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    Light emitting device package
    3.
    发明授权
    Light emitting device package 有权
    发光装置封装

    公开(公告)号：US08847259B2

    公开(公告)日：2014-09-30

    申请号：US13533726

    申请日：2012-06-26

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/00 ,  H01L33/64 ,  H01L33/62

    CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body comprising a cavity at an upper portion; a first and second metal layers on the cavity of the package body; an open area recessed in the cavity; a first metal plate disposed in the open area and spaced apart from the first and second metal layers; a semiconductor device disposed on the first metal plate and electrically connected to at least one of the first and the second metal layers; and a resin material in the cavity.

    摘要翻译： 提供一种发光器件封装及其制造方法。 发光器件封装包括封装主体，其包括在上部的空腔; 在封装体的腔体上的第一和第二金属层; 凹陷在空腔中的开放区域; 设置在所述开放区域中并与所述第一和第二金属层间隔开的第一金属板; 半导体器件，设置在所述第一金属板上并电连接到所述第一和第二金属层中的至少一个; 和空腔中的树脂材料。

    Light emitting device, light emitting device package, and lighting system
    4.
    发明授权
    Light emitting device, light emitting device package, and lighting system 有权
    发光装置，发光装置封装和照明系统

    公开(公告)号：US08735921B2

    公开(公告)日：2014-05-27

    申请号：US12959102

    申请日：2010-12-02

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L21/00

    CPC分类号： H01L33/405 ,  G02B5/0875 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device may include a reflective metal support including at least two pairs of first and second reflective metal layers, a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor and the second conductive type semiconductor layer on the reflective metal support, and an electrode on the light emitting structure layer. The reflective metal support includes at least one of Al, Ag, an APC(Ag—Pd—Cu) alloy, and an Au—Ni alloy.

    摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件可以包括反射金属支撑体，其包括至少两对第一和第二反射金属层，发光结构层，包括第一导电类型半导体层，第二导电类型半导体层和位于第一和第二反射金属层之间的有源层 导电型半导体和反射金属载体上的第二导电类型半导体层，以及发光结构层上的电极。 反射金属载体包括Al，Ag，APC（Ag-Pd-Cu）合金和Au-Ni合金中的至少一种。

    Light emitting device, method of manufacturing the same, light emitting device package and lighting system
    5.
    发明授权
    Light emitting device, method of manufacturing the same, light emitting device package and lighting system 有权
    发光装置及其制造方法，发光装置封装及照明系统

    公开(公告)号：US08466480B2

    公开(公告)日：2013-06-18

    申请号：US13008974

    申请日：2011-01-19

    申请人： Ki Hyun Cho ,  Geun Ho Kim

    发明人： Ki Hyun Cho ,  Geun Ho Kim

    IPC分类号： H01L21/00

    CPC分类号： H01L33/0079 ,  H01L33/12 ,  H01L33/32 ,  H01L33/405 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device according to the embodiment includes a conductive support substrate including plural pairs of first and second conductive layers; alight emitting structure layer including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second conductive semiconductor layers on the conductive support substrate; and an electrode on the light emitting structure layer. The first and second conductive layers are formed by using the same material.

    摘要翻译： 根据实施例的发光器件包括：导电支撑基板，包括多对第一和第二导电层; 在导电支撑基板上的第一和第二导电半导体层之间包括第一导电半导体层，第二导电半导体层和有源层的发光结构层; 以及发光结构层上的电极。 第一和第二导电层通过使用相同的材​​料形成。

    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
    9.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
    发光装置包装和照明系统

    公开(公告)号：US20110198643A1

    公开(公告)日：2011-08-18

    申请号：US12984369

    申请日：2011-01-04

    申请人： Geun Ho Kim

    发明人： Geun Ho Kim

    IPC分类号： H01L33/50

    CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： Disclosed is a light emitting device package. The light emitting device package includes a body; first and second electrode layers on the body; a light emitting device electrically connected to the first and second electrode layers on the body; a luminescent layer on the light emitting device; and an encapsulant layer including particles on the luminescent layer, wherein an effective refractive index of the encapsulant layer has a deviation of 10% or less with respect to an effective refractive index of the luminescent layer.

    摘要翻译： 公开了一种发光器件封装。 发光器件封装包括主体; 身体上的第一和第二电极层; 电连接到主体上的第一和第二电极层的发光器件; 发光装置上的发光层; 以及包含所述发光层上的粒子的密封剂层，其中，所述密封层的有效折射率相对于所述发光层的有效折射率偏离10％以下。