-
公开(公告)号：US20140159032A1
公开(公告)日：2014-06-12
申请号：US12945011
申请日：2010-11-12
Applicant: Athanasios J. Syllaios , Michael F. Taylor , Sameer K. Ajmera
Inventor： Athanasios J. Syllaios , Michael F. Taylor , Sameer K. Ajmera
IPC: H01L31/0336 , H01L31/0376 , H01L31/20 , H01L31/028
CPC classification number: H01L31/0336 , G01J5/20 , H01L21/02529 , H01L21/02532 , H01L21/02573 , H01L21/02592 , H01L27/14618 , H01L27/14649 , H01L31/028 , H01L31/0376 , H01L31/20 , H01L2924/0002 , H01L2924/00
Abstract: A center region of conductive material/s may be disposed or “sandwiched” between transition regions of relatively lower conductivity materials to provide substantially low defect density interfaces for the sandwiched material. The center region and surrounding transition regions may in turn be disposed or sandwiched between dielectric insulative material to form a sandwiched and transitioned device structure. The center region of such a sandwiched structure may be implemented, for example, as a device layer such as conductive microbolometer layer for a microbolometer detector structure.
Abstract translation: 可以将导电材料的中心区域设置或“夹在”相对低导电性材料的过渡区域之间，以为夹层材料提供基本上低的缺陷密度界面。 中心区域和周围的过渡区域又可以设置或夹在介电绝缘材料之间，以形成夹层和转变的器件结构。 这种夹层结构的中心区域可以实现为例如用于微测热计检测器结构的诸如导电微测热计层的器件层。
-
2.发明申请公开(公告)号：US20110266441A1
公开(公告)日：2011-11-03
申请号：US12799629
申请日：2010-04-28
Applicant: Thomas P. Fagan, III , John F. Brady , Thomas R. Schimert , Athanasios J. Syllaios
Inventor： Thomas P. Fagan, III , John F. Brady , Thomas R. Schimert , Athanasios J. Syllaios
IPC: H01L25/065 , H01L31/18 , H01L27/14
CPC classification number: H01L31/02325 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14649 , H01L27/1465 , H01L27/14683 , H01L27/14685 , H01L2924/0002 , H01L2924/00
Abstract: Optically transitioning pixel-level filtering using a multi-level structure that includes an isolated optically transitioning filter element that is suspended over a corresponding radiation detector element in a one-to-one relationship to provide, for example, one or more features such as spectral detection and/or selective radiation immunity.
Abstract translation: 使用多级结构光学转换像素级滤波，该多级结构包括以一对一关系悬挂在相应的辐射检测器元件上的隔离光学过渡滤光元件，以提供例如一个或多个特征，例如光谱 检测和/或选择性辐射免疫。
-
公开(公告)号：US07262412B2
公开(公告)日：2007-08-28
申请号：US11141356
申请日：2005-05-31
Applicant: Thomas R. Schimert , Athanasios J. Syllaios , Roland W. Gooch , William L. McCardel
Inventor： Thomas R. Schimert , Athanasios J. Syllaios , Roland W. Gooch , William L. McCardel
IPC: G01J5/00
CPC classification number: H01L27/1465 , H01L27/14618 , H01L27/14623 , H01L27/1463 , H01L27/14634 , H01L2224/05568 , H01L2224/05644 , H01L2224/05666 , H01L2224/05669 , H01L2224/16 , H01L2924/1461 , H01L2924/00014
Abstract: Methods for making optically blind reference pixels and systems employing the same. The reference pixels may be configured to be identical to, or substantially identical to, the active detector elements of a focal plane array assembly. The reference pixels may be configured to use the same relatively longer thermal isolation legs as the active detector pixels of the focal plane, thus eliminating joule heating differences. An optically blocking structure may be placed in close proximity directly over the reference pixels.
Abstract translation: 制造光学盲目参考像素的方法和采用该方法的系统。 参考像素可以被配置为与焦平面阵列组件的有源检测器元件相同或基本相同。 参考像素可以被配置为使用与焦平面的有源检测器像素相同的相对较长的热隔离支腿，从而消除焦耳加热差异。 可以将光学阻挡结构紧邻地放置在参考像素的正上方。
-
公开(公告)号：US07528061B2
公开(公告)日：2009-05-05
申请号：US11141361
申请日：2005-05-31
Applicant: Athanasios J. Syllaios , John H. Tregilgas , Roland W. Gooch
Inventor： Athanasios J. Syllaios , John H. Tregilgas , Roland W. Gooch
IPC: H01L21/44
CPC classification number: B81C1/00269 , B23K1/0016 , B81C2203/019 , H01L21/50 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
Abstract: Systems and methods for solder bonding that employ an equilibrium solidification process in which the solder is solidified by dissolving and alloying metals that raise the melting point temperature of the solder. Two or more structure surfaces may be solder bonded, for example, by employing heating to melt the solder and holding the couple at a temperature above the initial solder melting point of the solder until interdiffusion reduces the volume fraction of liquid so as to form a solid bond between surfaces before cooling to below the initial melting point of the solder.
Abstract translation: 用于焊接的系统和方法，其采用平衡凝固方法，其中通过溶解和合金化使焊料的熔点温度升高的金属使焊料固化。 两个或更多个结构表面可以焊接，例如，通过加热熔化焊料并将该焊料保持在高于焊料的初始焊料熔点的温度，直到相互扩散减小液体的体积分数以便形成固体 在冷却至低于焊料的初始熔点之前，表面之间的粘结。
-
公开(公告)号：US20070170360A1
公开(公告)日：2007-07-26
申请号：US11607087
申请日：2006-11-30
Applicant: Roland W. Gooch , Athanasios J. Syllaios , Thomas R. Schimert , William L. McCardel
Inventor： Roland W. Gooch , Athanasios J. Syllaios , Thomas R. Schimert , William L. McCardel
IPC: G01J5/00
CPC classification number: G01J5/20 , G01J2005/0077 , H01L21/187 , H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
Abstract: Systems and methods for bonding semiconductor devices and/or multiple wafers, in the form of a first segmented wafer and a second unsegmented wafer which may have different temperature coefficients of expansion (TCE), and which may be bonded together, with or without the presence of a vacuum.
Abstract translation: 用于接合半导体器件和/或多个晶片的系统和方法，其形式为可以具有不同温度膨胀系数（TCE）的第一分段晶片和第二未分段晶片，并且可以在或不存在 的真空。
-
Patent Agency Ranking
公开(公告)号：US06897469B2
公开(公告)日：2005-05-24
申请号：US10428745
申请日：2003-05-02
Applicant: Athanasios J. Syllaios , Roland W. Gooch , Thomas R. Schimert , Edward G. Meissner
Inventor： Athanasios J. Syllaios , Roland W. Gooch , Thomas R. Schimert , Edward G. Meissner
Abstract: A method for manufacturing optically-transparent lids includes etching sub-wavelength structures on a surface of a lid wafer. The structures may be arrayed in a hexagonally closed-packed pattern.
Abstract translation: 用于制造光学透明盖的方法包括在盖晶片的表面上蚀刻亚波长结构。 结构可以排列成六边形封闭图案。
-
公开(公告)号：US06879035B2
公开(公告)日：2005-04-12
申请号：US10428627
申请日：2003-05-02
Applicant: Athanasios J. Syllaios , Roland W. Gooch , Thomas R. Schimert
Inventor： Athanasios J. Syllaios , Roland W. Gooch , Thomas R. Schimert
CPC classification number: B81C1/00269
Abstract: A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure uptakes excess sealing surface material and prevents such material from entering the lid cavity.
-
公开(公告)号：US06297511B1
公开(公告)日：2001-10-02
申请号：US09283669
申请日：1999-04-01
Applicant: Athanasios J. Syllaios , Roland W. Gooch , William L. McCardel , Thomas R. Schimert
Inventor： Athanasios J. Syllaios , Roland W. Gooch , William L. McCardel , Thomas R. Schimert
IPC: H05B320
CPC classification number: F41J2/02
Abstract: An infrared radiation emitter is provided that is capable of producing infrared radiation modulating at high frequency. The IR emitter includes a low-thermal-mass resistive membrane that is suspended by long thermal isolation arms over a substrate. The membrane is suspended over the substrate such that a resonant emitting cavity is formed between the membrane and the substrate. The low-mass, thermally isolated membrane design maximizes the temperature change induced by Joule heating of the resistive membrane and allows the emitted IR radiation to be modulated at high frequencies.
Abstract translation: 提供一种红外辐射发射器，其能够在高频下产生红外辐射调制。 IR发射器包括一个低热质量的电阻膜，其通过长的隔热臂悬挂在衬底上。 膜悬浮在衬底上，使得在膜和衬底之间形成谐振发射腔。 低质量，热隔离膜设计可最大限度地增加电阻膜的焦耳加热引起的温度变化，并允许发射的红外辐射在高频下进行调制。
-
公开(公告)号：US08765514B1
公开(公告)日：2014-07-01
申请号：US12945011
申请日：2010-11-12
Applicant: Athanasios J. Syllaios , Michael F. Taylor , Sameer K. Ajmera
Inventor： Athanasios J. Syllaios , Michael F. Taylor , Sameer K. Ajmera
IPC: H01L21/00
CPC classification number: H01L31/0336 , G01J5/20 , H01L21/02529 , H01L21/02532 , H01L21/02573 , H01L21/02592 , H01L27/14618 , H01L27/14649 , H01L31/028 , H01L31/0376 , H01L31/20 , H01L2924/0002 , H01L2924/00
Abstract: A center region of conductive material/s may be disposed or “sandwiched” between transition regions of relatively lower conductivity materials to provide substantially low defect density interfaces for the sandwiched material. The center region and surrounding transition regions may in turn be disposed or sandwiched between dielectric insulative material to form a sandwiched and transitioned device structure. The center region of such a sandwiched structure may be implemented, for example, as a device layer such as conductive microbolometer layer for a microbolometer detector structure.
Abstract translation: 可以将导电材料的中心区域设置或“夹在”相对低导电性材料的过渡区域之间，以为夹层材料提供基本上低的缺陷密度界面。 中心区域和周围的过渡区域又可以设置或夹在介电绝缘材料之间，以形成夹层和转变的器件结构。 这种夹层结构的中心区域可以实现为例如用于微测热计检测器结构的诸如导电微测热计层的器件层。
-
公开(公告)号：US08610070B2
公开(公告)日：2013-12-17
申请号：US12799626
申请日：2010-04-28
Applicant: Thomas R. Schimert , Thomas P. Fagan, III , Athanasios J. Syllaios
Inventor： Thomas R. Schimert , Thomas P. Fagan, III , Athanasios J. Syllaios
CPC classification number: G01J5/20 , G01J1/02 , G01J1/0204 , G01J1/04 , G01J1/0411 , G01J1/0429 , G01J1/0488 , G01J4/04 , G01J5/02 , G01J5/0215 , G01J5/023 , G01J5/024 , G01J5/08 , G01J5/0806 , G01J5/0825 , G01J5/0862
Abstract: Pixel-level monolithic optical element configurations for uncooled infrared detectors and focal plane arrays in which a monolithically integrated or fabricated optical element may be suspended over a microbolometer pixel membrane structure of an uncooled infrared detector element A monolithic optical element may be, for example, a polarizing or spectral filter element, an optically active filter element, or a microlens element that is structurally attached by an insulating interconnect to the existing metal interconnects such that the installation of the optical element substantially does not impact the thermal mass or thermal time constant of the microbolometer pixel structure, and such that it requires little if any additional device real estate area beyond the area originally consumed by the microbolometer pixel structure interconnects.
Abstract translation: 用于非制冷红外探测器和焦平面阵列的像素级单片光学元件配置，其中单片集成或制造的光学元件可以悬挂在非制冷红外探测器元件的微测辐射热计像素膜结构上。单片光学元件可以是例如 偏振或光谱滤光器元件，光学有源滤光器元件或微透镜元件，其通过绝缘互连结构地附接到现有金属互连，使得光学元件的安装基本上不影响光学元件的热质量或热时间常数 微照度计像素结构，并且使得其需要很少的额外的设备房地产区域超出由微测热计像素结构原始消耗的区域互连。
-
-
-
-
-
-
-
-
-
Search Results
24
records
(took 0.013 seconds)
