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1.发明申请公开(公告)号：US20110266441A1
公开(公告)日：2011-11-03
申请号：US12799629
申请日：2010-04-28
IPC分类号： H01L25/065 , H01L31/18 , H01L27/14
CPC分类号： H01L31/02325 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14649 , H01L27/1465 , H01L27/14683 , H01L27/14685 , H01L2924/0002 , H01L2924/00
摘要： Optically transitioning pixel-level filtering using a multi-level structure that includes an isolated optically transitioning filter element that is suspended over a corresponding radiation detector element in a one-to-one relationship to provide, for example, one or more features such as spectral detection and/or selective radiation immunity.
摘要翻译： 使用多级结构光学转换像素级滤波，该多级结构包括以一对一关系悬挂在相应的辐射检测器元件上的隔离光学过渡滤光元件，以提供例如一个或多个特征，例如光谱 检测和/或选择性辐射免疫。
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2.发明申请MICROBOLOMETER INFRARED DETECTOR ELEMENTS AND METHODS FOR FORMING SAME 有权MICROBOLOMETER INFRARED DETECTOR元素及其形成方法公开(公告)号：US20100133536A1
公开(公告)日：2010-06-03
申请号：US11498939
申请日：2006-08-03
IPC分类号： H01L31/0376 , H01L31/18 , H01L21/50
摘要： Microbolometer infrared detector elements that may be formed and implemented by varying type/s of precursors used to form amorphous silicon-based microbolometer membrane material/s and/or by varying composition of the final amorphous silicon-based microbolometer membrane material/s (e.g., by adjusting alloy composition) to vary the material properties such as activation energy and carrier mobility. The amorphous silicon-based microbolometer membrane material/s materials may include varying amounts of one or more additional and optional materials, including hydrogen, fluorine, germanium, n-type dopants and p-type dopants.
摘要翻译： 可以通过改变类型的用于形成非晶硅基微热辐射计膜材料的前体和/或通过改变最终的非晶硅基微热辐照仪膜材料的组成来形成和实现微辐射热计红外探测器元件（例如， 通过调节合金组成）以改变材料性质如活化能和载流子迁移率。 无定形硅基微测辐射热计薄膜材料可以包括不同量的一种或多种附加和任选的材料，包括氢，氟，锗，n型掺杂剂和p型掺杂剂。
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公开(公告)号：US07262412B2
公开(公告)日：2007-08-28
申请号：US11141356
申请日：2005-05-31
IPC分类号： G01J5/00
CPC分类号： H01L27/1465 , H01L27/14618 , H01L27/14623 , H01L27/1463 , H01L27/14634 , H01L2224/05568 , H01L2224/05644 , H01L2224/05666 , H01L2224/05669 , H01L2224/16 , H01L2924/1461 , H01L2924/00014
摘要： Methods for making optically blind reference pixels and systems employing the same. The reference pixels may be configured to be identical to, or substantially identical to, the active detector elements of a focal plane array assembly. The reference pixels may be configured to use the same relatively longer thermal isolation legs as the active detector pixels of the focal plane, thus eliminating joule heating differences. An optically blocking structure may be placed in close proximity directly over the reference pixels.
摘要翻译： 制造光学盲目参考像素的方法和采用该方法的系统。 参考像素可以被配置为与焦平面阵列组件的有源检测器元件相同或基本相同。 参考像素可以被配置为使用与焦平面的有源检测器像素相同的相对较长的热隔离支腿，从而消除焦耳加热差异。 可以将光学阻挡结构紧邻地放置在参考像素的正上方。
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公开(公告)号：US06586831B2
公开(公告)日：2003-07-01
申请号：US09928031
申请日：2001-08-10
IPC分类号： H01L2312
CPC分类号： B81B7/0077 , H01L2924/0002 , Y10S438/909 , H01L2924/00
摘要： A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.
摘要翻译： 用于集成电路器件的真空封装包括具有分布在密封环周围的均匀厚度的多个控制间隔物的密封环。 密封圈位于衬底上的指定区域中，并且包围一个或多个集成电路器件。 真空包装还包括密封环上的密封层。 真空包装盖通过密封环上的密封层密封到密封环。 真空包装盖为一个或多个集成电路装置提供真空室。
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公开(公告)号：US5477158A
公开(公告)日：1995-12-19
申请号：US130908
申请日：1993-10-04
IPC分类号： G01R31/265 , H01L21/66 , G01R31/26 , G01R27/06
CPC分类号： G01R31/2656 , H01L22/14
摘要： An apparatus (10) is provided for measuring the excess carrier lifetime in a semiconductor material, such as an HgCdTe wafer (MCT). The apparatus includes a computer controller (56) which automates the functions of the apparatus, including the operation of the shutter (28) to control the time the testing samples are exposed to the excitation energy from a laser (14), the laser energy intensity on the sample, the position of the wafer controlled by the computer controller operating a motorized sample positioner (39) and maintaining the temperature of the sample. Multiple samples are taken by the apparatus which are averaged and analyzed to result in a characterization of the carrier lifetime.
摘要翻译： 提供了一种用于测量诸如HgCdTe晶片（MCT）的半导体材料中的过量载流子寿命的装置（10）。 该装置包括一个计算机控制器（56），其使装置的功能自动化，包括快门（28）的操作，以控制测试样本暴露于来自激光器（14）的激发能量的时间，激光能量强度 在样品上，由操作电动样品定位器（39）的计算机控制器控制的晶片的位置并保持样品的温度。 多个样品由装置取出，其被平均和分析以导致载流子寿命的表征。
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公开(公告)号：US08610070B2
公开(公告)日：2013-12-17
申请号：US12799626
申请日：2010-04-28
CPC分类号： G01J5/20 , G01J1/02 , G01J1/0204 , G01J1/04 , G01J1/0411 , G01J1/0429 , G01J1/0488 , G01J4/04 , G01J5/02 , G01J5/0215 , G01J5/023 , G01J5/024 , G01J5/08 , G01J5/0806 , G01J5/0825 , G01J5/0862
摘要： Pixel-level monolithic optical element configurations for uncooled infrared detectors and focal plane arrays in which a monolithically integrated or fabricated optical element may be suspended over a microbolometer pixel membrane structure of an uncooled infrared detector element A monolithic optical element may be, for example, a polarizing or spectral filter element, an optically active filter element, or a microlens element that is structurally attached by an insulating interconnect to the existing metal interconnects such that the installation of the optical element substantially does not impact the thermal mass or thermal time constant of the microbolometer pixel structure, and such that it requires little if any additional device real estate area beyond the area originally consumed by the microbolometer pixel structure interconnects.
摘要翻译： 用于非制冷红外探测器和焦平面阵列的像素级单片光学元件配置，其中单片集成或制造的光学元件可以悬挂在非制冷红外探测器元件的微测辐射热计像素膜结构上。单片光学元件可以是例如 偏振或光谱滤光器元件，光学有源滤光器元件或微透镜元件，其通过绝缘互连结构地附接到现有金属互连，使得光学元件的安装基本上不影响光学元件的热质量或热时间常数 微照度计像素结构，并且使得其需要很少的额外的设备房地产区域超出由微测热计像素结构原始消耗的区域互连。
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公开(公告)号：US20110266443A1
公开(公告)日：2011-11-03
申请号：US12799626
申请日：2010-04-28
IPC分类号： H01L31/09 , H01L31/18 , H01L31/0232 , H01L27/144 , G01J5/28 , G01J5/08
CPC分类号： G01J5/20 , G01J1/02 , G01J1/0204 , G01J1/04 , G01J1/0411 , G01J1/0429 , G01J1/0488 , G01J4/04 , G01J5/02 , G01J5/0215 , G01J5/023 , G01J5/024 , G01J5/08 , G01J5/0806 , G01J5/0825 , G01J5/0862
摘要： Pixel-level monolithic optical element configurations for uncooled infrared detectors and focal plane arrays in which a monolithically integrated or fabricated optical element may be suspended over a microbolometer pixel membrane structure of an uncooled infrared detector element A monolithic optical element may be, for example, a polarizing or spectral filter element, an optically active filter element, or a microlens element that is structurally attached by an insulating interconnect to the existing metal interconnects such that the installation of the optical element substantially does not impact the thermal mass or thermal time constant of the microbolometer pixel structure, and such that it requires little if any additional device real estate area beyond the area originally consumed by the microbolometer pixel structure interconnects.
摘要翻译： 用于非制冷红外探测器和焦平面阵列的像素级单片光学元件配置，其中单片集成或制造的光学元件可以悬挂在非制冷红外探测器元件的微测辐射热计像素膜结构上。单片光学元件可以是例如 偏振或光谱滤光器元件，光学有源滤光器元件或微透镜元件，其通过绝缘互连结构地附接到现有金属互连，使得光学元件的安装基本上不影响光学元件的热质量或热时间常数 微照度计像素结构，并且使得其需要很少的额外的设备房地产区域超出由微测热计像素结构原始消耗的区域互连。
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公开(公告)号：US07655909B2
公开(公告)日：2010-02-02
申请号：US11606621
申请日：2006-11-30
IPC分类号： G01J5/00
CPC分类号： G01J5/20 , G01J5/02 , G01J5/023 , G01J5/024 , G01J5/08 , G01J5/0834 , G01J5/22 , G01J5/522 , G01J2005/0077
摘要： Infrared detector elements and methods for forming infrared detector elements in which the top metal layer of CMOS circuitry of the detector element is employed as a lead metal reflector for the infrared detector.
摘要翻译： 用于形成红外检测器元件的红外检测器元件和方法，其中检测器元件的CMOS电路的顶部金属层被用作用于红外检测器的引线金属反射器。
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公开(公告)号：US20070170359A1
公开(公告)日：2007-07-26
申请号：US11606880
申请日：2006-11-30
申请人： Athanasios J. Syllaios , Thomas R. Schimert , William L. McCardel , Roland W. Gooch , John F. Brady
发明人： Athanasios J. Syllaios , Thomas R. Schimert , William L. McCardel , Roland W. Gooch , John F. Brady
IPC分类号： G01J5/00
CPC分类号： G01J3/2803 , G01J3/02 , G01J3/0232 , G01J3/2823 , G01J3/36 , G01J5/024 , G01J5/20 , H01L27/14621 , H01L27/14647 , H01L27/1467 , H01L27/14685 , H01L27/14687 , H01L2924/381 , H04N5/33 , H04N5/332
摘要： Systems and methods for providing multi-spectral image capability using an integrated multi-band focal plane array that, in one example, may be employed to simultaneously image in the visible spectrum and infrared spectrum using an integrated dual-band focal plane array, e.g., by including visible imaging circuitry within read out integrated circuitry (ROIC) used to readout infrared detector elements within the same pixel element/s.
摘要翻译： 使用集成的多频带焦平面阵列来提供多光谱图像能力的系统和方法，在一个示例中，可以使用集成的双频带焦平面阵列在可见光谱和红外光谱中同时成像，例如， 通过在用于读出相同像素元件的红外检测器元件的读出集成电路（ROIC）中包括可见成像电路。
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公开(公告)号：US06690014B1
公开(公告)日：2004-02-10
申请号：US09557748
申请日：2000-04-25
IPC分类号： H01L310376
CPC分类号： H01L27/14649 , G01J5/20
摘要： A microbolometer is provided that includes an absorber element having material properties to change temperature in response to absorbing infrared radiation. An amorphous silicon detector is thermally coupled to the absorber element and is suspended above a silicon substrate at a height of one-quarter wavelength of the infrared radiation to be detected. The amorphous silicon detector changes electrical resistance in response to the absorber element changing temperature. The microbolometer also includes electrode arms coupled to the silicon substrate to provide structural support for the amorphous silicon detector above the surface of the silicon substrate. The electrode arms further provide electrical connectivity for the microbolometer.
摘要翻译： 提供了一种微测热计，其包括具有响应于吸收红外辐射而改变温度的材料性质的吸收体元件。 非晶硅检测器热耦合到吸收体元件，并且在待检测的红外辐射的四分之一波长的高度上悬挂在硅衬底上。 非晶硅检测器响应于吸收体元件的变化温度而改变电阻。 微热辐射计还包括耦合到硅衬底的电极臂，以为硅衬底的表面上的非晶硅检测器提供结构支撑。 电极臂还提供用于微热辐射计的电连接。
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