depth of field, after which the chip component and the substrate are brought into close contact with each other.

公开(公告)号：US11504686B2

公开(公告)日：2022-11-22

申请号：US16498012

申请日：2018-03-16

申请人： TORAY ENGINEERING CO., LTD.

发明人： Chisa Inaka ,  Tsukasa Niwa ,  Takashi Iwade ,  Kazunori Nakakita

IPC分类号： B01J4/02 ,  B01J19/00 ,  G01G17/04

摘要： A synthesis device comprises a plurality of pipes, a feeding unit, a reaction vessel, and a measurement mechanism. The pipes extend from a plurality of storage containers, respectively, in which a plurality of types of solutions are stored. The feeding unit is configured to feed the solutions in the storage containers through the pipes. The solutions selectively fed from the storage containers are put in the reaction vessel to generate a synthesized product by chemical synthesis. The measuring mechanism is provided between the storage containers and the reaction vessel in a middle of an overall flow path including the pipes, the measuring mechanism being configured to measure the solutions fed to the reaction vessel.

公开(公告)号：US11495571B2

公开(公告)日：2022-11-08

申请号：US16326512

申请日：2017-08-23

申请人： TORAY ENGINEERING CO., LTD.

发明人： Yoshiyuki Arai

IPC分类号： H01L23/00 ,  H01L33/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/60 ,  H01L33/32

摘要： A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

公开(公告)号：US20210280440A1

公开(公告)日：2021-09-09

申请号：US16326512

申请日：2017-08-23

申请人： TORAY ENGINEERING CO., LTD.

发明人： Yoshiyuki ARAI

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L33/00

摘要： A mounting method is a method for mounting a diced semiconductor chip having a first face that is held on a carrier substrate and a second face that is an opposite face of the first face on a circuit board placed on a mounting table. The mounting method includes affixing the second face of the semiconductor chip to an adhesive sheet, removing the carrier substrate from the semiconductor chip, reducing an adhesive strength of the adhesive sheet, and mounting the semiconductor chip on the circuit board by holding a first face side of the semiconductor chip with a head to separate the semiconductor chip from the adhesive sheet, and joining a second face side of the semiconductor chip to the circuit board.

公开(公告)号：US10351947B2

公开(公告)日：2019-07-16

申请号：US15306416

申请日：2015-02-23

申请人： TORAY ENGINEERING CO., LTD.

发明人： Masamichi Yamashita ,  Toshiyuki Jinda ,  Takayoshi Fujimoto ,  Katsuyoshi Miyashita

IPC分类号： C23C14/04 ,  C23C14/24 ,  C23C14/34 ,  C23C14/56 ,  C23C14/44 ,  C23C16/455 ,  C23C16/505 ,  C23C16/54 ,  H01J37/34 ,  C23C16/44

摘要： A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber accommodating the main roll; a plurality of film formation chambers arranged in a peripheral direction of the main roll, the film formation chambers having partitions disposed radially outward of the main roll; and a main roll cover covering the outer peripheral face of the main roll over which the strip-shaped substrate travels, the main roll cover being provided to the partitions, the main roll cover having a film formation chamber communication component that communicates with the film formation chambers. A pressure in an interior of the main roll cover defined between the main roll cover and the outer peripheral face of the main roll is set to be higher than a pressure in the film formation chambers.

公开(公告)号：US10026951B2

公开(公告)日：2018-07-17

申请号：US14787001

申请日：2014-03-05

申请人： YOKOGAWA ELECTRIC CORPORATION ,  TORAY ENGINEERING CO., LTD.

发明人： Hiroyuki Miyamoto ,  Takashi Sasaki ,  Atsushi Watanabe ,  Kazushige Nakashima ,  Yohei Nishimatsu ,  Kenji Kitajima

IPC分类号： B05C5/02 ,  B05C11/10 ,  H01M4/04

摘要： The surface profile of a coating material in a substrate width direction is optimized in coating a substrate with the coating material such as an electrode active material. A gap adjuster configured to adjust a gap between a nozzle for ejecting a coating material and a substrate to be coated with the coating material, a rotation speed adjuster configured to adjust a rotation speed of a pump for pressure-feeding the coating material to the nozzle, a model calculator configured to calculate a surface profile of the coating material based on an end region model and a central region model wherein the end region model models profiles of rising regions in the surface profile of the coating material in a width direction of the substrate and the central region model models a profile of a central region between the rising regions in the surface profile, a comparator configured to compare a predetermined set profile with the surface profile of the coating material calculated by the model calculator, and a control calculator configured to calculate a control amount of at least one of the gap adjuster and the rotation speed adjuster based on a comparison result of the comparator are included.

公开(公告)号：US20170354340A1

公开(公告)日：2017-12-14

申请号：US15524892

申请日：2014-11-14

申请人： TORAY ENGINEERING CO., LTD. ,  THE RITSUMEIKAN TRUST

发明人： Junichi MATSUMURA ,  Chisa INAKA ,  Masaaki MAKIKAWA ,  Yusuke SAKAUE

IPC分类号： A61B5/0428 ,  A61B5/0402 ,  A61B5/0456

CPC分类号： A61B5/0428 ,  A61B5/04028 ,  A61B5/04085 ,  A61B5/04288 ,  A61B5/0456

摘要： A method for detecting a position of a signal source in a living body includes: arranging three electrodes on a surface of the living body and alternately connecting a first external resistance and a second external resistance in parallel between the electrodes and a ground potential; measuring first voltages Vi (i=1, 2, 3) generated at the respective electrodes when the first external resistance is connected in parallel between the electrodes and the ground potential, and second voltages Vi (i=1, 2, 3) generated at the respective electrodes when the second external resistance is connected in parallel between the electrodes and the ground potential; and calculating three ratios Vi/V′i (i=1, 2, 3) from the first and second voltages Vi and V′i, and detecting the position of the signal source in the living body based on the three ratios Vi/V′i (i=1, 2, 3).

公开(公告)号：US09673166B2

公开(公告)日：2017-06-06

申请号：US15038963

申请日：2014-11-19

申请人： TORAY ENGINEERING CO., LTD.

发明人： Koji Nishimura ,  Katsumi Terada ,  Mikio Kawakami

IPC分类号： H01L21/68 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/81 ,  H01L24/75 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75753 ,  H01L2224/75843 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06593 ,  H01L2924/00014

摘要： A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.