Fault tolerance of multi-processor system with distributed cache
    1.
    发明授权
    Fault tolerance of multi-processor system with distributed cache 有权
    具有分布式缓存的多处理器系统的容错能力

    公开(公告)号:US08954790B2

    公开(公告)日:2015-02-10

    申请号:US12984500

    申请日:2011-01-04

    摘要: A semiconductor chip is described having different instances of cache agent logic circuitry for respective cache slices of a distributed cache. The semiconductor chip further includes hash engine logic circuitry comprising: hash logic circuitry to determine, based on an address, that a particular one of the cache slices is to receive a request having the address, and, a first input to receive notice of a failure event for the particular cache slice. The semiconductor chip also includes first circuitry to assign the address to another cache slice of the cache slices in response to the notice.

    摘要翻译: 描述了具有用于分布式高速缓存的各个缓存片段的高速缓存代理逻辑电路的不同实例的半导体芯片。 半导体芯片还包括散列引擎逻辑电路,包括:散列逻辑电路,用于基于地址确定特定的一个高速缓存片段将接收具有该地址的请求,以及第一输入以接收故障通知 特定缓存片段的事件。 半导体芯片还包括响应于通知将地址分配给高速缓存片的另一高速缓存片的第一电路。

    FAULT TOLERANCE OF MULTI-PROCESSOR SYSTEM WITH DISTRIBUTED CACHE
    4.
    发明申请
    FAULT TOLERANCE OF MULTI-PROCESSOR SYSTEM WITH DISTRIBUTED CACHE 有权
    具有分布式高速缓存的多处理器系统的容错性

    公开(公告)号:US20120005524A1

    公开(公告)日:2012-01-05

    申请号:US12984500

    申请日:2011-01-04

    IPC分类号: G06F11/20

    摘要: A semiconductor chip is described having different instances of cache agent logic circuitry for respective cache slices of a distributed cache. The semiconductor chip further includes hash engine logic circuitry comprising: hash logic circuitry to determine, based on an address, that a particular one of the cache slices is to receive a request having the address, and, a first input to receive notice of a failure event for the particular cache slice. The semiconductor chip also includes first circuitry to assign the address to another cache slice of the cache slices in response to the notice.

    摘要翻译: 描述了具有用于分布式高速缓存的各个缓存片段的高速缓存代理逻辑电路的不同实例的半导体芯片。 半导体芯片还包括散列引擎逻辑电路,包括:散列逻辑电路,用于基于地址确定特定的一个高速缓存片段将接收具有该地址的请求,以及第一输入以接收故障通知 特定缓存片段的事件。 半导体芯片还包括响应于通知将地址分配给高速缓存片的另一高速缓存片的第一电路。

    MEMORY LINK POWER MANAGEMENT
    8.
    发明申请
    MEMORY LINK POWER MANAGEMENT 有权
    存储器链接电源管理

    公开(公告)号:US20130042126A1

    公开(公告)日:2013-02-14

    申请号:US13206923

    申请日:2011-08-10

    IPC分类号: G06F1/32

    摘要: Embodiments of the invention describe systems and processes directed towards improving link power-management during memory subsystem idle states. Embodiments of the invention control memory link operations when various components of a memory subsystem enter low power states under certain operating conditions. Embodiments of the invention similarly describe exiting low power states for memory links and various components of a memory subsystem upon detecting certain operating conditions.Embodiments of the invention may detect operating conditions in a computing system. Some of these operating conditions may include, but are not limited to, a memory controller being empty of transactions directed towards a memory unit, a processor core executing a processor low-power mode, and a processor socket executing an idle mode. In response to detecting said operating conditions, embodiments of the invention may execute a low-power idle state for the memory unit and various components of the memory subsystem.

    摘要翻译: 本发明的实施例描述了在存储器子系统空闲状态期间改进链路功率管理的系统和过程。 当存储器子系统的各个组件在某些操作条件下进入低功率状态时,本发明的实施例控制存储器连接操作。 本发明的实施例类似地描述了在检测到某些操作条件时存储器链路和存储器子系统的各种组件的退出低功率状态。 本发明的实施例可以检测计算系统中的操作条件。 这些操作条件中的一些可以包括但不限于存储器控制器,其不涉及指向存储器单元的事务,执行处理器低功率模式的处理器核心以及执行空闲模式的处理器插座。 响应于检测到所述操作条件,本发明的实施例可以为存储器单元和存储器子系统的各种组件执行低功率空闲状态。