Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film
    5.
    发明授权
    Method for electrostatic thermal bonding of a pair of glass substrates by utilizing a silicon thin film 失效
    利用硅薄膜对一对玻璃基板进行静电热粘结的方法

    公开(公告)号:US06197139B1

    公开(公告)日:2001-03-06

    申请号:US09226949

    申请日:1999-01-08

    IPC分类号: B32B1700

    CPC分类号: C03C27/08

    摘要: An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a conventional epoxy or frit. The electrostatic thermal bonding method uses a silicon-glass bonding mechanism. First, a silicon thin film is deposited on a metal thin film formed on a side of one glass substrate, and the two glass substrates are brought face to face with each other by bringing the silicon thin film into contact with the surface of the other glass substrate. A predetermined direct current voltage is applied between the metal thin film and the other glass substrate under a predetermined temperature, thereby the bonding between glass substrates is performed. In the glass-glass bonding method utilizing the silicon thin film, the direct current voltage in the range of 0 to 1000V is applied under a bonding temperature between 100 to 500° C. and the elements are combined between a surface of the glass and a surface of the silicon thin film. Therefore, such a bonding results in an improved bonding strength and an improved vacuum packaging.

    摘要翻译: 用于粘合一对玻璃基板的静电热粘合方法能够解决由于利用常规环氧树脂或玻璃料的玻璃基板的接合期间产生的气体而导致的装置污染和不完全的真空包装等问题。 静电热粘合方法使用硅玻璃接合机构。 首先,将硅薄膜沉积在形成在一个玻璃基板一侧的金属薄膜上,并且通过使硅薄膜与另一个玻璃的表面接触来使两个玻璃基板彼此面对 基质。 在预定温度下在金属薄膜和另一玻璃基板之间施加预定的直流电压,从而进行玻璃基板之间的接合。 在利用硅薄膜的玻璃玻璃接合方法中,在100〜500℃的接合温度下施加0〜1000V范围内的直流电压,在玻璃的表面和 表面的硅薄膜。 因此,这种接合导致改善的接合强度和改进的真空包装。

    Micro-tip for emitting electric field and method for fabricating the same
    6.
    发明授权
    Micro-tip for emitting electric field and method for fabricating the same 失效
    用于发射电场的微尖端及其制造方法

    公开(公告)号:US5827752A

    公开(公告)日:1998-10-27

    申请号:US686131

    申请日:1996-07-23

    CPC分类号: H01J9/025

    摘要: A micro-tip for emitting an electric field and a method for fabricating the same are disclosed. The method includes the steps of: forming a silicon mould; forming a functional layer on the silicon mould, and then forming a tip on the functional layer; forming a conductive thin film on one side of the tip; bonding a substrate to the conductive thin film; and removing the silicon mould, to thereby obtain the structural advantages of the semiconductor tip as well as the advantages of the material for functional layer, and realize the micro-tip for an emitting electric field having high reliability.

    摘要翻译: 公开了一种用于发射电场的微尖端及其制造方法。 该方法包括以下步骤:形成硅模具; 在硅模具上形成功能层,然后在功能层上形成尖端; 在尖端的一侧形成导电薄膜; 将基板结合到导电薄膜上; 去除硅模具,从而获得半导体尖端的结构优点以及功能层材料的优点,并实现具有高可靠性的发射电场的微尖端。

    MEASURING DEVICE FOR PERMEATION RATE OF WATER AND OXYGEN OF PROTECTIVE LAYER IN ORGANIC ELECTRONIC DEVICE AND MEASURING METHOD USING THE DEVICE
    10.
    发明申请
    MEASURING DEVICE FOR PERMEATION RATE OF WATER AND OXYGEN OF PROTECTIVE LAYER IN ORGANIC ELECTRONIC DEVICE AND MEASURING METHOD USING THE DEVICE 审中-公开
    用于有机电子设备中的保护层的水和氧的渗透速率的测量装置和使用该装置的测量方法

    公开(公告)号:US20090205978A1

    公开(公告)日:2009-08-20

    申请号:US12033788

    申请日:2008-02-19

    IPC分类号: G01F1/64 G01N27/26

    CPC分类号: G01N27/041

    摘要: A device and method for measuring water and oxygen permeation rates of a protective layer in an organic electronic device are provided. The device includes: a glass substrate; a pair of electrode layers facing each other and deposited on the glass substrate; a calcium layer deposited on the glass substrate; a water and oxygen permeable substrate deposited on the calcium layer; a target protective layer of an organic electronic device, which is deposited on the water and oxygen permeable substrate; and a sealing material applied along an edge of the target protective layer, wherein one ends of the pair of electrode layers are buried in the calcium layer and the other ends are electrically connected to an external resistance measuring device.Accordingly, high reliability can be achieved, applicability to various processes for the protective layer in the organic electronic device can be enhanced without affecting reflectance or transmittance of the protective layer, and a defect averaging operation does not need to be performed on a calcium layer within the device unlike the conventional art, by using a principle that electrical characteristics of the device are changed when the water or oxygen permeates the protective layer.

    摘要翻译: 提供了一种用于测量有机电子器件中的保护层的水和氧渗透速率的装置和方法。 该装置包括:玻璃基板; 一对彼此面对并沉积在玻璃基板上的电极层; 沉积在玻璃基板上的钙层; 沉积在钙层上的水和氧气可渗透基质; 有机电子器件的目标保护层,其沉积在水和氧气渗透的基底上; 以及沿着目标保护层的边缘施加的密封材料,其中一对电极层的一端被埋在钙层中,另一端电连接到外部电阻测量装置。 因此,可以实现高可靠性,可以在不影响保护层的反射率或透射率的情况下提高对于有机电子器件中的保护层的各种工艺的适用性,并且不需要对内部的钙层进行缺陷平均化操作 该装置不同于传统技术,通过使用当水或氧渗透保护层时装置的电特性改变的原理。